Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 2/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.49 |
| ▸ | GFER | P55789 | 1/20 | 0.49 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.49 |
| ▸ | POLB | P06746 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 1/20 | 0.47 |
| ▸ | USP2 | O75604 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | THRB | P10828 | 1/20 | 0.47 |
| ▸ | PKM | P14618 | 1/20 | 0.47 |
| ▸ | APEX1 | P27695 | 1/20 | 0.47 |
| ▸ | RECQL | P46063 | 1/20 | 0.47 |
| ▸ | BLM | P54132 | 1/20 | 0.47 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | GLA | P06280 | 1/20 | 0.46 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.45 |
| ▸ | CDC25B | P30305 | 1/20 | 0.45 |
| ▸ | CASP6 | P55212 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1554060 | 0.90 | KMT2A (0.59) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL712251 | 0.88 | KDM4E (0.61) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL710634 | 0.85 | KMT2A (0.63) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL1027446 | 0.85 | KMT2A (0.61) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL11625436 | 0.85 | POLB (0.61) | KMT2AKDM4EGFERPOLBMEN1 | |
| SCHEMBL5078313 | 0.85 | POLB (0.57) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL10583194 | 0.82 | BRAF (0.56) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL2426327 | 0.82 | KEAP1 (0.66) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL7554668 | 0.81 | KDM4E (0.53) | KMT2AKDM4EGFERRXFP1POLB | |
| SCHEMBL1553285 | 0.81 | KDM4E (0.55) | KMT2AKDM4EGFERRXFP1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021039111-A1 | RESIN COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL USING SAME, IMPREGNATED BASE MATERIAL, CIRCUIT BASE BOARD, BUILD-UP FILM, PREPREG, CARBON FIBER COMPOSITE MATERIAL, SOLDER RESIST, DRY FILM, AND PRINTED CIRCUIT BOARD | DIC株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2020196139-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT | 東レ株式会社 | 2020-10-01 | — | — | WO | disclosed |
| CN-106463706-A | Method for manufacturing electrode | 宇部兴产株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106165164-A | Method for manufacturing electrode | 宇部兴产株式会社 | 2016-11-23 | — | — | CN | disclosed |
| CN-105705999-A | Photosensitive thermosetting resin composition and flexible printed wiring board | 太阳油墨制造株式会社 | 2016-06-22 | — | — | CN | disclosed |
| CN-105683836-A | PHOTOSENSITIVE HEAT-CURABLE RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD | 太阳油墨制造株式会社 | 2016-06-15 | — | — | CN | disclosed |
| CN-105378564-A | Photosensitive thermosetting resin composition and flexible printed circuit board | TAIYO INK MFG CO LTD | 2016-03-02 | — | — | CN | disclosed |
| CN-105278241-A | PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, DRY FILM AND PRINTED WIRING BOARD | TAIYO INK MFG CO LTD | 2016-01-27 | — | — | CN | disclosed |
| CN-103562796-A | Resin composition and semiconductor element substrate | ZEON CORP | 2014-02-05 | — | — | CN | disclosed |
| CN-103443707-A | Resin composition and semiconductor element substrate | ZEON CORP | 2013-12-11 | — | — | CN | disclosed |
| CN-103163736-A | Composition including polyamide acid for forming lower layer reflection preventing film | NISSAN CHEMICAL IND LTD | 2013-06-19 | — | — | CN | disclosed |
| CN-101681099-B | Positive photosensitive resin composition and polyhydroxyamide resin | NISSAN CHEMICAL IND LTD | 2013-02-20 | — | — | CN | disclosed |
| CN-101065708-B | Method for forming photoresist pattern using double layer antireflection film | NISSAN CHEMICAL IND LTD | 2013-01-02 | — | — | CN | disclosed |
| CN-102575008-A | Process for producing polyimide siloxane solution composition, and polyimide siloxane solution composition | UBE INDUSTRIES | 2012-07-11 | — | — | CN | disclosed |