SCHEMBL1027446

SCHEMBL1027446

Nc1ccc(Oc2ccc(N)c(C(=O)O)c2)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.61
MEN1 O00255 3/20 0.61
MAPT P10636 2/20 0.61
TDP1 Q9NUW8 2/20 0.61
POLB P06746 2/20 0.61
USP2 O75604 1/20 0.61
THRB P10828 1/20 0.61
PKM P14618 1/20 0.61
APEX1 P27695 1/20 0.61
RECQL P46063 1/20 0.61
BLM P54132 1/20 0.61
MCL1 Q07820 1/20 0.61
HDAC3 O15379 3/20 0.53
BRAF P15056 3/20 0.53
HDAC4 P56524 3/20 0.53
HDAC1 Q13547 3/20 0.53
HDAC7 Q8WUI4 3/20 0.53
HDAC2 Q92769 3/20 0.53
HDAC10 Q969S8 3/20 0.53
HDAC11 Q96DB2 3/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1554060 0.94 KMT2A (0.59) KMT2AMEN1MAPTTDP1POLB
SCHEMBL10947890 0.93 KMT2A (0.72) KMT2AMEN1MAPTTDP1POLB
SCHEMBL712251 0.93 KDM4E (0.61) KMT2AMEN1MAPTTDP1POLB
SCHEMBL5078313 0.89 POLB (0.57) KMT2AMEN1MAPTTDP1POLB
SCHEMBL710634 0.89 KMT2A (0.63) KMT2AMEN1MAPTTDP1POLB
SCHEMBL9645846 0.87 POLB (0.63) KMT2AMEN1MAPTTDP1POLB
SCHEMBL10583194 0.86 BRAF (0.56) KMT2AMEN1MAPTTDP1POLB
SCHEMBL2426327 0.86 KEAP1 (0.66) KMT2AMEN1MAPTTDP1POLB
SCHEMBL2949574 0.86 PARP10 (0.59) KMT2AMEN1MAPTTDP1POLB
SCHEMBL7554668 0.86 KDM4E (0.53) KMT2AMEN1MAPTTDP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111522201-A Positive photosensitive resin composition, cured film prepared from positive photosensitive resin composition and electronic element 江苏三月科技股份有限公司 2020-08-11 CN claimed
WO-2024150722-A1 LAMINATE, SEMICONDUCTOR ELEMENT, AND MEMS ELEMENT 東レ株式会社 2024-07-18 WO disclosed
WO-2024150723-A1 METHOD FOR PRODUCING MULTILAYER BODY, AND RESIN COMPOSITION 東レ株式会社 2024-07-18 WO disclosed
CN-112180685-B Positive photosensitive resin composition, cured film and pattern processing method of cured film 武汉柔显科技股份有限公司 2024-06-25 CN disclosed
CN-118108621-A Diamine compound, heat-resistant resin, resin composition, cured film, and electronic component 东友精细化工有限公司 2024-05-31 CN disclosed
WO-2024057730-A1 ORGANIC EL DISPLAY DEVICE 東レ株式会社 2024-03-21 WO disclosed
US-20240067822-A1 RESIN COMPOSITION, NONWOVEN FABRIC AND TEXTILE PRODUCT OBTAINED USING SAME, SEPARATOR FOR POWER STORAGE ELEMENT, SECONDARY BATTERY, AND ELECTRIC DOUBLE-LAYER CAPACITOR TORAY INDUSTRIES, INC. (JP) 2024-02-29 US disclosed
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
WO-2023233895-A1 POLYIMIDE RESIN PRECURSOR 東京応化工業株式会社 2023-12-07 WO disclosed
WO-2023233896-A1 PHOTOSENSITIVE RESIN COMPOSITION 東京応化工業株式会社 2023-12-07 WO disclosed
US-20110071197-A1 BIS-ARYL COMPOUNDS FOR USE AS MEDICAMENTS BIOLIPOX AB (LV) 2011-03-24 US disclosed
EP-2274280-A2 BIS-ARYL COMPOUNDS FOR USE AS MEDICAMENTS Biolipox AB (SE) 2011-01-19 EP disclosed
WO-2009127822-A2 BIS-ARYL COMPOUNDS FOR USE AS MEDICAMENTS BIOLIPOX AB (SE) 2009-10-22 WO disclosed
US-20080275154-A1 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition SAKAYORI KATSUYA 2008-11-06 US disclosed
US-7410746-B2 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition DAI NIPPON PRINTING CO., LTD. (JP) 2008-08-12 US disclosed
US-20040023159-A1 Photoradical polymerization initiator, radical generator, photosensitive compound and photosensitive resin composition containing these materials and product or its accessory portions using the composition DAI NIPPON PRINTING CO., LTD. (JP) 2004-02-05 US disclosed
US-6524770-B1 For polyimide precursor curable under patternwise low radiation; heat and chemical resistance; polyamide having unsaturated ester pendant groups cures HITACHI CHEMICAL CO., LTD. (JP) 2003-02-25 US disclosed
EP-0119162-B1 PHOTOPOLYMERISABLE COMPOSITION, MATERIAL COATED THEREWITH, AND PROCESS FOR OBTAINING RELIEF IMAGES CIBA-GEIGY AG (CH) 1988-03-23 EP disclosed
US-4548891-A PHOTORESISTS; HEAT RESISTANCE; THICKNESS; SHARPNESS CIBA GEIGY CORPORATION (US) 1985-10-22 US disclosed
EP-0119162-A2 Photopolymerisable composition, material coated therewith, and process for obtaining relief images CIBA-GEIGY AG (CH) 1984-09-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110071197-A1 BIS-ARYL COMPOUNDS FOR USE AS MEDICAMENTS LTC4S, LTB4R2, LTB4R KMT2A 3849/4885MEN1 2758/4885MAPT 4587/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.