SCHEMBL710634

SCHEMBL710634

Nc1ccc(Oc2ccc(-c3ccc(Oc4ccc(N)c(C(=O)O)c4)cc3)cc2)cc1C(=O)O

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.63
KDM4E B2RXH2 2/20 0.63
GFER P55789 1/20 0.63
RXFP1 Q9HBX9 1/20 0.63
POLB P06746 2/20 0.52
MCL1 Q07820 2/20 0.52
TDP1 Q9NUW8 2/20 0.52
MEN1 O00255 1/20 0.52
USP2 O75604 1/20 0.52
MAPT P10636 1/20 0.52
THRB P10828 1/20 0.52
PKM P14618 1/20 0.52
APEX1 P27695 1/20 0.52
RECQL P46063 1/20 0.52
BLM P54132 1/20 0.52
GLA P06280 1/20 0.50
KEAP1 Q14145 1/20 0.50
CASP6 P55212 2/20 0.49
ALDH1A1 P00352 1/20 0.49
CDC25B P30305 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1554060 0.94 KMT2A (0.59) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL712251 0.93 KDM4E (0.61) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL1027446 0.89 KMT2A (0.61) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL5078313 0.89 POLB (0.57) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL2426327 0.86 KEAP1 (0.66) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL10583194 0.86 BRAF (0.56) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL7554668 0.86 KDM4E (0.53) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL1553285 0.86 KDM4E (0.55) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL22471783 0.85 KMT2A (0.49) KMT2AKDM4EGFERRXFP1POLB
SCHEMBL1553291 0.83 POLB (0.58) KMT2AKDM4EGFERRXFP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10511025-B2 Electrode manufacturing method UBE INDUSTRIES, LTD. (JP) 2019-12-17 US disclosed
US-20170194645-A1 ELECTRODE MANUFACTURING METHOD UBE INDUSTRIES, LTD. (JP) 2017-07-06 US disclosed
US-9685654-B2 Method for producing electrode UBE INDUSTRIES, LTD. (JP) 2017-06-20 US disclosed
EP-3154110-A1 ELECTRODE MANUFACTURING METHOD UBE Industries, Ltd. (JP) 2017-04-12 EP disclosed
EP-3133680-A1 METHOD FOR PRODUCING ELECTRODE Ube Industries, Ltd. (JP) 2017-02-22 EP disclosed
US-20170025671-A1 METHOD FOR PRODUCING ELECTRODE UBE CORPORATION (JP) 2017-01-26 US disclosed
US-9012537-B2 Process for producing polyimide siloxane solution composition, and polyimide siloxane solution composition UBE INDUSTRIES, LTD. (JP) 2015-04-21 US disclosed
US-20120157574-A1 PROCESS FOR PRODUCING POLYIMIDE SILOXANE SOLUTION COMPOSITION, AND POLYIMIDE SILOXANE SOLUTION COMPOSITION UBE INDUSTRIES, LTD. (JP) 2012-06-21 US disclosed
US-8124173-B2 Process for packaging electronic devices UBE INDUSTRIES, LTD. (JP) 2012-02-28 US disclosed
US-20090092748-A1 ELECTRONIC DEVICE PACKAGING AND CURABLE RESIN COMPOSITION UBE INDUSTRIES, LTD. (JP) 2009-04-09 US disclosed
US-6686106-B2 POLYIMIDESILOXANE COPOLYMERS UBE INDUSTRIES, LTD. (JP) 2004-02-03 US disclosed
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
US-20030026998-A1 Atomic oxygen-resistant film UBE INDUSTRIES, LTD. (JP) 2003-02-06 US disclosed
US-6468639-B2 PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL UBE INDUSTRIES, LTD. (JP) 2002-10-22 US disclosed
US-6461738-B2 HEAT AND SOLVENT RESISTANCE UBE INDUSTRIES, INC. (JP) 2002-10-08 US disclosed
US-20020076548-A1 SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM UBE INDUSTRIES, LTD. (JP) 2002-06-20 US disclosed
US-20020001763-A1 Photosensitive resin compositions, insulating films, and processes for formation of the films UBE INDUSTRIES, LTD. 2002-01-03 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
US-20010020081-A1 Polyimide-based insulating film composition, insulating film and insulating film-forming method UBE INDUSTRIES, LTD. (JP) 2001-09-06 US disclosed
US-6117510-A SUPPORT FILMS WITH POLYIMIDOSILOXANE COPOLYMER COATINGS UBE INDUSTRIES, LTD. (JP) 2000-09-12 US disclosed