SCHEMBL2320188

SCHEMBL2320188

CCCCCCC(C)C#CC([O])=O

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.43
GPR84 Q9NQS5 7/20 0.42
CA1 P00915 2/20 0.42
FFAR1 O14842 2/20 0.42
ZDHHC7 Q9NXF8 1/20 0.42
MAPT P10636 1/20 0.41
LCK P06239 1/20 0.41
PPARD Q03181 1/20 0.41
ZDHHC20 Q5W0Z9 1/20 0.41
ZDHHC2 Q9UIJ5 1/20 0.41
FAAH O00519 1/20 0.40
CA2 P00918 1/20 0.40
FFAR4 Q5NUL3 1/20 0.39
FDPS P14324 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2491510 0.84 ZDHHC7 (0.46) ACE2GPR84CA1FFAR1ZDHHC7
SCHEMBL272762 0.82 ACE2 (0.44) ACE2GPR84CA1FFAR1MAPT
SCHEMBL29647839 0.79 OPRM1 (0.48) ACE2GPR84FDPS
SCHEMBL16782308 0.79 OPRM1 (0.48) ACE2GPR84FDPS
Bicarbonate SCHEMBL29385221 0.76 HMGCR (0.44) ACE2GPR84FFAR1MAPT
SCHEMBL273813 0.76 CA2 (0.42) ACE2GPR84CA1FFAR1MAPT
SCHEMBL31112701 0.75 SPHK1 (0.43) ACE2GPR84CA1FFAR1MAPT
SCHEMBL21218968 0.75 SPHK1 (0.43) ACE2GPR84CA1FFAR1MAPT
SCHEMBL5068321 0.75 SPHK1 (0.43) ACE2GPR84CA1FFAR1MAPT
SCHEMBL28783023 0.75 SPHK1 (0.43) ACE2GPR84CA1FFAR1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1536285-B1 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJIFILM CORP (JP) 2016-01-06 EP disclosed
US-9046782-B2 Resist composition for negative tone development and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
EP-2353048-B1 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD FUJIFILM CORP (JP) 2015-02-25 EP disclosed
EP-2157477-B1 USE OF A RESIST COMPOSITION FOR NEGATIVE WORKING-TYPE DEVELOPMENT, AND METHOD FOR PATTERN FORMATION USING THE RESIST COMPOSITION FUJIFILM CORP (JP) 2014-08-06 EP disclosed
US-8709704-B2 Pattern forming method using developer containing organic solvent and rinsing solution for use in the pattern forming method FUJIFILM CORPORATION (JP) 2014-04-29 US disclosed
US-20110229832-A1 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2011-09-22 US disclosed
EP-2353048-A2 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD FUJIFILM Corporation (JP) 2011-08-10 EP disclosed
US-20100190106-A1 RESIST COMPOSITION FOR NEGATIVE TONE DEVELOPMENT AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2010-07-29 US disclosed
WO-2010061977-A2 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2010-06-03 WO disclosed
EP-2157477-A1 RESIST COMPOSITION FOR NEGATIVE WORKING-TYPE DEVELOPMENT, AND METHOD FOR PATTERN FORMATION USING THE RESIST COMPOSITION Fujifilm Corporation (JP) 2010-02-24 EP disclosed
US-20080081294-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
EP-1906246-A2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM Corporation (JP) 2008-04-02 EP disclosed
US-7348122-B2 Photosensitive resin composition and method for manufacturing semiconductor device using the same FUJIFILM CORPORATION (JP) 2008-03-25 US disclosed
US-7341817-B2 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJIFILM CORPORATION (JP) 2008-03-11 US disclosed
US-20070087288-A1 Positive-working photosensitive composition and pattern forming method using the same FUJIFILM CORPORATION 2007-04-19 US disclosed
US-20070048656-A1 Photosensitive resin composition and method for manufacturing semiconductor device using the same FUJI PHOTO FILM CO., LTD. 2007-03-01 US disclosed
US-20060210922-A1 Positive resist composition and pattern forming method using the resist composition FUJI PHOTO FILM CO., LTD. 2006-09-21 US disclosed
EP-1703322-A2 Positive resist composition and pattern forming method using the resist composition FUJI PHOTO FILM CO., LTD. (JP) 2006-09-20 EP disclosed
US-20050123859-A1 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJI PHOTO FILM CO., LTD. 2005-06-09 US disclosed
EP-1536285-A2 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2005-06-01 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110229832-A1 PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD RER1, RARA, RARG ACE2 4648/4885GPR84 2217/4885CA1 483/4885
US-20050123859-A1 Photosensitive composition, compound for use in the photosensitive composition, and pattern forming method using the photosensitive composition PFN1, SPIN4, PPOX ACE2 4806/4885GPR84 3358/4885CA1 1359/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.