Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | CES1 | P23141 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2846774 | 1.00 | CES2 (0.33) | CES2CES1ALDH1A1HSD17B10 | |
| SCHEMBL2842129 | 0.96 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL3141136 | 0.73 | EPHX1 (0.35) | CES2CES1 | |
| SCHEMBL4657040 | 0.73 | CES2 (0.30) | CES2CES1 | |
| SCHEMBL11889302 | 0.69 | ALDH1A1 (0.33) | CES2CES1ALDH1A1HSD17B10 | |
| SCHEMBL11097584 | 0.69 | ALDH1A1 (0.33) | CES2CES1ALDH1A1HSD17B10 | |
| SCHEMBL652387 | 0.69 | ALDH1A1 (0.33) | CES2CES1ALDH1A1HSD17B10 | |
| SCHEMBL3146301 | 0.69 | — | — | |
| SCHEMBL3145841 | 0.67 | EPHX1 (0.31) | — | |
| SCHEMBL15915221 | 0.67 | ALDH1A1 (0.32) | ALDH1A1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 227 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2550562-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-21 | — | — | EP | disclosed |
| EP-2539769-B1 | PATTERN FORMING METHOD AND RESIST COMPOSITION | FUJIFILM CORP (JP) | 2021-04-07 | — | — | EP | disclosed |
| CN-105051610-B | Pattern forming method and method for manufacturing electronic component | 富士胶片株式会社 | 2020-02-14 | — | — | CN | disclosed |
| EP-2681623-B1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM | FUJIFILM CORP (JP) | 2019-07-10 | — | — | EP | disclosed |
| US-20190196328-A1 | PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION | FUJIFILM CORPORATION (JP) | 2019-06-27 | — | — | US | disclosed |
| EP-2434343-B1 | Resist composition, resist film therefrom and method of forming pattern therewith | FUJIFILM CORP (JP) | 2019-05-15 | — | — | EP | disclosed |
| US-10248019-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film | FUJIFILM CORPORATION (JP) | 2019-04-02 | — | — | US | disclosed |
| US-10126651-B2 | Pattern forming method, and, method for producing electronic device and electronic device, each using the same | FUJIFILM CORPORATION (JP) | 2018-11-13 | — | — | US | disclosed |
| US-10126653-B2 | Pattern forming method and resist composition | FUJIFILM CORPORATION (JP) | 2018-11-13 | — | — | US | disclosed |
| US-9952509-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2018-04-24 | — | — | US | disclosed |
| WO-2011087144-A1 | PATTERN FORMING METHOD, PATTERN, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-21 | — | — | WO | disclosed |
| WO-2011083872-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-07-14 | — | — | WO | disclosed |
| US-20110091809-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-04-21 | — | — | US | disclosed |
| WO-2011043481-A1 | PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM | FUJIFILM CORPORATION (JP) | 2011-04-14 | — | — | WO | disclosed |
| WO-2011024734-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-03-03 | — | — | WO | disclosed |
| US-20110008731-A1 | ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2011-01-13 | — | — | US | disclosed |
| WO-2010140709-A1 | METHOD OF FORMING PATTERN USING ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, AND PATTERN | FUJIFILM CORPORATION (JP) | 2010-12-09 | — | — | WO | disclosed |
| US-20100255418-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN THEREWITH | FUJIFILM CORPORATION (JP) | 2010-10-07 | — | — | US | disclosed |
| US-20100248136-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-09-30 | — | — | US | disclosed |
| WO-2010061977-A2 | PATTERN FORMING METHOD USING DEVELOPER CONTAINING ORGANIC SOLVENT AND RINSING SOLUTION FOR USE IN THE PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-06-03 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100255418-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN THEREWITH | RER1, NOC2L, RAD51 | CES2 2444/4885CES1 3043/4885ALDH1A1 2338/4885 |
| US-20110008731-A1 | ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, COMPOUND AND METHOD OF FORMING PATTERN USING THE COMPOSITION | RER1, XRN2, RXRA | CES2 2665/4885CES1 2386/4885ALDH1A1 2195/4885 |
| US-10248019-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film | ACTR3, RXRA, RARA | CES2 2329/4885CES1 2583/4885ALDH1A1 1688/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.