SCHEMBL23909537

SCHEMBL23909537

COC(=O)c1cccc2c(C(=O)Cl)cccc12

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.50
TSHR P16473 1/20 0.50
NR4A2 P43354 4/20 0.49
ALDH1A1 P00352 3/20 0.48
CFTR P13569 1/20 0.48
HSD17B10 Q99714 1/20 0.48
BRD4 O60885 2/20 0.47
KDM4E B2RXH2 4/20 0.47
POLB P06746 1/20 0.47
ATM Q13315 1/20 0.47
PSMD14 O00487 1/20 0.46
CREBBP Q92793 1/20 0.46
SLC6A4 P31645 1/20 0.45
SLC6A3 Q01959 1/20 0.45
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA9 Q16790 2/20 0.44
CA12 O43570 1/20 0.44
CA7 P43166 1/20 0.44
CA14 Q9ULX7 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7326322 0.92 BRD4 (0.51) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL70429 0.90 LMNA (0.59) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL2153429 0.83 ALDH1A1 (0.52) TSHRNR4A2ALDH1A1HSD17B10KDM4E
SCHEMBL3230050 0.82 NR4A2 (0.53) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL305237 0.82 TSHR (0.61) LMNATSHRALDH1A1CFTRHSD17B10
SCHEMBL70381 0.81 BRD4 (0.59) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL29434198 0.81 BRD4 (0.59) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL23909597 0.81 ALDH1A1 (0.53) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL3207564 0.81 NR4A2 (0.58) LMNATSHRNR4A2ALDH1A1CFTR
SCHEMBL9300933 0.81 LMNA (0.66) LMNATSHRNR4A2ALDH1A1CFTR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-B Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2023-04-28 CN disclosed
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed