SCHEMBL2476595

SCHEMBL2476595

CC(OS(=O)(=O)c1ccccc1)c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.40
HTR6 P50406 1/20 0.39
TDP1 Q9NUW8 3/20 0.39
PARL Q9H300 1/20 0.39
PSIP1 O75475 1/20 0.39
ALDH1A1 P00352 6/20 0.38
MAPT P10636 4/20 0.38
KDM4E B2RXH2 4/20 0.38
HPGD P15428 2/20 0.38
KMT2A Q03164 2/20 0.38
NPSR1 Q6W5P4 3/20 0.37
HSP90AA1 P07900 2/20 0.37
MAPK1 P28482 2/20 0.37
RAB9A P51151 2/20 0.37
LMNA P02545 2/20 0.37
PAX8 Q06710 1/20 0.37
MPI P34949 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
HSD11B1 P28845 1/20 0.37
GMNN O75496 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL491994 0.89 VDR (0.45) TDP1ALDH1A1MAPTKDM4EHPGD
SCHEMBL11988007 0.89 VDR (0.45) TDP1ALDH1A1MAPTKDM4EHPGD
SCHEMBL9098070 0.84 KMT2A (0.49) ALDH1A1MAPTKMT2AMAPK1LMNA
SCHEMBL14778409 0.83 HTR6 (0.46) HTR6TDP1PARLPSIP1ALDH1A1
SCHEMBL9740034 0.81 UGT2B7 (0.46) TDP1KMT2AMAPK1LMNASMN1; SMN2
SCHEMBL9241690 0.81 L3MBTL1 (0.46) HTR6TDP1MAPTKMT2AMAPK1
SCHEMBL780154 0.81 HTR6 (0.44) HTR6TDP1PARLPSIP1ALDH1A1
SCHEMBL16046055 0.81 THRB (0.39) HTR6TDP1PARLPSIP1ALDH1A1
SCHEMBL2351888 0.81 PARL (0.41) HTR6TDP1PARLPSIP1ALDH1A1
SCHEMBL1825460 0.81 CCR5 (0.38) HCAR2HTR6TDP1PARLPSIP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6326122-B1 HEAT SENSITIVE ELEMENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2001-12-04 US claimed
US-11450445-B2 Electroconductive film and method for manufacturing electroconductive pattern TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2022-09-20 US disclosed
US-20200303086-A1 ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2020-09-24 US disclosed
US-10720259-B2 Electroconductive film and method for manufacturing electroconductive pattern TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2020-07-21 US disclosed
EP-3287847-A1 POSITIVE-IMAGE THERMOSENSITIVE LITHOGRAPHIC PRINTING PLATE Qingdao Lanfan Advanced Materials Co. Ltd. (CN) 2018-02-28 EP disclosed
US-20170309363-A1 ELECTROCONDUCTIVE FILM AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2017-10-26 US disclosed
EP-1655132-B2 Positive photosensitive lithographic printing plate AGFA GRAPHICS NV (BE) 2017-08-23 EP disclosed
EP-1747884-B2 Positive photosensitive lithographic printing plate AGFA GRAPHICS NV (BE) 2017-08-23 EP disclosed
EP-1464487-B2 Method of making a positive photosensitive lithographic printing plate AGFA GRAPHICS NV (BE) 2017-05-17 EP disclosed
EP-1464487-B1 Method of making a positive photosensitive lithographic printing plate AGFA GRAPHICS NV (BE) 2015-05-06 EP disclosed
EP-1747884-A2 Positive photosensitive lithographic printing plate Mitsubishi Chemical Corporation (JP) 2007-01-31 EP disclosed
EP-1655132-A2 Positive photosensitive lithographic printing plate MITSUBISHI CHEMICAL CORPORATION (JP) 2006-05-10 EP disclosed
EP-0823327-B1 Method for making positive photosensitive lithographic printing plate MITSUBISHI CHEM CORP (JP) 2004-11-10 EP disclosed
US-6808861-B1 SUITABLE FOR DIRECT PLATE MAKING BY MEANS OF A SEMICONDUCTOR LASER OR A YAG LASER MITSUBISHI CHEMICAL CORPORATION (JP) 2004-10-26 US disclosed
EP-1464487-A2 Positive photosensitive composition and positive photosensitive lithographic printing plate Mitsubishi Chemical Corporation (JP) 2004-10-06 EP disclosed
US-20020146635-A1 Positive photosensitive composition positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plate MITSUBISHI CHEMICAL CORPORATION (JP) 2002-10-10 US disclosed
US-6410207-B1 USING ALKALI DEVELOPER MITSUBISHI CHEMICAL CORPORATION (JP) 2002-06-25 US disclosed
US-6326122-B1 HEAT SENSITIVE ELEMENTS MITSUBISHI CHEMICAL CORPORATION (JP) 2001-12-04 US disclosed
EP-0823327-A2 Positive photosensitive composition, positive photosensitive lithographic printing plate and method for making positive photosensitive lithographic printing plate Mitsubishi Chemical Corporation (JP) 1998-02-11 EP disclosed
US-5446011-A Imagewise coloring when heating; mixture of n-substituted indole, aromatic polyhydroxy compound, carbonyl compound and an acid RICOH COMPANY, LTD. (JP) 1995-08-29 US disclosed