SCHEMBL2494950

SCHEMBL2494950

CCN(CC)C(=Cc1ccccc1)c1nc2ccccc2o1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.48
RAB9A P51151 3/20 0.48
GLO1 Q04760 1/20 0.48
POLB P06746 2/20 0.47
MAPT P10636 6/20 0.46
NPC1 O15118 2/20 0.46
KMT2A Q03164 2/20 0.46
MEN1 O00255 1/20 0.46
MAPK1 P28482 1/20 0.46
FAAH O00519 4/20 0.45
HTT P42858 3/20 0.45
TDP1 Q9NUW8 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
NPSR1 Q6W5P4 1/20 0.43
XDH P47989 1/20 0.43
CES1 P23141 2/20 0.42
DAGLA Q9Y4D2 1/20 0.42
LMNA P02545 2/20 0.41
GAA P10253 2/20 0.41
CYP2C9 P11712 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL476618 0.85 KDM4E (0.49) KDM4ERAB9AGLO1POLBMAPT
SCHEMBL6819064 0.84 MEN1 (0.46) KDM4ERAB9APOLBMAPTNPC1
SCHEMBL8067656 0.80 DAGLA (0.33) KDM4ERAB9AGLO1POLBMAPT
SCHEMBL5708151 0.76 MAPT (0.55) KDM4ERAB9AGLO1POLBMAPT
SCHEMBL11133076 0.75 RAB9A (0.38) KDM4ERAB9AGLO1POLBMAPT
SCHEMBL285169 0.73 KDM4E (0.51) KDM4ERAB9AGLO1POLBMAPT
SCHEMBL12411252 0.72 NPC1 (0.49) RAB9AMAPTNPC1KMT2AMEN1
SCHEMBL11206642 0.72 NPC1 (0.49) RAB9AMAPTNPC1KMT2AMEN1
SCHEMBL2494588 0.72 MEN1 (0.51) KDM4ERAB9AMAPTNPC1KMT2A
SCHEMBL9841094 0.70 GLO1 (0.50) KDM4ERAB9AGLO1MAPTNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US claimed
JP-60019145-A None JP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
WO-2020162630-A1 METHOD FOR PRODUCING ORGANIC COMPOUND ダイキン工業株式会社 2020-08-13 WO disclosed
US-8575288-B2 Photocurable resin composition for forming overcoats RGB pixels black matrixes or spacers in color filter production, and color filters DAI NIPPON PRINTING CO., LTD. (JP) 2013-11-05 US disclosed
US-8029877-B2 Curable resin composition, curable resin composition for forming photosensitive pattern, color filter, liquid crystal panel substrate and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2011-10-04 US disclosed
US-20100238388-A1 CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION FOR FORMING PHOTOSENSITIVE PATTERN, COLOR FILTER, LIQUID CRYSTAL PANEL SUBSTRATE AND LIQUID CRYSTAL PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2010-09-23 US disclosed
US-7537810-B2 Curable resin composition, photosensitive pattern-forming curable resin composition, color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2009-05-26 US disclosed
US-7399574-B2 Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2008-07-15 US disclosed
US-20060229376-A1 Curable resin composition, photosensitive pattern-forming curable resin composition,color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed
US-20030118922-A1 Curable resin for photo-patterning, process for producing the same, curable resin composition, color filter, liquid crystal panel substrate, and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2003-06-26 US disclosed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US disclosed
EP-0107792-B1 PHOTOPOLYMERIZABLE COMPOSITIONS MITSUBISHI KASEI CORPORATION (JP) 1985-12-27 EP disclosed
JP-S6019145-A COMPOSITE TYPE ELECTROPHOTOGRAPHIC SENSITIVE BODY HITACHI LTD 1985-01-31 JP disclosed
EP-0107792-A1 Photopolymerizable compositions MITSUBISHI KASEI CORPORATION (JP) 1984-05-09 EP disclosed
US-4346157-A CHARGE GENERATING AND CHARGE TRANSPORT LAYERS HITACHI, LTD. (JP) 1982-08-24 US disclosed