SCHEMBL476618

SCHEMBL476618

CN(C)C(=Cc1ccccc1)c1nc2ccccc2o1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.49
MAPT P10636 7/20 0.49
KMT2A Q03164 4/20 0.49
RAB9A P51151 3/20 0.49
MEN1 O00255 2/20 0.49
NPC1 O15118 2/20 0.49
MAPK1 P28482 1/20 0.49
GLO1 Q04760 1/20 0.48
HTT P42858 3/20 0.48
FAAH O00519 2/20 0.48
TDP1 Q9NUW8 1/20 0.48
POLB P06746 2/20 0.47
NPSR1 Q6W5P4 1/20 0.46
GAA P10253 3/20 0.43
LMNA P02545 2/20 0.43
CYP2C9 P11712 1/20 0.43
CYP2C19 P33261 1/20 0.43
XDH P47989 3/20 0.43
ALDH1A1 P00352 3/20 0.42
USP2 O75604 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2494950 0.85 KDM4E (0.48) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL11136669 0.84 APP (0.38) KDM4EMAPTKMT2ARAB9AMEN1
2-Mercaptobenzothiazole SCHEMBL28104086 0.82 MEN1 (0.41) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL5708151 0.80 MAPT (0.55) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL9195617 0.77 TDP1 (0.45) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL285169 0.76 KDM4E (0.51) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL28688131 0.73 KMT2A (0.56) KDM4EMAPTKMT2ARAB9AGLO1
Bicarbonate SCHEMBL11140372 0.72 FAAH (0.53) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL23902532 0.70 XDH (0.51) KDM4EMAPTKMT2ARAB9AMEN1
SCHEMBL8032979 0.70 XDH (0.54) KDM4EMAPTKMT2ARAB9AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 568 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111522200-B Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2021-07-27 CN claimed
CN-111522200-A Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof 中国科学院化学研究所 2020-08-11 CN claimed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US claimed
JP-3086760-A None JP disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-12559468-B2 Method for producing organic compound DAIKIN INDUSTRIES, LTD. (JP) 2026-02-24 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-5238784-A PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER SUMITOMO BAKELITE COMPANY LIMITED (JP) 1993-08-24 US disclosed
EP-0532798-A1 An electroluminescent element ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-03-24 EP disclosed
EP-0475086-A1 Photo-sensitive polymer composition HITACHI, LTD. (JP) 1992-03-18 EP disclosed
EP-0430220-A2 Photosensitive resin composition and semiconductor apparatus using it SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
EP-0430221-A2 Photosensitive resin composition SUMITOMO BAKELITE COMPANY LIMITED (JP) 1991-06-05 EP disclosed
JP-H0386760-A PHOTOSENSITIVE RESIN COMPOSITION SUMITOMO BAKELITE CO LTD 1991-04-11 JP disclosed
US-4985470-A Three component photoinitiator system, printing plates, photoresists, inks, paints, adhesives MITSUBISHI KASEI CORPORATION (JP) 1991-01-15 US disclosed
EP-0107792-B1 PHOTOPOLYMERIZABLE COMPOSITIONS MITSUBISHI KASEI CORPORATION (JP) 1985-12-27 EP disclosed
EP-0107792-A1 Photopolymerizable compositions MITSUBISHI KASEI CORPORATION (JP) 1984-05-09 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 KDM4E 295/4885MAPT 2839/4885KMT2A 483/4885
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR KDM4E 88/4885MAPT 1027/4885KMT2A 668/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 KDM4E 1832/4885MAPT 1037/4885KMT2A 373/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 KDM4E 419/4885MAPT 2658/4885KMT2A 805/4885
US-12559468-B2 Method for producing organic compound FOXM1, FOXO3, FOXO1 KDM4E 4532/4885MAPT 4434/4885KMT2A 3164/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.