SCHEMBL24996358

SCHEMBL24996358

CC(OC1=CC=C(c2cc(-c3ccc(O[C@@H](C)Oc4ccccc4)cc3)cc(-c3ccc(OC(C)Oc4ccccc4)cc3)c2S(=O)(=O)O)CC1)Oc1ccccc1

nearest known ligand 0.34

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ CYP1A2 P05177 1/20 0.34
▸ GAA P10253 1/20 0.34
▸ CYP2C9 P11712 1/20 0.34
▸ PKM P14618 1/20 0.34
▸ CYP2C19 P33261 1/20 0.34
▸ MCL1 Q07820 1/20 0.32
▸ MAPT P10636 1/20 0.32
▸ MAP4K4 O95819 2/20 0.31
▸ PPARG P37231 4/20 0.31
▸ PPARA Q07869 4/20 0.31
▸ ALOX15 P16050 1/20 0.30
▸ HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25006154 0.86 CYP1A2 (0.44) CYP1A2GAACYP2C9PKMCYP2C19
SCHEMBL25005778 0.76 PPARA (0.47) CYP1A2GAACYP2C9PKMCYP2C19
SCHEMBL24995338 0.76 ERN1 (0.36) CYP1A2GAACYP2C9PKMCYP2C19
SCHEMBL24995588 0.68 KIF11 (0.44) PPARGPPARA
SCHEMBL25006129 0.67 PPARA (0.42) CYP1A2GAACYP2C9PKMCYP2C19
SCHEMBL21794265 0.67 PTPN1 (0.47) MAPT
SCHEMBL21794146 0.66 SMN1; SMN2 (0.50) CYP1A2CYP2C9CYP2C19MAP4K4
SCHEMBL23432887 0.65 PRKAB2 (0.34) CYP1A2GAACYP2C9PKMCYP2C19
SCHEMBL24581546 0.65 EGFR (0.47) GAAMAPT
SCHEMBL21794139 0.64 MMP3 (0.52) MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4130878-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FOR MANUFACTURING PHOTOMASK, AND METHOD FOR MANUFACTURING PHOTOMASK FUJIFILM Corporation (JP) 2023-02-08 — — EP disclosed
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