SCHEMBL2687995

SCHEMBL2687995

O=C(c1ccccc1)P(=O)(c1ccccc1)c1c(-c2ccccc2)cc(-c2ccccc2)cc1-c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 3/20 0.41
HDAC8 Q9BY41 1/20 0.39
RAB9A P51151 2/20 0.39
KMO O15229 1/20 0.39
NPC1 O15118 1/20 0.39
CTDSP1 Q9GZU7 1/20 0.39
ALDH1A1 P00352 2/20 0.38
KMT2A Q03164 2/20 0.38
PTGS1 P23219 1/20 0.38
EGFR P00533 1/20 0.36
MAP4K4 O95819 1/20 0.35
ATM Q13315 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
MEN1 O00255 1/20 0.35
LMNA P02545 1/20 0.35
MAPT P10636 1/20 0.35
DHODH Q02127 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2773099 0.87 ALDH1A1 (0.40) PTPN1HDAC8RAB9AKMONPC1
SCHEMBL2688000 0.79 PTPN1 (0.45) PTPN1HDAC8KMT2APTGS1EGFR
SCHEMBL22083769 0.78 RAB9A (0.52) PTPN1RAB9ANPC1CTDSP1ALDH1A1
SCHEMBL2771670 0.78 NR1H4 (0.40) RAB9ANPC1CTDSP1ALDH1A1KMT2A
SCHEMBL31401985 0.78 BCAT2 (0.41) PTPN1RAB9ANPC1CTDSP1ALDH1A1
SCHEMBL58814 0.77 ALDH1A1 (0.52) PTPN1HDAC8RAB9ANPC1ALDH1A1
SCHEMBL17446544 0.73 CA2 (0.48) RAB9ANPC1ALDH1A1KMT2AL3MBTL1
SCHEMBL2771466 0.73 KMT2A (0.44) HDAC8RAB9ANPC1ALDH1A1KMT2A
SCHEMBL37050 0.73 LMNA (0.40) HDAC8RAB9ANPC1KMT2AMEN1
SCHEMBL13727652 0.73 PTGS2 (0.36) HDAC8ALDH1A1KMT2APTGS1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2657037-B1 Printing apparatus and printing method SEIKO EPSON CORP (JP) 2020-03-25 EP disclosed
CN-105419459-B Uv-curing type ink jet printing ink composition uses its ink-jet recording apparatus, ink jet recording method and ink group 精工爱普生株式会社 2018-12-14 CN disclosed
US-9458338-B2 Ultraviolet curable type ink-jet ink composition, recording method and recording apparatus using the same SEIKO EPSON CORPORATION (JP) 2016-10-04 US disclosed
CN-104411494-B The manufacture method of duplexer, duplexer, minute concave-convex structure body and protective film 三菱丽阳株式会社 2016-06-08 CN disclosed
US-9327522-B2 Image recording apparatus having an irradiator with directionality in the transport direction SEIKO EPSON CORPORATION (JP) 2016-05-03 US disclosed
US-9296218-B2 Printing apparatus SEIKO EPSON CORPORATION (JP) 2016-03-29 US disclosed
US-9150033-B2 Printing apparatus and printing method SEIKO EPSON CORPORATION (JP) 2015-10-06 US disclosed
US-20150240094-A1 ULTRAVIOLET CURABLE TYPE INK-JET INK COMPOSITION, RECORDING METHOD AND RECORDING APPARATUS USING THE SAME SEIKO EPSON CORP (JP) 2015-08-27 US disclosed
US-9056986-B2 Ultraviolet curable type ink-jet ink composition, recording method and recording apparatus using same SEIKO EPSON CORPORATION (JP) 2015-06-16 US disclosed
CN-104411494-A Method for producing laminate, laminate, and article MITSUBISHI RAYON CO 2015-03-11 CN disclosed
EP-2657037-A1 Printing apparatus and printing method Seiko Epson Corporation (JP) 2013-10-30 EP disclosed
US-20120127249-A1 RECORDING METHOD, LIGHT CURABLE TYPE INK SET, AND RECORDING APPARATUS SEIKO EPSON CORPORATION (JP) 2012-05-24 US disclosed
US-20120113201-A1 ULTRAVIOLET CURABLE TYPE INK-JET INK COMPOSITION, RECORDING METHOD AND RECORDING APPARATUS USISNG SAME SEIKO EPSON CORPORATION (JP) 2012-05-10 US disclosed
US-7560519-B2 Dual-stage wafer applied underfills LORD CORPORATION (US) 2009-07-14 US disclosed
EP-1694769-A4 DUAL-STAGE WAFER APPLIED UNDERFILLS LORD CORP (US) 2007-08-29 EP disclosed
US-20070082203-A1 Dual-stage wafer applied underfills LORD CORPORATION 2007-04-12 US disclosed
EP-1694769-A1 DUAL-STAGE WAFER APPLIED UNDERFILLS Lord Corporation (US) 2006-08-30 EP disclosed
WO-2005056675-A1 DUAL-STAGE WAFER APPLIED UNDERFILLS LORD CORPORATION (US) 2005-06-23 WO disclosed
US-6146789-A Battery having a visible-light or near-infrared-light curing resin as an insulating seal THREE BOND CO., LTD. (JP) 2000-11-14 US disclosed
EP-0824276-A1 Visible-light or near-infrared-light curing resin for battery-insulating seal THREE BOND CO., LTD. (JP) 1998-02-18 EP disclosed