Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 2/20 | 0.39 |
| ▸ | GAA | P10253 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | PKM | P14618 | 2/20 | 0.37 |
| ▸ | RECQL | P46063 | 1/20 | 0.37 |
| ▸ | ESR1 | P03372 | 3/20 | 0.35 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.35 |
| ▸ | AR | P10275 | 1/20 | 0.35 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL272276 | 0.85 | ALDH1A1 (0.55) | HSD17B10ALOX15MEN1GAAMAPT | |
| SCHEMBL28336815 | 0.82 | MMP2 (0.40) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL29185435 | 0.82 | ALDH1A1 (0.50) | HSD17B10ALOX15MEN1GAAMAPT | |
| SCHEMBL20920802 | 0.82 | ALDH1A1 (0.38) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL5958751 | 0.80 | HSD17B10 (0.46) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL29399630 | 0.80 | ESR1 (0.50) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL29412586 | 0.80 | ESR1 (0.50) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL766058 | 0.80 | ESR1 (0.50) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL3947426 | 0.79 | HSD17B10 (0.50) | HSD17B10ALOX15CYP3A4MEN1GAA | |
| SCHEMBL1025296 | 0.79 | ALDH1A1 (0.50) | HSD17B10ALOX15CYP3A4MEN1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 211 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8449978-B2 | Insulated wire and insulating varnish used therefor | HITACHI CABLE, LTD. (JP) | 2013-05-28 | — | — | US | claimed |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | RESONAC CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| WO-2025128333-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128334-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| WO-2025128332-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-19 | — | — | WO | disclosed |
| US-20250189892-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250188311-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250188312-A1 | POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME | FUJIFILM ELECTRONIC MAT USA INC (US) | 2025-06-12 | — | — | US | disclosed |
| US-20240361697-A1 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-10-31 | — | — | US | disclosed |
| US-6524764-B1 | Alkali-developable; polyamide, phenol compound and/or ester of a naphthoquinone diazide sulphonic acid | TORAY INDUSTRIES, INC. (JP) | 2003-02-25 | — | — | US | disclosed |
| US-20020162998-A1 | Display | TORAY INDUSTRIES, INC. (JP) | 2002-11-07 | — | — | US | disclosed |
| US-6365306-B2 | ADDING A DISSOLUTION INHIBITOR TO A POLYMER SOLUBLE IN AN AQUEOUS ALKALINE DEVELOPER AND A QUINONEDIAZIDE PHOTOSENSITIZER TO INCREASE THE SOLUBILITY DIFFERENCE BETWEEN THE EXPOSED AND UNEXPOSED PARTS; FINENESS; RESOLUTION; FILMS | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2002-04-02 | — | — | US | disclosed |
| US-6340546-B1 | WHICH, ON HEATING, BECOME HEAT-RESISTANT POLYIMIDE POLYMERS SUITABLE FOR SURFACE-PROTECTING FILMS, INTERLAYER INSULATING FILMS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2002-01-22 | — | — | US | disclosed |
| EP-1132773-A1 | POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2001-09-12 | — | — | EP | disclosed |
| US-20010009746-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-07-26 | — | — | US | disclosed |
| US-6232032-B1 | MIXTURE OF POLYBENZOXAZOLE AND POLYAMIDE | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2001-05-15 | — | — | US | disclosed |
| EP-1028354-A1 | Positive photosensitive resin composition, method of forming relief pattern, and electronic part | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-08-16 | — | — | EP | disclosed |
| EP-0961169-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |
| EP-0863436-A1 | Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-09 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | JMJD6, RARA, BCR | HSD17B10 2940/4885ALOX15 2728/4885CYP3A4 2409/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.