Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 2/20 | 0.35 |
| ▸ | CES2 | O00748 | 4/20 | 0.33 |
| ▸ | CES1 | P23141 | 4/20 | 0.33 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | PCSK9 | Q8NBP7 | 1/20 | 0.33 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.32 |
| ▸ | ATM | Q13315 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.31 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482045 | 0.86 | PCSK9 (0.39) | CES2CES1LMNAPCSK9PTGS2 | |
| SCHEMBL10587114 | 0.83 | CES2 (0.41) | CES2CES1PCSK9ALDH1A1 | |
| SCHEMBL6114431 | 0.80 | TP53 (0.38) | TP53CES2CES1LMNAPCSK9 | |
| SCHEMBL27943133 | 0.78 | — | — | |
| SCHEMBL4802957 | 0.76 | ALDH1A1 (0.39) | LMNAALDH1A1PKMSMN1; SMN2L3MBTL1 | |
| SCHEMBL415335 | 0.75 | TP53 (0.38) | TP53CES2CES1LMNAPCSK9 | |
| SCHEMBL417807 | 0.75 | TP53 (0.38) | TP53CES2CES1LMNAPCSK9 | |
| SCHEMBL16351155 | 0.74 | TDP1 (0.46) | ALDH1A1TSHRHPGDSMN1; SMN2 | |
| Fluoride SCHEMBL27660694 | 0.73 | TP53 (0.36) | TP53CES2CES1LMNAPCSK9 | |
| SCHEMBL8992405 | 0.73 | TP53 (0.36) | TP53CES2CES1LMNAPCSK9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113168101-B | Photosensitive resin composition, method for producing pattern cured film, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2025-02-18 | — | — | CN | disclosed |
| CN-113168102-B | Photosensitive resin composition, method for producing pattern cured product, interlayer insulating film, coverlay, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-11-19 | — | — | CN | disclosed |
| CN-112334833-B | Negative photosensitive resin composition, polyimide using same, and method for producing cured relief pattern | 旭化成株式会社 | 2024-09-24 | — | — | CN | disclosed |
| US-12091612-B2 | Electrochromic element | RICOH COMPANY, LTD. (JP) | 2024-09-17 | — | — | US | disclosed |
| CN-114502617-B | Polyimide precursor, photosensitive resin composition, interlayer insulating film, covercoat, surface protective film, and electronic component | 艾曲迪微系统股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| US-11970662-B2 | Electrochromic element | RICOH COMPANY, LTD. (JP) | 2024-04-30 | — | — | US | disclosed |
| CN-117836927-A | Resin cured film, semiconductor device, and method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117730398-A | Resin composition for dicing protective layer and method for processing semiconductor wafer | 株式会社力森诺科 | 2024-03-19 | — | — | CN | disclosed |
| CN-112368284-B | Electrochromic compound, electrochromic composition and electrochromic element | 株式会社理光 | 2024-03-08 | — | — | CN | disclosed |
| US-11859131-B2 | Electrochromic compound, electrochromic composition, and electrochromic element | RICOH COMPANY, LTD. (JP) | 2024-01-02 | — | — | US | disclosed |
| US-8791221-B2 | Addition-curable metallosiloxane compound | DAICEL CORPORATION (JP) | 2014-07-29 | — | — | US | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| EP-2650319-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | Daicel Corporation (JP) | 2013-10-16 | — | — | EP | disclosed |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | DAICEL CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| US-8530003-B2 | Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device | FUJIFILM CORPORATION (JP) | 2013-09-10 | — | — | US | disclosed |
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2012-05-10 | — | — | US | disclosed |
| US-8133550-B2 | Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device | FUJIFILM CORPORATION (JP) | 2012-03-13 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120115333-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | CD79B, BRIX1, SMARCB1 | TP53 3596/4885CES2 2790/4885CES1 3304/4885 |
| US-20130267653-A1 | ADDITION-CURABLE METALLOSILOXANE COMPOUND | B2M, MSI2, MNS1 | TP53 3501/4885CES2 4550/4885CES1 4578/4885 |
| US-11970662-B2 | Electrochromic element | TMEM109, DSG1, GPX1 | TP53 2601/4885CES2 583/4885CES1 2361/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.