Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | TSHR | P16473 | 1/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.46 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.40 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.40 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.37 |
| ▸ | KIF11 | P52732 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | RXRA | P19793 | 1/20 | 0.34 |
| ▸ | RXRB | P28702 | 1/20 | 0.34 |
| ▸ | RXRG | P48443 | 1/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.33 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.33 |
| ▸ | GRIN3B | O60391 | 1/20 | 0.33 |
| ▸ | GRIN1 | Q05586 | 1/20 | 0.33 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.33 |
| ▸ | GRIN2B | Q13224 | 1/20 | 0.33 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.33 |
| ▸ | GRIN3A | Q8TCU5 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL988385 | 0.78 | ALDH1A1 (0.46) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL2101133 | 0.77 | ALDH1A1 (0.41) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL17138351 | 0.76 | TDP1 (0.44) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL450655 | 0.76 | TDP1 (0.44) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL3298464 | 0.74 | ALDH1A1 (0.43) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| Methyl Alcohol SCHEMBL28457865 | 0.73 | ALDH1A1 (0.65) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL2102113 | 0.73 | ALDH1A1 (0.41) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL5000032 | 0.73 | TDP1 (0.41) | ALDH1A1TDP1TSHRCA2GABRA1 | |
| SCHEMBL29130284 | 0.73 | CA12 (0.35) | ALDH1A1TDP1TSHRCA2ALOX12 | |
| SCHEMBL29355273 | 0.73 | ALDH1A1 (0.63) | ALDH1A1TDP1TSHRCA2GABRA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12386256-B2 | Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2025-08-12 | — | — | US | disclosed |
| US-7160625-B2 | Insulating film material containing an organic silane compound, its production method and semiconductor device | TOSOH CORPORATION (JP) | 2007-01-09 | — | — | US | disclosed |
| US-20060127683-A1 | Insulating film material containing an organic silane compound, its production method and semiconductor device | TOSOH CORPORATION | 2006-06-15 | — | — | US | disclosed |
| US-6764807-B2 | LITHOGRAPHY | KODAK POLYCHROME GRAPHICS LLC | 2004-07-20 | — | — | US | disclosed |
| US-20030180550-A1 | Insulating film material containing an organic silane compound, its production method and semiconductor device | TOSOH CORPORATION | 2003-09-25 | — | — | US | disclosed |
| CN-1437228-A | Material for insulating film containing organic silane compound, method for producing the same, and semiconductor device | TOKURI CO LTD (JP) | 2003-08-20 | — | — | CN | disclosed |
| US-20020086235-A1 | Lithography | EASTMAN KODAK COMPANY | 2002-07-04 | — | — | US | disclosed |
| US-6399271-B1 | HYDROXY CONTAINING COMPOUND WITH AFFINITY FOR INK, AND TITANIUM OR SILICON CONTAINING COMPOUND WITH DIFFERENT AFFINITY FOR INK | KODAK POLYCHROME GRAPHICS LLC | 2002-06-04 | — | — | US | disclosed |
| EP-1021301-A1 | PLANOGRAPHIC PRINTING | Kodak Polychrome Graphics Company Ltd. (US) | 2000-07-26 | — | — | EP | disclosed |
| WO-1999014048-A1 | PLANOGRAPHIC PRINTING | KODAK POLYCHROME GRAPHICS COMPANY LTD (US) | 1999-03-25 | — | — | WO | disclosed |
| EP-0377175-A2 | Pattern forming composition and process for forming pattern using the same | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | ALDH1A1 3316/4885TDP1 2890/4885TSHR 3312/4885 |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | ALDH1A1 382/4885TDP1 2023/4885TSHR 4385/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | ALDH1A1 413/4885TDP1 2942/4885TSHR 2388/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.