Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL2745482

CC(C)(C)OC(=O)OC1CC[S+](c2cccc3ccccc23)C1.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.32

Full drug profile on Sugi Atlas →

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ATM Q13315 1/20 0.32
ACACB O00763 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8178159-B2 Organosilicate resin formulation for use in microelectronic devices DOW GLOBAL TECHNOLOGIES LLC 2012-05-15 US disclosed
US-20070185298-A1 Organosilicate resin formulation for use in microelectronic devices DOW GLOBAL TECHNOLOGIES LLC 2007-08-09 US disclosed
EP-1614151-A2 ORGANOSILICATE RESIN FORMULATION FOR USE IN MICROELECTRONIC DEVICES DOW GLOBAL TECHNOLOGIES INC. (US) 2006-01-11 EP disclosed
US-20040241580-A1 Radiation-sensitive resin composition NISHIMURA YUKIO (JP) 2004-12-02 US disclosed
WO-2004090965-A2 ORGANOSILICATE RESIN FORMULATION FOR USE IN MICROELECTRONIC DEVICES DOW GLOBAL TECHNOLOGIES INC. (US) 2004-10-21 WO disclosed
US-6403280-B1 TERPOLYMER COMPRISING MALEIC ANHYDRIDE, NORBORNENE ESTER DERIVATIVE, AND ALICYCLIC (METH)ACRYLATE MONOMERS; DURABILITY TO DRY ETCHING; TRANSPARENCY, STORAGE STABILITY JSR CORPORATION (JP) 2002-06-11 US disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed