SCHEMBL2747207

SCHEMBL2747207

Oc1ccc(C2C3CC4CC(C3)CC2(c2ccc(O)cc2)C4)cc1

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 5/20 0.45
ESR1 P03372 5/20 0.45
CYP2C9 P11712 1/20 0.45
GAA P10253 2/20 0.41
MAPT P10636 1/20 0.41
XBP1 P17861 1/20 0.41
KMT2A Q03164 2/20 0.38
MEN1 O00255 1/20 0.38
POLB P06746 1/20 0.38
GFER P55789 1/20 0.38
CNR2 P34972 1/20 0.37
HSP90AA1 P07900 2/20 0.37
EPHX2 P34913 3/20 0.36
P2RX7 Q99572 1/20 0.35
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
KDM1A O60341 1/20 0.33
NPSR1 Q6W5P4 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3846317 0.84 GAA (0.45) ESR2ESR1CYP2C9GAAMAPT
SCHEMBL28205290 0.83 ALDH1A1 (0.53) ESR2ESR1CYP2C9GAAKMT2A
SCHEMBL2748795 0.83 LIG1 (0.38) KMT2AMEN1P2RX7ALDH1A1LMNA
SCHEMBL2746122 0.81 MEN1 (0.46) MAPTKMT2AMEN1EPHX2P2RX7
SCHEMBL5561167 0.79 KDM1A (0.38) P2RX7ALDH1A1LMNAKDM1A
SCHEMBL14480337 0.78 MEN1 (0.55) ESR2ESR1CYP2C9GAAKMT2A
SCHEMBL2747640 0.78 MMP2 (0.38) ESR2ESR1CYP2C9GAAMAPT
SCHEMBL16088381 0.76 LMNA (0.35) MAPTKMT2AMEN1POLBEPHX2
SCHEMBL28270976 0.76 MEN1 (0.31) GAAMAPTXBP1KMT2AMEN1
SCHEMBL28231046 0.76 ESR1 (0.42) ESR2ESR1CYP2C9GAAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115536880-B Polyarylether ketone-based dielectric film containing rigid annular structure, and preparation method and application thereof 西安交通大学 2024-04-09 CN claimed
CN-115536880-A Polyarylether ketone-based dielectric film containing rigid ring structure and preparation method and application thereof 西安交通大学 2022-12-30 CN claimed
CN-106046735-B It is a kind of with haze, the poly carbonate resin composition of high transparency and preparation method thereof 中国石油化工股份有限公司 2018-12-28 CN claimed
CN-115536880-B Polyarylether ketone-based dielectric film containing rigid annular structure, and preparation method and application thereof 西安交通大学 2024-04-09 CN disclosed
CN-115536880-A Polyarylether ketone-based dielectric film containing rigid ring structure and preparation method and application thereof 西安交通大学 2022-12-30 CN disclosed
CN-115185156-A Photosensitive resin composition for forming partition wall, organic electroluminescent element, image display device, and illumination 三菱化学株式会社 2022-10-14 CN disclosed
CN-109790274-B Urethane resin using polyrotaxane, and polishing pad 株式会社德山 2021-11-02 CN disclosed
CN-105555844-B Fiber-reinforced thermoplastic resin composition 沙特基础全球技术有限公司 2019-11-22 CN disclosed
CN-110402270-A Flame-retardant polycarbonate resin composition and molded article thereof IDEMITSU KOSAN CO 2019-11-01 CN disclosed
CN-110382624-A Polycarbonate resin composition and molded article thereof 出光兴产株式会社 2019-10-25 CN disclosed
CN-110382623-A Polycarbonate resin composition and molded article thereof 出光兴产株式会社 2019-10-25 CN disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1858980-A1 THERMOPLASTIC POLYCARBONATE COMPOSITIONS, ARTICLES MADE THEREFROM AND METHOD OF MANUFACTURE General Electric Company (US) 2007-11-28 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed
CN-1918210-A Method for preparing polycarbonate copolymer IDEMITSU KOSAN CO (JP) 2007-02-21 CN disclosed
WO-2006096438-A1 THERMOPLASTIC POLYCARBONATE COMPOSITIONS, ARTICLES MADE THEREFROM AND METHOD OF MANUFACTURE GENERAL ELECTRIC COMPANY (US) 2006-09-14 WO disclosed
EP-1290058-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC. (US) 2003-03-12 EP disclosed
WO-2001088013-A2 PROCESS FOR MANUFACTURING A HYDROXYESTER DERIVATIVE INTERMEDIATE AND EPOXY RESINS PREPARED THEREFROM DOW GLOBAL TECHNOLOGIES INC (US) 2001-11-22 WO disclosed