Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC6A3 | Q01959 | 3/20 | 0.49 |
| ▸ | HTR3E | A5X5Y0 | 1/20 | 0.38 |
| ▸ | HTR3B | O95264 | 1/20 | 0.38 |
| ▸ | HTR3A | P46098 | 1/20 | 0.38 |
| ▸ | HTR3D | Q70Z44 | 1/20 | 0.38 |
| ▸ | HTR3C | Q8WXA8 | 1/20 | 0.38 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | HTR2A | P28223 | 2/20 | 0.33 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.33 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.33 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | KDM1A | O60341 | 2/20 | 0.32 |
| ▸ | MAOB | P27338 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | BCHE | P06276 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5405667 | 0.77 | SLC6A3 (0.56) | SLC6A3SLC6A4NPC1RAB9AALDH1A1 | |
| SCHEMBL11705873 | 0.68 | CHRNB2 (0.59) | SLC6A3KDM1AMAOB | |
| SCHEMBL3902761 | 0.67 | PTGS2 (0.43) | SLC6A3NPC1RAB9AAKR1C3AKR1C1 | |
| SCHEMBL145371 | 0.66 | MAOB (0.44) | SLC6A3KCNH2ALDH1A1KDM1AMAOB | |
| Biphenyl SCHEMBL28877571 | 0.65 | ALDH1A1 (0.60) | SLC6A4NPC1RAB9AALDH1A1KDM1A | |
| SCHEMBL14974371 | 0.64 | ALDH1A1 (0.42) | NPC1RAB9AALDH1A1GAAKDM1A | |
| SCHEMBL17652437 | 0.64 | ALDH1A1 (0.42) | NPC1RAB9AALDH1A1KDM1AMAOB | |
| SCHEMBL9130854 | 0.64 | ALDH1A1 (0.42) | HTR3ASLC6A4RAB9AALDH1A1KDM1A | |
| SCHEMBL2789125 | 0.64 | PLAU (0.44) | — | |
| SCHEMBL14973844 | 0.64 | ALDH1A1 (0.42) | NPC1RAB9AALDH1A1KDM1AMAOB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115073440-A | Compound with benzoxazole ring and organic electroluminescent device thereof | 长春海谱润斯科技股份有限公司 | 2022-09-20 | — | — | CN | disclosed |
| CN-114730027-A | Ultraviolet-curable composition for light-shielding, light-shielding film, and method for producing article having light-shielding film | 昭和电工材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-109843935-B | Dispersion liquid | 住友化学株式会社 | 2021-07-27 | — | — | CN | disclosed |
| CN-107835843-B | Pigment dispersion liquid containing organic coloring pigment and infrared absorbing dye, colored resin composition, and optical filter | 日本化药株式会社 | 2021-03-19 | — | — | CN | disclosed |
| CN-112034547-A | Coloring composition, color conversion optical filter containing the same, and display device | 日本化药株式会社 | 2020-12-04 | — | — | CN | disclosed |
| CN-109153155-B | Mold release film | 昭和电工材料株式会社 | 2020-11-10 | — | — | CN | disclosed |
| US-10808150-B2 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-10-20 | — | — | US | disclosed |
| CN-105934478-B | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | 日立化成株式会社 | 2020-01-14 | — | — | CN | disclosed |
| US-10358580-B2 | Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-07-23 | — | — | US | disclosed |
| US-9920227-B2 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-03-20 | — | — | US | disclosed |
| US-9868884-B2 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-01-16 | — | — | US | disclosed |
| US-20160355709-A1 | RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT | RESONAC CORPORATION (JP) | 2016-12-08 | — | — | US | disclosed |
| US-20160340561-A1 | ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20160340554-A1 | ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT | RESONAC CORPORATION (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20130244020-A1 | BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER, PRODUCING METHOD THEREOF, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER | NITTO DENKO CORPORATION (JP) | 2013-09-19 | — | — | US | disclosed |
| EP-2639259-A1 | BUBBLE-CONTAINING THERMALLY-CONDUCTIVE RESIN-COMPOSITION LAYER, MANUFACTURING METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAID RESIN-COMPOSITION LAYER | Nitto Denko Corporation (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20100160587-A1 | THERMOSETTING RESIN COMPOSITION AND OPTICAL MEMBER USING CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-2141203-A1 | THERMOSETTING RESIN COMPOSITION AND OPTICAL MEMBER USING CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| US-7192684-B2 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-03-20 | — | — | US | disclosed |
| US-20040067436-A1 | Polymerizable silicon-containing compound, manufacturing method, polymer, resist composition and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-04-08 | — | — | US | disclosed |