Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28484773 | 0.79 | PGR (0.33) | ALDH1A1 | |
| SCHEMBL29084012 | 0.79 | OPRM1 (0.38) | ALDH1A1 | |
| Benzene SCHEMBL28680468 | 0.78 | OPRM1 (0.32) | — | |
| SCHEMBL27794540 | 0.78 | OPRM1 (0.32) | — | |
| SCHEMBL28366987 | 0.75 | ALDH1A1 (0.41) | ALDH1A1 | |
| SCHEMBL17474259 | 0.74 | OPRM1 (0.33) | — | |
| SCHEMBL29093603 | 0.73 | MAPT (0.34) | ALDH1A1 | |
| SCHEMBL5537290 | 0.72 | ALDH1A1 (0.38) | ALDH1A1 | |
| SCHEMBL29084104 | 0.72 | MGAT2 (0.33) | — | |
| SCHEMBL29084132 | 0.72 | RAPGEF3 (0.33) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114787120-B | Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2024-08-09 | — | — | CN | disclosed |
| CN-118251445-A | Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same | 信越化学工业株式会社 | 2024-06-25 | — | — | CN | disclosed |
| CN-112236464-B | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-116813824-A | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-09-29 | — | — | CN | disclosed |
| CN-113348079-B | Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device | 三菱瓦斯化学株式会社 | 2023-06-02 | — | — | CN | disclosed |