SCHEMBL2911445

SCHEMBL2911445

CN(C)c1ccc(C=CC(=O)c2ccc(N(C)C)cc2)cc1

nearest known ligand 0.87

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TLR9 Q9NR96 2/20 0.87
CRHBP P24387 1/20 0.87
CRHR2 Q13324 1/20 0.87
MAPT P10636 6/20 0.84
KMT2A Q03164 4/20 0.84
NPC1 O15118 4/20 0.84
RAB9A P51151 4/20 0.84
CASP3 P42574 1/20 0.84
SMN1; SMN2 Q16637 1/20 0.84
CYP1B1 Q16678 1/20 0.84
SENP8 Q96LD8 1/20 0.84
SENP7 Q9BQF6 1/20 0.84
SENP6 Q9GZR1 1/20 0.84
MAOB P27338 3/20 0.79
HSD17B3 P37058 1/20 0.70
MEN1 O00255 3/20 0.66
L3MBTL1 Q9Y468 2/20 0.66
TDP1 Q9NUW8 2/20 0.66
ALDH1A1 P00352 1/20 0.66
LMNA P02545 1/20 0.66

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2911444 1.00 TLR9 (0.87) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL482965 0.93 MAPT (0.77) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL5950050 0.93 MAPT (0.77) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL5950048 0.93 MAPT (0.77) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL25185026 0.93 CRHBP (1.00) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL25200423 0.93 CRHBP (1.00) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL25190978 0.93 MAPT (0.79) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL25200425 0.93 CRHBP (1.00) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL25205299 0.93 MAPT (0.79) TLR9CRHBPCRHR2MAPTKMT2A
SCHEMBL3045501 0.93 CRHBP (1.00) TLR9CRHBPCRHR2MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 266 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4367280-A AROMATIC CARBONYL COMPOUND AND P-DIALKYLAMINO AROMATIC CARBONYL COMPOUND COMBINATION POLYMERIZATION INITIATOR FUJI PHOTO FILM CO., LTD. (JP) 1983-01-04 US claimed
US-4290870-A 5-ISOXOLONE, AROMATIC CARBONYL, DIALKYLAMINO AROMATIC CARBONYL OR FUJI PHOTO FILM CO., LTD. (JP) 1981-09-22 US claimed
US-4148658-A BENZOYLMETHYLENE-BENSOTHIAZOLYIDEND-THIAZOLIDONE COMPOUND, AMINE, AND AMINOARYLCARBONYL COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1979-04-10 US claimed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-02-05 US disclosed
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-01-01 US disclosed
EP-0203393-B1 CURABLE COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1989-07-12 EP disclosed
US-4778859-A Tetramine derived polyimide with pendant unsaturation, and various photosensitive compositions therefrom ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1988-10-18 US disclosed
EP-0254230-A2 Heat-resistant photoresist film Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1988-01-27 EP disclosed
EP-0203393-A1 Curable composition Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1986-12-03 EP disclosed
US-4367280-A AROMATIC CARBONYL COMPOUND AND P-DIALKYLAMINO AROMATIC CARBONYL COMPOUND COMBINATION POLYMERIZATION INITIATOR FUJI PHOTO FILM CO., LTD. (JP) 1983-01-04 US disclosed
US-4290870-A 5-ISOXOLONE, AROMATIC CARBONYL, DIALKYLAMINO AROMATIC CARBONYL OR FUJI PHOTO FILM CO., LTD. (JP) 1981-09-22 US disclosed
US-4148658-A BENZOYLMETHYLENE-BENSOTHIAZOLYIDEND-THIAZOLIDONE COMPOUND, AMINE, AND AMINOARYLCARBONYL COMPOUND FUJI PHOTO FILM CO., LTD. (JP) 1979-04-10 US disclosed
US-4018607-A Crystalline organic pigment sensitizers for photoconductive layers EASTMAN KODAK COMPANY (US) 1977-04-19 US disclosed
US-4018606-A Organic azo pigment sensitizers for photoconductive layers EASTMAN KODAK COMPANY (US) 1977-04-19 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 TLR9 421/4885CRHBP 2429/4885CRHR2 319/4885
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR TLR9 1627/4885CRHBP 3186/4885CRHR2 2040/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 TLR9 3448/4885CRHBP 2558/4885CRHR2 947/4885
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEM1, ASIC1, SMARCB1 TLR9 1011/4885CRHBP 1105/4885CRHR2 557/4885
US-20260036904-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE RER1, ASIC1, FRG1 TLR9 1067/4885CRHBP 3487/4885CRHR2 401/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 TLR9 803/4885CRHBP 3998/4885CRHR2 3916/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.