SCHEMBL30457795

SCHEMBL30457795

COc1cccc(S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)c2ccccc2)c1

nearest known ligand 0.47

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PGR P06401 5/20 0.47
HSD11B1 P28845 1/20 0.47
NFE2L2 Q16236 4/20 0.46
KEAP1 Q14145 3/20 0.46
KAT6A Q92794 3/20 0.45
TAS2R14 Q9NYV8 1/20 0.45
MEP1B Q16820 1/20 0.43
FFAR4 Q5NUL3 1/20 0.43
CTSG P08311 1/20 0.42
CMA1 P23946 1/20 0.42
CA12 O43570 1/20 0.40
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
CA9 Q16790 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3177012 1.00 PGR (0.47) PGRHSD11B1NFE2L2KEAP1KAT6A
SCHEMBL3177826 0.95 MEP1B (0.46) PGRHSD11B1NFE2L2KEAP1KAT6A
SCHEMBL3166497 0.86 KMT2A (0.48) PGRHSD11B1CA1CA2
SCHEMBL3160621 0.81 HTR6 (0.40) NFE2L2KEAP1MEP1BFFAR4
SCHEMBL30137796 0.81 HTR6 (0.40) NFE2L2KEAP1MEP1BFFAR4
SCHEMBL65095 0.80 SMN1; SMN2 (0.46) CA12CA1CA2CA9
SCHEMBL3160442 0.80 HTR6 (0.39) NFE2L2KEAP1MEP1BFFAR4
SCHEMBL28299239 0.80 MTNR1B (0.41) PGRHSD11B1NFE2L2KEAP1TAS2R14
SCHEMBL30137805 0.80 HTR6 (0.39) NFE2L2KEAP1MEP1BFFAR4
SCHEMBL6932659 0.80 HSD11B1 (0.54) PGRHSD11B1KAT6A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122072436-A Negative photosensitive resin composition, cured film, and resist film DIC株式会社 2026-05-22 CN disclosed
CN-119575759-A Positive photosensitive resin composition, photosensitive film, resist underlayer film, resist permanent film, and method for producing film DIC株式会社 2025-03-07 CN disclosed
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 CN disclosed
CN-118011733-A Positive photosensitive resin composition, resist film, resist underlayer film, and resist permanent film DIC株式会社 2024-05-10 CN disclosed
CN-117075428-A Negative photosensitive resin composition DIC株式会社 2023-11-17 CN disclosed
CN-110959138-B Resist material DIC株式会社 2023-06-30 CN disclosed