Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNB2 | P17787 | 1/20 | 0.31 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.31 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.31 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | ANPEP | P15144 | 2/20 | 0.30 |
| ▸ | RNPEP | Q9H4A4 | 2/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | DNPEP | Q9ULA0 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3155313 | 0.87 | CHRNB2 (0.36) | CHRNB2CHRNB4CHRNA3CHRNA4 | |
| SCHEMBL3476847 | 0.84 | EPHX1 (0.43) | CHRNB2CHRNB4CHRNA3CHRNA4 | |
| SCHEMBL18271650 | 0.84 | ALOX15 (0.30) | — | |
| SCHEMBL4544298 | 0.84 | CYP2D6 (0.36) | CHRNB2CHRNB4CHRNA3CHRNA4 | |
| SCHEMBL1720124 | 0.83 | CAD (0.31) | — | |
| SCHEMBL1142593 | 0.82 | BCAT2 (0.33) | HTT | |
| SCHEMBL3158558 | 0.82 | MTNR1A (0.33) | CHRNB2CHRNB4CHRNA4ANPEPRNPEP | |
| SCHEMBL1142597 | 0.76 | — | — | |
| SCHEMBL2261531 | 0.75 | — | — | |
| SCHEMBL27822111 | 0.75 | CHRNB2 (0.50) | CHRNB2CHRNB4CHRNA3CHRNA4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| CN-120153318-A | Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film | 旭化成株式会社 | 2025-06-13 | — | — | CN | disclosed |
| WO-2024225072-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM | 旭化成株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| CN-102047178-B | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2014-05-28 | — | — | CN | disclosed |
| CN-102047179-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2014-02-26 | — | — | CN | disclosed |
| CN-102439520-A | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2012-05-02 | — | — | CN | disclosed |
| CN-102047179-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | ASAHI KASEI E MATERIALS CORP | 2011-05-04 | — | — | CN | disclosed |
| CN-102047178-A | Photosensitive resin composition | ASAHI KASEI E MATERIALS CORP | 2011-05-04 | — | — | CN | disclosed |
| CN-101993537-A | Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same | ASAHI KASEI E MATERIALS CORP | 2011-03-30 | — | — | CN | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| CN-101495919-A | Positive photosensitive resin composition | ASAHI KASEI EMD CORP (JP) | 2009-07-29 | — | — | CN | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | CHRNB2 3898/4885CHRNB4 3816/4885CHRNA3 3208/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | CHRNB2 2637/4885CHRNB4 3284/4885CHRNA3 2758/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.