SCHEMBL3311317

SCHEMBL3311317

ClC(Cl)(Cl)c1nc(-c2ccc(CCc3ccccc3)cc2)nc(C(Cl)(Cl)Cl)n1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.42
NPC1 O15118 2/20 0.42
RAB9A P51151 2/20 0.42
CYP1A2 P05177 1/20 0.42
CYP2C19 P33261 1/20 0.42
KCNH2 Q12809 1/20 0.40
ALDH1A1 P00352 2/20 0.39
MAPT P10636 1/20 0.38
MAOA P21397 2/20 0.38
MAOB P27338 2/20 0.38
PDE5A O76074 1/20 0.38
LMNA P02545 2/20 0.38
KDM4E B2RXH2 2/20 0.38
NPSR1 Q6W5P4 1/20 0.38
PDE7A Q13946 1/20 0.36
PDE7B Q9NP56 1/20 0.36
ATM Q13315 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
NR1H3 Q13133 2/20 0.36
GAA P10253 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL125466 0.83 MEN1 (0.44) L3MBTL1NPC1RAB9ACYP1A2CYP2C19
SCHEMBL4900598 0.83 MEN1 (0.47) L3MBTL1NPC1RAB9ACYP1A2CYP2C19
SCHEMBL80527 0.83 MEN1 (0.47) L3MBTL1NPC1RAB9ACYP1A2CYP2C19
SCHEMBL14040238 0.83 S1PR1 (0.39) L3MBTL1NPC1RAB9AALDH1A1MAPT
SCHEMBL8412982 0.81 NPC1 (0.38) L3MBTL1NPC1RAB9AALDH1A1MAPT
SCHEMBL2833718 0.80 RAB9A (0.47) NPC1RAB9AALDH1A1MAPTKDM4E
SCHEMBL9871106 0.79 ESR1 (0.57) L3MBTL1NPC1RAB9AALDH1A1MAPT
SCHEMBL2760438 0.79 IDO1 (0.39) PDE7APDE7B
SCHEMBL765590 0.79 ADORA3 (0.38) PDE7APDE7B
SCHEMBL2832962 0.79 TP53 (0.43) NPC1RAB9ACYP1A2ALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10656520-B2 Photosensitive resin composition and cured film prepared therefrom ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD (KR) 2020-05-19 US disclosed
US-20180373144-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2018-12-27 US disclosed
EP-1564591-B1 Polymerizable composition FUJIFILM CORP (JP) 2016-08-03 EP disclosed
US-20100112474-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING A PERMANENT PATTERN, AND PRINTED BOARD FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20080268374-A1 Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process FUJIFILM CORPORATION (JP) 2008-10-30 US disclosed
US-20080118867-A1 Pattern Forming Material, Pattern Forming Apparatus, And Pattern Forming Process ASAHI KASEI E-MATERIALS CORPORATION (JP) 2008-05-22 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-20080113302-A1 Pattern Forming Process FUJIFILM CORPORATION (JP) 2008-05-15 US disclosed
EP-1780599-A1 PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, PHOTOSENSITIVE LAMINATE, PATTERN FORMING APPARATUS AND METHOD OF PATTERN FORMATION FUJIFILM Corporation (JP) 2007-05-02 EP disclosed
WO-2006004171-A1 PHOTOSENSITIVE FILM, PROCESS FOR PRODUCING THE SAME, PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2006-01-12 WO disclosed
WO-2005109098-A1 PATTERN FORMING MATERIAL, PATTERN FORMING APPARATUS, AND PATTERN FORMING PROCESS FUJI PHOTO FILM CO., LTD. (JP) 2005-11-17 WO disclosed
WO-2005093793-A1 PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed
WO-2005093515-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, AND PERMANENT PATTERN AND PROCESS FOR FORMING THE SAME FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed
WO-2005091078-A1 PATTERN FORMING PROCESS AND PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-09-29 WO disclosed
WO-2005083522-A1 PATTERN FORMING PROCESS FUJI PHOTO FILM CO., LTD. (JP) 2005-09-09 WO disclosed