SCHEMBL2760438

SCHEMBL2760438

SCc1ccc(-c2nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n2)cc1

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 6/20 0.39
PDE7A Q13946 1/20 0.33
PDE7B Q9NP56 1/20 0.33
DHFR P00374 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8412982 0.84 NPC1 (0.38)
SCHEMBL2832962 0.81 TP53 (0.43)
SCHEMBL765590 0.81 ADORA3 (0.38) PDE7APDE7B
SCHEMBL13528466 0.81 DHFR (0.37) DHFR
SCHEMBL3343534 0.80 TP53 (0.42)
SCHEMBL5019508 0.80 MKNK1 (0.40) PDE7APDE7B
SCHEMBL17756343 0.80 IDO1 (0.46) IDO1DHFR
SCHEMBL14040238 0.79 S1PR1 (0.39)
SCHEMBL3311317 0.79 L3MBTL1 (0.42) PDE7APDE7B
SCHEMBL80044 0.76 NPC1 (0.52) DHFR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9926422-B2 Bump-forming material, method for producing electronic component, method for producing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2018-03-27 US disclosed
US-20170260348-A1 BUMP-FORMING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2017-09-14 US disclosed
US-8647813-B2 Photosensitive composition and photosensitive lithographic printing plate material MITSUBISHI PAPER MILLS LIMITED (JP) 2014-02-11 US disclosed
US-20130022927-A1 PHOTOSENSITIVE COMPOSITION AND PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL MITSUBISHI PAPER MILLS LIMITED (JP) 2013-01-24 US disclosed
US-8088552-B2 Photosensitive composition and lithographic printing original plate using the composition OKAMOTO CHEMICAL INDUSTRY CO., LTD. (JP) 2012-01-03 US disclosed
US-20110318689-A1 LIGHT-SENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL MITSUBISHI PAPER MILLS LIMITED (JP) 2011-12-29 US disclosed
US-20110318689-A1 LIGHT-SENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL MITSUBISHI PAPER MILLS LIMITED (JP) 2011-12-29 US disclosed
US-20100112478-A1 WATER-DEVELOPABLE PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE MATERIAL MITSUBISHI PAPER MILLS LIMITED (JP) 2010-05-06 US disclosed
US-7704675-B2 Photosensitive recording layer of sensityzing dye, polymerization initiator, polymerizable compound, binder polymer, protective oxygen barrier layer; backcoat layer of epoxy resin; infrared absorber; scratches prevented without interleaving slip sheets FUJIFILM CORPORATION (JP) 2010-04-27 US disclosed
US-20100081090-A1 PROCESS FOR MAKING LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20090208870-A1 Photosensitive composition and lithographic printing original plate using the composition OKAMOTO CHEMICAL INDUSTRY CO.,LTD. 2009-08-20 US disclosed
EP-1520695-B1 Photosensitive composition and image recording material using the same FUJIFILM CORP (JP) 2008-12-10 EP disclosed
EP-1518673-B1 Photosensitive composition and planographic printing plate precursor FUJIFILM CORP (JP) 2008-05-21 EP disclosed
US-20080113296-A1 Photosensitive recording layer of sensityzing dye, polymerization initiator, polymerizable compound, binder polymer, protective oxygen barrier layer; backcoat layer of epoxy resin; infrared absorber; scratches prevented without interleaving slip sheets FUJIFILM CORPORATION (JP) 2008-05-15 US disclosed