SCHEMBL704364

SCHEMBL704364

CCCO[Si](C)(C)c1ccccc1

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
ALDH1A1 P00352 3/20 0.35
LTA4H P09960 2/20 0.35
HPGD P15428 2/20 0.35
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
CYP1A2 P05177 1/20 0.33
CYP19A1 P11511 1/20 0.33
CYP2C9 P11712 1/20 0.33
CYP2C19 P33261 1/20 0.33
TP53 P04637 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
GAA P10253 2/20 0.32
TLR8 Q9NR97 1/20 0.32
MAPT P10636 1/20 0.32
KDM4E B2RXH2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705459 0.89 CYP19A1 (0.32) ALDH1A1HPGDESR1CYP1A2CYP19A1
SCHEMBL706190 0.88 LTA4H (0.46) ALDH1A1LTA4HCYP1A2CYP19A1CYP2C9
SCHEMBL2598243 0.84 LTA4H (0.44) LMNAMEN1KMT2AALDH1A1LTA4H
SCHEMBL9805244 0.84 LTA4H (0.44) LMNAMEN1KMT2AALDH1A1LTA4H
SCHEMBL18417879 0.84 LTA4H (0.44) LMNAMEN1KMT2AALDH1A1LTA4H
SCHEMBL704989 0.83 LMNA (0.38) LMNAMEN1KMT2AALDH1A1LTA4H
SCHEMBL426599 0.83 LMNA (0.38) LMNAMEN1KMT2AALDH1A1LTA4H
SCHEMBL27670640 0.82 ESR1 (0.37) ALDH1A1LTA4HHPGDESR1ESR2
SCHEMBL106512 0.82 ESR1 (0.37) ALDH1A1LTA4HHPGDESR1ESR2
SCHEMBL3481700 0.81 ACHE (0.33) ALDH1A1CYP19A1CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7335712-B2 Process of producing a siloxy-functionalized polymer BRIDGESTONE CORPORATION (JP) 2008-02-26 US claimed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-8299185-B2 Curable cage-type silicone copolymer and process for production thereof and curable resin composition comprising curable cage-type silicone copolymer and cured product thereof NIPPON STEEL CHEMICAL CO., LTD. (JP) 2012-10-30 US disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100280190-A1 CURABLE CAGE-TYPE SILICONE COPOLYMER AND PROCESS FOR PRODUCTION THEREOF AND CURABLE RESIN COMPOSITION COMPRISING CURABLE CAGE-TYPE SILICONE COPOLYMER AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2010-11-04 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-20060241241-A1 Process of producing a siloxy-functionalized polymer BRIDGESTONE CORPORATION 2006-10-26 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
EP-0042208-B1 METHOD FOR PRODUCING HYDROPHOBIC REINFORCING SILICA FILLERS DOW CORNING CORPORATION (US) 1985-12-04 EP disclosed
EP-0043640-B1 OPTICALLY CLEAR SILICONE COMPOSITIONS CURABLE TO ELASTOMERS DOW CORNING CORPORATION (US) 1985-10-16 EP disclosed
US-4418165-A POLYDIORGANOSILOXANES AND SILICA FILLER DOW CORNING CORPORATION (US) 1983-11-29 US disclosed
US-4344800-A AGING, BASIC CATALYSTS DOW CORNING CORPORATION (US) 1982-08-17 US disclosed
EP-0043640-A1 Optically clear silicone compositions curable to elastomers DOW CORNING CORPORATION (US) 1982-01-13 EP disclosed
EP-0042208-A2 Method for producing hydrophobic reinforcing silica fillers DOW CORNING CORPORATION (US) 1981-12-23 EP disclosed
WO-1981003485-A1 METHOD FOR PRODUCING HYDROPHOBIC REINFORCING SILICA FILLERS AND FILLERS OBTAINED THEREBY DOW CORNING (US) 1981-12-10 WO disclosed
WO-1981003496-A1 OPTICALLY CLEAR SILICONE COMPOSITIONS CURABLE TO ELASTOMERS DOW CORNING (US) 1981-12-10 WO disclosed