SCHEMBL3482172

SCHEMBL3482172

CCCO[SiH](OCCC)c1ccc(CC)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.42
LPL P06858 1/20 0.39
LIPG Q9Y5X9 1/20 0.39
IDO1 P14902 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.36
TDP1 Q9NUW8 2/20 0.36
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36
ATM Q13315 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
RXRA P19793 1/20 0.36
RXRB P28702 1/20 0.36
TP53 P04637 1/20 0.36
TAAR1 Q96RJ0 1/20 0.35
PLAU P00749 1/20 0.35
CYP2C19 P33261 1/20 0.35
CYP2A6 P11509 1/20 0.34
TRPA1 O75762 1/20 0.34
PLK1 P53350 1/20 0.34
LMNA P02545 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL704584 0.89 ALDH1A1 (0.35) ALDH1A1TDP1TSHRL3MBTL1TP53
SCHEMBL3482301 0.88 ALDH1A1 (0.39) ALDH1A1LPLLIPGIDO1SMN1; SMN2
SCHEMBL3482481 0.83 ALDH1A1 (0.40) ALDH1A1LPLLIPGIDO1SMN1; SMN2
SCHEMBL11054435 0.82 ALDH1A1 (0.50) ALDH1A1LPLLIPGSMN1; SMN2TP53
SCHEMBL3481812 0.81 ACHE (0.35) ALDH1A1IDO1SMN1; SMN2TDP1L3MBTL1
SCHEMBL22661018 0.81 LTA4H (0.47) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL8953992 0.79 TSHR (0.41) ALDH1A1TDP1TSHRMAPK1ATM
SCHEMBL15735901 0.79 HTR7 (0.36) ALDH1A1SMN1; SMN2TDP1TSHRL3MBTL1
SCHEMBL313696 0.78 LMNA (0.44) ALDH1A1SMN1; SMN2TDP1TSHRMAPK1
SCHEMBL3482288 0.78 NR1I2 (0.48) ALDH1A1IDO1SMN1; SMN2TDP1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed