SCHEMBL3540816

SCHEMBL3540816

Nc1ncnc2ncnn12

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CSNK1A1 P48729 1/20 0.42
CLK2 P49760 1/20 0.42
LIMK1 P53667 1/20 0.42
DYRK1A Q13627 1/20 0.42
CLK4 Q9HAZ1 1/20 0.42
DYRK1B Q9Y463 1/20 0.42
ALDH1A1 P00352 8/20 0.42
POLB P06746 1/20 0.42
GAA P10253 3/20 0.40
KDM4E B2RXH2 4/20 0.36
RCE1 Q9Y256 1/20 0.36
SMN1; SMN2 Q16637 2/20 0.35
GLA P06280 1/20 0.35
HPGD P15428 1/20 0.35
ENPP1 P22413 1/20 0.34
EGLN2 Q96KS0 6/20 0.34
PDE10A Q9Y233 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5420423 0.73 ALDH1A1 (0.44) CSNK1A1CLK2LIMK1DYRK1ACLK4
SCHEMBL1650004 0.72 ALDH1A1 (0.49) ALDH1A1POLBGAAKDM4ERCE1
Hydrochloric Acid SCHEMBL31049672 0.70 ALDH1A1 (0.47) ALDH1A1POLBGAAKDM4ERCE1
SCHEMBL609328 0.69 ALDH1A1 (0.50) ALDH1A1POLBGAA
SCHEMBL5411017 0.67 DGAT1 (0.41) CSNK1A1CLK2LIMK1DYRK1ACLK4
SCHEMBL21637046 0.67 SMPD3 (0.38) CSNK1A1CLK2LIMK1DYRK1ACLK4
SCHEMBL3547481 0.67 EGLN2 (0.45) CLK4EGLN2
SCHEMBL9373335 0.67 LMNA (0.40) ALDH1A1POLBGAAKDM4ERCE1
SCHEMBL7074320 0.67
SCHEMBL5096009 0.66 EGLN2 (0.50) DYRK1AALDH1A1GAAKDM4ESMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119735985-B Waterproof coating coated on surface of underground coal mine equipment and preparation method thereof 神木市启星煤炭自动化设备有限公司 2025-05-20 CN claimed
CN-119735985-A Waterproof coating coated on surface of underground coal mine equipment and preparation method thereof 神木市启星煤炭自动化设备有限公司 2025-04-01 CN claimed
CN-119285947-A Low-temperature curing polyimide precursor solution and preparation method thereof 北京化工大学常州先进材料研究院 2025-01-10 CN claimed
WO-2023191400-A1 ETHYL PIPERIDINE TRIAZOLO TRIAZINE DERIVATIVES, SYNTHESIS METHOD THEREFOR, AND PHARMACEUTICAL COMPOSITION CONTAINING SAME FOR PREVENTION OR TREATMENT OF CANCER 에이치케이이노엔 주식회사 2023-10-05 WO claimed
EP-1633756-A2 A2A ADENOSINE RECEPTOR ANTAGONISTS Biogen Idec MA Inc. (US) 2006-03-15 EP claimed
WO-2004092173-A2 A2A ADENOSINE RECEPTOR ANTAGONISTS BIOGEN IDEC MA INC. (US) 2004-10-28 WO claimed
WO-2026100079-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100734-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT HDマイクロシステムズ株式会社 2026-05-15 WO disclosed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-03-05 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
CN-105980603-A Etching liquid, replenishing liquid, and method for forming copper wiring MEC股份有限公司 2016-09-28 CN disclosed
CN-102375336-B Manufacturing method of photosensitive resin composition and solidified embossing pattern, and semiconductor device ASAHI KASEI E MATERIALS CORP 2013-10-09 CN disclosed
CN-102375336-A Manufacturing Method Of Photosensitive Resin Composition And Solidified Embossing Pattern, And Semiconductor Device ASAHI KASEI E MATERIALS CORP 2012-03-14 CN disclosed
US-7834014-B2 Parkinson's disease; [2-(7-amino-2-furan-2-yl-[1,2,4]triazolo[1,5-a][1,3,5]triazin-5-yl)-octahydro-pyrido[1,2-a]pyrazin-7-yl]-methanol; BIOGEN IDEC MA INC. (US) 2010-11-16 US disclosed
US-7285550-B2 Triazolotriazines and pyrazolotriazines and methods of making and using the same BIOGEN IDEC MA INC. (US) 2007-10-23 US disclosed
US-20070173505-A1 A2a adenosine receptor antagonists BIOGEN IDEC MA INC. 2007-07-26 US disclosed
US-20060276475-A1 Triazolotriazines and pyrazolotriazines and methods of making and using the same BIOGEN IDEC MA INC. 2006-12-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 CSNK1A1 1037/4885CLK2 4130/4885LIMK1 3785/4885
US-20070173505-A1 A2a adenosine receptor antagonists ADORA2A, ADORA1, ADORA3 CSNK1A1 2796/4885CLK2 2485/4885LIMK1 3573/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 CSNK1A1 298/4885CLK2 3089/4885LIMK1 3243/4885
US-20060276475-A1 Triazolotriazines and pyrazolotriazines and methods of making and using the same ADORA2A, ADORA3, ADORA1 CSNK1A1 2412/4885CLK2 1364/4885LIMK1 3527/4885
US-20260063999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM ARCN1, PBRM1, LCP1 CSNK1A1 2238/4885CLK2 4287/4885LIMK1 2256/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.