Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PKM | P14618 | 5/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.43 |
| ▸ | HTR6 | P50406 | 3/20 | 0.40 |
| ▸ | ACLY | P53396 | 1/20 | 0.38 |
| ▸ | HTR2C | P28335 | 1/20 | 0.38 |
| ▸ | HTR2B | P41595 | 1/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.37 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.37 |
| ▸ | VDR | P11473 | 1/20 | 0.37 |
| ▸ | PNMT | P11086 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
| ▸ | PKLR | P30613 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23074295 | 0.88 | CYP2D6 (0.53) | PKMLMNATSHRHTR2BMAPT | |
| SCHEMBL24385732 | 0.84 | ACLY (0.36) | PKMLMNATSHRACLYNPC1 | |
| SCHEMBL25975471 | 0.84 | VDR (0.35) | PKMLMNATSHRHTR6ACLY | |
| SCHEMBL13203361 | 0.82 | PKM (0.49) | PKMLMNATSHRHTR6NPC1 | |
| SCHEMBL30869955 | 0.82 | PKM (0.34) | PKMHTR2CHTR2BMAPTPKLR | |
| SCHEMBL24383962 | 0.81 | PKM (0.34) | PKMLMNATSHRACLY | |
| SCHEMBL9924561 | 0.81 | GHSR (0.39) | NPC1RAB9AALDH1A1SMN1; SMN2 | |
| SCHEMBL16248295 | 0.81 | MAPT (0.45) | PKMLMNATSHRHTR6ACLY | |
| SCHEMBL10046291 | 0.80 | MAPT (0.43) | PKMLMNATSHRACLYNPC1 | |
| SCHEMBL17589746 | 0.80 | VDR (0.46) | PKMLMNAHTR6ACLYHTR2C |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 118 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240026069-A1 | POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT | JSR CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20240026069-A1 | POLYMER, COMPOSITION, CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT | JSR CORPORATION (JP) | 2024-01-25 | — | — | US | disclosed |
| US-20230345631-A1 | PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | JSR CORPORATION (JP) | 2023-10-26 | — | — | US | disclosed |
| US-20230345631-A1 | PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | JSR CORPORATION (JP) | 2023-10-26 | — | — | US | disclosed |
| US-11584824-B2 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | ENEOS CORPORATION (JP) | 2023-02-21 | — | — | US | disclosed |
| US-11578166-B2 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | ENEOS CORPORATION (JP) | 2023-02-14 | — | — | US | disclosed |
| US-11560465-B2 | Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device | ENEOS CORPORATION (JP) | 2023-01-24 | — | — | US | disclosed |
| US-20220389130-A1 | FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-12-08 | — | — | US | disclosed |
| US-20220195188-A1 | COMPOSITION FOR CURABLE RESINS, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE | ENEOS CORPORATION (JP) | 2022-06-23 | — | — | US | disclosed |
| EP-3991968-A1 | FILM, MULTILAYER BODY, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-05-04 | — | — | EP | disclosed |
| US-20110135944-A1 | THERMOSETTING COMPOSITION | HUNTSMAN INTERNATIONAL LLC (US) | 2011-06-09 | — | — | US | disclosed |
| WO-2011047929-A1 | THERMOSETTING COMPOSITION | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2011-04-28 | — | — | WO | disclosed |
| US-20100222512-A1 | Redox-Induced Cationically Polymerizable Compositions With Low Cure Temperature | HENKEL AG & CO. KGAA (DE) | 2010-09-02 | — | — | US | disclosed |
| US-20100222512-A1 | Redox-Induced Cationically Polymerizable Compositions With Low Cure Temperature | HENKEL AG & CO. KGAA (DE) | 2010-09-02 | — | — | US | disclosed |
| US-20100187001-A1 | NOVEL POLYIMIDE RESIN AND PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION | SONY CHEMICAL & INFORMATION DEVICE CORPORATION (JP) | 2010-07-29 | — | — | US | disclosed |
| WO-2010018008-A1 | THERMOSETTING COMPOSITION | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2010-02-18 | — | — | WO | disclosed |
| US-20090299062-A1 | THERMOSETTING COMPOUND, COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-20090299062-A1 | THERMOSETTING COMPOUND, COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE | SEKISUI CHEMICAL CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| US-6558783-B1 | Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2003-05-06 | — | — | US | disclosed |
| EP-1063262-A1 | THERMOSETTING POLYPHENYLENE ETHER RESIN COMPOSITION, CURED RESIN COMPOSITION OBTAINED THEREFROM, AND LAMINATED STRUCTURE | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 2000-12-27 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090299062-A1 | THERMOSETTING COMPOUND, COMPOSITION CONTAINING THE SAME, AND MOLDED ARTICLE | DHX15, H1-4, KCNJ2 | PKM 3024/4885LMNA 995/4885TSHR 4664/4885 |
| US-11578166-B2 | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device | SEM1, SMARCA1, SMARCD2 | PKM 4047/4885LMNA 1030/4885TSHR 4201/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.