Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 4/20 | 0.38 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | HRH4 | Q9H3N8 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | HTR6 | P50406 | 2/20 | 0.33 |
| ▸ | MPO | P05164 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | GFER | P55789 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.32 |
| ▸ | GAA | P10253 | 2/20 | 0.32 |
| ▸ | FLT1 | P17948 | 1/20 | 0.32 |
| ▸ | FLT4 | P35916 | 1/20 | 0.32 |
| ▸ | KDR | P35968 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | IKBKB | O14920 | 1/20 | 0.32 |
| ▸ | CA12 | O43570 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3939833 | 0.88 | CA2 (0.42) | CA2POLBHTTLMNATSHR | |
| SCHEMBL5382807 | 0.86 | CA2 (0.43) | CA2POLBHTTLMNATSHR | |
| SCHEMBL5374401 | 0.85 | CA2 (0.42) | CA2POLBHTTLMNATSHR | |
| SCHEMBL3937091 | 0.85 | POLB (0.52) | CA2POLBHTTLMNATSHR | |
| SCHEMBL5377515 | 0.79 | HTR6 (0.47) | CA2POLBHRH4LMNATSHR | |
| SCHEMBL9326441 | 0.75 | ALDH1A1 (0.38) | POLBHTTTSHRCYP3A4GFER | |
| SCHEMBL8403864 | 0.73 | ALDH1A1 (0.46) | CA2POLBHTTLMNATSHR | |
| SCHEMBL20788166 | 0.73 | NOS2 (0.47) | POLBHTTTSHRSMN1; SMN2GAA | |
| SCHEMBL6131303 | 0.73 | GABRA1 (0.37) | CA2POLBHTTCYP3A4GFER | |
| SCHEMBL31614612 | 0.73 | DHFR (0.35) | POLBHTTKDM4EALDH1A1PTPN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | claimed |
| US-9957425-B2 | Adhesive composition for semiconductor and adhesive film including the same | CHEIL INDUSTRIES, INC. (KR) | 2018-05-01 | — | — | US | disclosed |
| US-9169425-B2 | Adhesive film and electronic device including the same | CHEIL INDUSTRIES, INC. (KR) | 2015-10-27 | — | — | US | disclosed |
| US-9109147-B2 | Adhesive composition for semiconductor and adhesive film comprising the same | CHEIL INDUSTRIES, INC. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-8946343-B2 | Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film | CHEIL INDUSTRIES, INC. (KR) | 2015-02-03 | — | — | US | disclosed |
| US-20140194555-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2014-07-10 | — | — | US | disclosed |
| US-20140186607-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM | CHEIL INDUSTRIES, INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20130281559-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2013-10-24 | — | — | US | disclosed |
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-20130154125-A1 | ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME | CHEIL INDUSTRIES INC. (KR) | 2013-06-20 | — | — | US | disclosed |
| US-20010015484-A1 | Heat -resistant adhesive sheet | MATSUURA HIDEKAZU (JP) | 2001-08-23 | — | — | US | disclosed |
| US-6248613-B1 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-06-19 | — | — | US | disclosed |
| US-6046072-A | BONDING A SEMICONDUCTOR CHIP TO A LEAD FRAME WITH ADHESIVE MEMBER HAVING LOW MOISTURE ABSORBING, LOW FLOW ADHESIVE AND ENCAPSULATING PACKAGE WITH SEALANT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-04-04 | — | — | US | disclosed |
| EP-0618614-B1 | Heat-resistant adhesive for the fabrication of a semiconductor package | HITACHI CHEMICAL CO LTD (JP) | 1999-01-07 | — | — | EP | disclosed |
| EP-0862205-A1 | Heat-resistant adhesive | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-02 | — | — | EP | disclosed |
| EP-0553612-B1 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO LTD (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5510425-A | AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5508357-A | SOLUBILITY IN SOLVENT, LOW MELTING POINT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-04-16 | — | — | US | disclosed |
| EP-0618614-A2 | Heat-resistant adhesive for the fabrication of a semiconductor package | Hitachi Chemical Co., Ltd. (JP) | 1994-10-05 | — | — | EP | disclosed |
| EP-0553612-A2 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | HITACHI CHEMICAL CO., LTD. (JP) | 1993-08-04 | — | — | EP | disclosed |