Trifluoromethanesulfonic Acid

Trifluoromethanesulfonic Acid

SCHEMBL443422

CC(C)(C)[I+](c1ccccc1)(c1ccccc1)C(C)(C)C.O=S(=O)([O-])C(F)(F)F

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
GPR3 P46089 2/20 0.46
HSD11B1 P28845 4/20 0.38
PTPN1 P18031 1/20 0.38
KCNH2 Q12809 7/20 0.36
ACHE P22303 5/20 0.36
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
CA5A P35218 1/20 0.34
CA9 Q16790 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3947658 0.84 HSD11B1 (0.36) GPR3HSD11B1PTPN1CA1CA2
Trifluoromethanesulfonic Acid SCHEMBL8735170 0.82 GPR3 (0.47) GPR3HSD11B1PTPN1KCNH2ACHE
SCHEMBL2058746 0.82 CA2 (0.40) HSD11B1CA1CA2
SCHEMBL2058552 0.81 MAPK1 (0.36) ACHE
Iodide SCHEMBL9005402 0.79 MAPK1 (0.35) ACHE
Trifluoromethanesulfonic Acid SCHEMBL8640775 0.78 HSD11B1 (0.41) GPR3HSD11B1PTPN1CA1CA2
SCHEMBL2241309 0.77 ALDH1A1 (0.35) HSD11B1CA1CA2CA5ACA9
Trifluoromethanesulfonic Acid SCHEMBL523876 0.74 GPR3 (0.50) GPR3PTPN1KCNH2ACHECA1
Trifluoromethanesulfonic Acid SCHEMBL19915287 0.74 GPR3 (0.50) GPR3PTPN1KCNH2ACHECA1
Trifluoromethanesulfonic Acid SCHEMBL29576707 0.74 GPR3 (0.50) GPR3PTPN1KCNH2ACHECA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250377591-A1 PHOTORESIST COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2025-12-11 US claimed
CN-112313580-B Chemical amplification type positive photoresist composition for improving pattern profile 荣昌化学制品株式会社 2024-11-22 CN claimed
CN-118818901-A KrF negative photoresist and preparation method and patterning forming method thereof 厦门恒坤新材料科技股份有限公司 2024-10-22 CN claimed
CN-117795418-A Chemically amplified positive resist composition for pattern profile and resolution improvement YC化学制品株式会社 2024-03-29 CN claimed
US-11586109-B2 Chemically-amplified-type negative-type photoresist composition YOUNG CHANG CHEMICAL CO., LTD (KR) 2023-02-21 US claimed
EP-3435160-B1 NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER, HAVING HIGH RESOLUTION AND HIGH ASPECT RATIO YOUNG CHANG CHEMICAL CO LTD (KR) 2022-05-04 EP claimed
US-20210216013-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE YOUNG CHANG CHEMICAL CO., LTD (KR) 2021-07-15 US claimed
US-10775699-B2 Negative photoresist composition for KRF laser, having high resolution and high aspect ratio YOUNG CHANG CHEMICAL CO., LTD (KR) 2020-09-15 US claimed
US-20190137871-A1 CHEMICALLY-AMPLIFIED-TYPE NEGATIVE-TYPE PHOTORESIST COMPOSITION YCCHEM CO., LTD. (KR) 2019-05-09 US claimed
US-20190101827-A1 NEGATIVE PHOTORESIST COMPOSITION FOR KRF LASER, HAVING HIGH RESOLUTION AND HIGH ASPECT RATIO YCCHEM CO., LTD. (KR) 2019-04-04 US claimed
US-6472120-B1 IMPROVED ETCHING RESISTANCE ADHESION, WETTABILITY; FIRST MONOMER IS NORBORNENE ESTER, AND A SECOND MONOMER IS MALEIC ANHYDRIDE SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-29 US claimed
US-20020155379-A1 Photosensitive monomer, photosensitive polymer and chemically amplified resist composition comprising lactone group having acid-labile protecting group SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-24 US claimed
US-20020146642-A1 Photosensitive polymers and resist compositions comprising the photosensitive polymers SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-10 US claimed
US-20020042016-A1 Resist composition comprising photosensitive polymer having loctone in its backbone SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-04-11 US claimed
US-6300036-B1 COPOLYMER OF MALEIC ANHYDRIDE AND 2-NORBORNENE-5-METHANOL DERIVATIVE; ACCURATE PATTERNS WHEN EXPOSED TO ARGON FLUORIDE LASERS; DRY ETCHING RESISTANCE SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-10-09 US claimed
US-20010024763-A1 Photosensitive polymer including copolymer of alkyl vinyl ether and resist composition containing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-09-27 US claimed
US-6287747-B1 CONTAINING ORGANOOXYGEN COMPOUNDS AND UNSATURATED COMPOUNDS SAMSUNG ELECTRONICS CO., LTD. (KR) 2001-09-11 US claimed
US-6143466-A Chemically amplified photoresist composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-11-07 US claimed
US-6143465-A Photosensitive polymer having cyclic backbone and resist composition comprising same SAMSUNG ELECTRONICS CO., LTD. (KR) 2000-11-07 US claimed
EP-0921439-A1 Photosensitive polymer and chemically amplified resist composition using the same Samsung Electronics Co., Ltd. (KR) 1999-06-09 EP claimed