Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA1 | P30542 | 4/20 | 0.41 |
| ▸ | ADORA3 | P0DMS8 | 3/20 | 0.41 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.41 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 2/20 | 0.34 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | ALK | Q9UM73 | 1/20 | 0.33 |
| ▸ | TNKS2 | Q9H2K2 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | GNRHR | P30968 | 2/20 | 0.30 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3708487 | 0.88 | ADORA1 (0.43) | ADORA1ADORA3ADORA2ADDAH1KMT2A | |
| SCHEMBL11115095 | 0.82 | ADORA1 (0.39) | ADORA1ADORA3ADORA2ADDAH1KMT2A | |
| SCHEMBL8590742 | 0.81 | GAA (0.45) | DDAH1KMT2AKDM4EHTTGAA | |
| SCHEMBL21777169 | 0.81 | KMT2A (0.34) | ADORA1ADORA3ADORA2ADDAH1KMT2A | |
| SCHEMBL13384268 | 0.79 | ADORA1 (0.36) | ADORA1ADORA3ADORA2ADDAH1KMT2A | |
| SCHEMBL18824951 | 0.76 | ADORA1 (0.34) | ADORA1ADORA3ADORA2ADDAH1KMT2A | |
| SCHEMBL2020536 | 0.75 | — | — | |
| SCHEMBL7604115 | 0.74 | NPSR1 (0.35) | KDM4EL3MBTL1MAPT | |
| SCHEMBL3813547 | 0.71 | — | — | |
| SCHEMBL27886779 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 370 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250075028-A1 | FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS | CYTEC INDUSTRIES, INC. (US) | 2025-03-06 | — | — | US | claimed |
| WO-2023140644-A1 | MODIFIED EPOXY RESIN FOR SEMICONDUCTOR DEVICE ENCAPSULATION, METHOD FOR MANUFACTURING SAME, AND LIQUID RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATION EXHIBITING LOW WARPAGE CONTAINING SAME | (주)에버텍엔터프라이즈 | 2023-07-27 | — | — | WO | claimed |
| US-20210047460-A1 | FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS | CYTEC INDUSTRIES INC. | 2021-02-18 | — | — | US | claimed |
| CN-111868149-A | Fast curing resin formulation with consistent processing characteristics | 塞特工业公司 | 2020-10-30 | — | — | CN | claimed |
| CN-110191907-A | Mix aeroge based on isocyanates-cyclic ethers-clay network copolymer | 汉高股份有限及两合公司 | 2019-08-30 | — | — | CN | claimed |
| US-20190263962-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | Henkel IP & Holding GmbH (DE) | 2019-08-29 | — | — | US | claimed |
| WO-2018077862-A9 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | HENKEL AG & CO. KGAA (DE) | 2019-07-11 | — | — | WO | claimed |
| WO-2018077862-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | HENKEL AG & CO. KGAA (DE) | 2018-05-03 | — | — | WO | claimed |
| EP-3315529-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | Henkel AG & Co. KGaA (DE) | 2018-05-02 | — | — | EP | claimed |
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | claimed |
| US-8318036-B2 | Sizing composition for an insulating product based on mineral wool, and resulting products | SAINT-GOBAIN ISOVER (FR) | 2012-11-27 | — | — | US | claimed |
| EP-1682461-B1 | SIZING COMPOSITION FOR AN INSULATING PRODUCT BASED ON MINERAL WOOL, AND RESULTING PRODUCTS | SAINT GOBAIN ISOVER (FR) | 2011-11-09 | — | — | EP | claimed |
| EP-0867480-A2 | Cationically electrodepositable coating composition | KANSAI PAINT CO., LTD. (JP) | 1998-09-30 | — | — | EP | claimed |
| EP-0478606-B1 | Process for the preparation of epoxy-terminated polyoxazolidones and of electrical laminates therefrom | DOW CHEMICAL CO (US) | 1994-12-14 | — | — | EP | claimed |
| US-5112932-A | Reaction of a polyisocyanate compound with a polyepoxide compound in the presence of a catalyst | THE DOW CHEMICAL COMPANY (US) | 1992-05-12 | — | — | US | claimed |
| US-4658009-A | Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-04-14 | — | — | US | claimed |
| EP-0194895-A2 | 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-09-17 | — | — | EP | claimed |
| US-4514556-A | REACTION OF 2-ETHYL-4-METHYL IMIDAZOLE WITH CATALYST AND FORMALDEHYDE OR METHYLENIZING AGENT, CURING AGENT FOR EPOXY RESIN | SHIKOKU CHEMICALS CORPORATION (JP) | 1985-04-30 | — | — | US | claimed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | claimed |
| JP-60226522-A | — | — | None | — | — | JP | disclosed |
| JP-63221172-A | — | — | None | — | — | JP | disclosed |
| JP-8120162-A | — | — | None | — | — | JP | disclosed |
| JP-60252466-A | — | — | None | — | — | JP | disclosed |
| JP-63105080-A | — | — | None | — | — | JP | disclosed |
| JP-8109240-A | — | — | None | — | — | JP | disclosed |
| JP-8109316-A | — | — | None | — | — | JP | disclosed |
| WO-2025201692-A1 | METHOD OF PRODUCING A SURFACE-MODIFIED TEXTILE | KORDSA TEKNIK TEKSTIL A.S. (TR) | 2025-10-02 | — | — | WO | disclosed |
| EP-4624654-A1 | METHOD OF PRODUCING A SURFACE-MODIFIED TEXTILE AND SURFACE-MODIFIED TEXTILE OBTAINED BY SAID METHOD | Kordsa Teknik Tekstil A.S (TR) | 2025-10-01 | — | — | EP | disclosed |
| US-12410347-B2 | Adhesive composition, and coverlay film and printed circuit board that include the same | DOOSAN CORPORATION (KR) | 2025-09-09 | — | — | US | disclosed |
| US-20250276509-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD (KR) | 2025-09-04 | — | — | US | disclosed |
| EP-3631058-B1 | ELECTROCHEMICAL GRAFTING OF CARBON FIBERS WITH ALIPHATIC AMINES FOR IMPROVED COMPOSITE STRENGTH | DOW GLOBAL TECHNOLOGIES LLC (US) | 2025-07-30 | — | — | EP | disclosed |
| US-12310224-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-05-20 | — | — | US | disclosed |
| US-20250075028-A1 | FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS | CYTEC INDUSTRIES, INC. (US) | 2025-03-06 | — | — | US | disclosed |
| US-12139575-B2 | Fast-cure resin formulations with consistent handling characteristics | CYTEC INDUSTRIES INC. (US) | 2024-11-12 | — | — | US | disclosed |
| US-20240298513-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-09-05 | — | — | US | disclosed |
| US-12077642-B2 | Polymeric aerogel composite and synthesis by ambient and freeze-drying | VIRGINIA COMMONWEALTH UNIVERSITY (US) | 2024-09-03 | — | — | US | disclosed |
| EP-3844202-B1 | EPOXY COMPOSITE FORMULATION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-06-19 | — | — | EP | disclosed |
| US-11980084-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2024-05-07 | — | — | US | disclosed |
| US-11897999-B2 | Insulation product comprising mineral fibers and a binder | SAINT-GOBAIN ISOVER (FR) | 2024-02-13 | — | — | US | disclosed |
| US-11872212-B2 | Self-healing organic crystals | INDIAN INSTITUTE OF SCIENCE EDUCATION AND RESEARCH (IISER) KOLKATA (IN) | 2024-01-16 | — | — | US | disclosed |
| US-11732085-B2 | Epoxy composition | DOW GLOBAL TECHNOLOGIES LLC (US) | 2023-08-22 | — | — | US | disclosed |
| WO-2023140644-A1 | MODIFIED EPOXY RESIN FOR SEMICONDUCTOR DEVICE ENCAPSULATION, METHOD FOR MANUFACTURING SAME, AND LIQUID RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATION EXHIBITING LOW WARPAGE CONTAINING SAME | (주)에버텍엔터프라이즈 | 2023-07-27 | — | — | WO | disclosed |
| US-11702499-B2 | Polyisocyanurate based polymers and fiber reinforced composites | TRIMER TECHNOLOGIES LLC (US) | 2023-07-18 | — | — | US | disclosed |
| US-20230209980-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-06-29 | — | — | US | disclosed |
| US-20230135423-A1 | ADHESIVE COMPOSITION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE THE SAME | DOOSAN CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| US-11600778-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-03-07 | — | — | US | disclosed |
| EP-3645614-B1 | EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR | DOW GLOBAL TECHNOLOGIES LLC (US) | 2023-02-22 | — | — | EP | disclosed |
| US-20230051178-A1 | Self-Healing Organic Crystals | INDIAN INSTITUTE OF SCIENCE EDUCATION AND RESEARCH (IISER) KOLKATA (IN) | 2023-02-16 | — | — | US | disclosed |
| EP-4116388-A1 | ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME | Doosan Corporation (KR) | 2023-01-11 | — | — | EP | disclosed |
| US-20230002536-A1 | MANUFACTURE OF FIBER REINFORCED COMPOSITE MATERIALS WITH ISOCYANATE RESIN | TRIMER TECHNOLOGIES, LLC (US) | 2023-01-05 | — | — | US | disclosed |
| US-11447644-B2 | Antistatic powder coating composition | KCC CORPORATION (KR) | 2022-09-20 | — | — | US | disclosed |
| US-20220293858-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-09-15 | — | — | US | disclosed |
| EP-4048498-A1 | MANUFACTURE OF FIBER REINFORCED COMPOSITE MATERIALS WITH ISOCYANATE RESIN | Sodano, Henry, A. (US) | 2022-08-31 | — | — | EP | disclosed |
| US-20220251433-A1 | ADHESIVE COMPOSITION, COVERLAY FILM COMPRISING SAME, AND PRINTED CIRCUIT BOARD | DOOSAN CORPORATION (KR) | 2022-08-11 | — | — | US | disclosed |
| EP-3724143-B1 | INSULATION PRODUCT COMPRISING MINERAL FIBERS AND A BINDER | SAINT GOBAIN ISOVER (FR) | 2022-06-15 | — | — | EP | disclosed |
| CN-111183192-B | Antistatic powder coating composition | 株式会社KCC | 2022-06-07 | — | — | CN | disclosed |
| US-11349077-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-05-31 | — | — | US | disclosed |
| US-20220153905-A1 | Polyisocyanurate Based Polymers and Fiber Reinforced Composites | TRIMER TECHNOLOGIES, LLC. | 2022-05-19 | — | — | US | disclosed |
| US-11332609-B2 | Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor | DOW GLOBAL TECHNOLOGIES LLC (US) | 2022-05-17 | — | — | US | disclosed |
| EP-3992262-A1 | ADHESIVE COMPOSITION, COVERLAY FILM COMPRISING SAME, AND PRINTED CIRCUIT BOARD | Doosan Corporation (KR) | 2022-05-04 | — | — | EP | disclosed |
| US-11312883-B2 | Conductive paste composition and ceramic electronic component having external electrodes formed using the same | BESTGRAPHENE CO., LTD (KR) | 2022-04-26 | — | — | US | disclosed |
| CN-109429496-B | Thermosetting resin composition, and prepreg and substrate using same | 可隆工业株式会社 | 2022-02-11 | — | — | CN | disclosed |
| US-11225754-B2 | Electrochemical grafting of carbon fibers with aliphatic amines for improved composite strength | DOW GLOBAL TECHNOLOGIES LLC (US) | 2022-01-18 | — | — | US | disclosed |
| US-11198756-B2 | Blend for curing epoxy resin composistions | HUNTSMAN PETROCHEMICAL LLC (US) | 2021-12-14 | — | — | US | disclosed |
| US-11180599-B2 | Polyisocyanurate based polymers and fiber reinforced composites | TRIMER TECHNOLOGIES, LLC (US) | 2021-11-23 | — | — | US | disclosed |
| EP-3472221-B1 | BLEND FOR CURING EPOXY RESIN COMPOSITIONS | HUNTSMAN PETROCHEMICAL LLC (US) | 2021-11-10 | — | — | EP | disclosed |
| EP-3894478-A1 | POLYISOCYANURATE BASED POLYMERS AND FIBER REINFORCED COMPOSITES | Trimer Technologies, LLC (US) | 2021-10-20 | — | — | EP | disclosed |
| US-20210206926-A1 | POLYMERIC AEROGEL COMPOSITE AND SYNTHESIS BY AMBIENT AND FREEZE-DRYING` | U.S. DEPARTMENT OF ENERGY | 2021-07-08 | — | — | US | disclosed |
| US-20210171703-A1 | INSULATION PRODUCT COMPRISING MINERAL FIBERS AND A BINDER | SAINT-GOBAIN ISOVER (FR) | 2021-06-10 | — | — | US | disclosed |
| US-20210163732-A1 | EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR | DOW GLOBAL TECHNOLOGIES LLC | 2021-06-03 | — | — | US | disclosed |
| WO-2021081154-A1 | MANUFACTURE OF FIBER REINFORCED COMPOSITE MATERIALS WITH ISOCYANATE RESIN | SODANO HENRY A (US) | 2021-04-29 | — | — | WO | disclosed |
| EP-3802673-A1 | POLYMERIC AEROGEL COMPOSITE AND SYNTHESIS BY AMBIENT AND FREEZE-DRYING | Virginia Commonwealth University (US) | 2021-04-14 | — | — | EP | disclosed |
| WO-2021049805-A1 | SEALING SHEET, AND SEMICONDUCTOR DEVICE INCLUDING SAME | 주식회사 두산 | 2021-03-18 | — | — | WO | disclosed |
| US-20210047460-A1 | FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS | CYTEC INDUSTRIES INC. | 2021-02-18 | — | — | US | disclosed |
| US-20210002409-A1 | Polyisocyanurate Based Polymers and Fiber Reinforced Composites | TRIMER TECHNOLOGIES, LLC | 2021-01-07 | — | — | US | disclosed |
| US-20200392349-A1 | ANTISTATIC POWDER COATING COMPOSITION | KCC CORPORATION (KP) | 2020-12-17 | — | — | US | disclosed |
| US-20200378059-A1 | ELECTROCHEMICAL GRAFTING OF CARBON FIBERS WITH ALIPHATIC AMINES FOR IMPROVED COMPOSITE STRENGTH | DOW GLOBAL TECHNOLOGIES LLC | 2020-12-03 | — | — | US | disclosed |
| CN-111868149-A | Fast curing resin formulation with consistent processing characteristics | 塞特工业公司 | 2020-10-30 | — | — | CN | disclosed |
| EP-3724143-A1 | INSULATION PRODUCT COMPRISING MINERAL FIBERS AND A BINDER | SAINT-GOBAIN ISOVER (FR) | 2020-10-21 | — | — | EP | disclosed |
| US-20200308457-A1 | CONDUCTIVE PASTE COMPOSITION AND CERAMIC ELECTRONIC COMPONENT HAVING EXTERNAL ELECTRODES FORMED USING THE SAME | UDUCK Advanced Materials Co., Ltd. (KR) | 2020-10-01 | — | — | US | disclosed |
| US-10774173-B2 | Thermosetting resin composition, and prepreg and substrate using same | KOLON INDUSTRIES, INC. (KR) | 2020-09-15 | — | — | US | disclosed |
| EP-3362495-B1 | FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-08-12 | — | — | EP | disclosed |
| WO-2020123640-A1 | POLYISOCYANURATE BASED POLYMERS AND FIBER REINFORCED COMPOSITES | SODANO HENRY A (US) | 2020-06-18 | — | — | WO | disclosed |
| US-10662304-B2 | Composites for protecting signal transmitters/receivers | SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION (US) | 2020-05-26 | — | — | US | disclosed |
| EP-2841255-B1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KK (JP) | 2020-05-13 | — | — | EP | disclosed |
| EP-3645614-A1 | EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR | Dow Global Technologies LLC (US) | 2020-05-06 | — | — | EP | disclosed |
| US-10636971-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2020-04-28 | — | — | US | disclosed |
| EP-3631058-A1 | ELECTROCHEMICAL GRAFTING OF CARBON FIBERS WITH ALIPHATIC AMINES FOR IMPROVED COMPOSITE STRENGTH | Dow Global Technologies LLC (US) | 2020-04-08 | — | — | EP | disclosed |
| US-20200095393-A1 | ORGANIC AEROGELS BASED ON AMINES AND CYCLIC ETHER POLYMER NETWORKS | HENKEL AG & CO KGAA (DE) | 2020-03-26 | — | — | US | disclosed |
| US-20200058876-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2020-02-20 | — | — | US | disclosed |
| EP-3606987-A1 | ORGANIC AEROGELS BASED ON AMINES AND CYCLIC ETHER POLYMER NETWORKS | Henkel AG & Co. KGaA (DE) | 2020-02-12 | — | — | EP | disclosed |
| CN-110494478-A | Organic aerogel based on amine and polymerization of cyclic ethers object network | HENKEL AG & CO KGAA | 2019-11-22 | — | — | CN | disclosed |
| US-10461255-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-10-29 | — | — | US | disclosed |
| EP-3548574-A1 | ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES | Momentive Performance Materials Inc. (US) | 2019-10-09 | — | — | EP | disclosed |
| US-20190276630-A1 | POLYSILOXANE BASED AEROGELS | Henkel IP & Holding GmbH (DE) | 2019-09-12 | — | — | US | disclosed |
| CN-110191907-A | Mix aeroge based on isocyanates-cyclic ethers-clay network copolymer | 汉高股份有限及两合公司 | 2019-08-30 | — | — | CN | disclosed |
| US-20190263962-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | Henkel IP & Holding GmbH (DE) | 2019-08-29 | — | — | US | disclosed |
| US-20190256678-A1 | HYBRID AEROGELS BASED ON CLAYS | Henkel IP & Holding GmbH (DE) | 2019-08-22 | — | — | US | disclosed |
| EP-2909249-B1 | CORE SHELL RUBBER MODIFIED SOLID EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-07-31 | — | — | EP | disclosed |
| US-20190225618-A1 | IDO Inhibitors | MAUTINO MARIO (US) | 2019-07-25 | — | — | US | disclosed |
| WO-2018077862-A9 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | HENKEL AG & CO. KGAA (DE) | 2019-07-11 | — | — | WO | disclosed |
| WO-2019115912-A1 | INSULATION PRODUCT COMPRISING MINERAL FIBERS AND A BINDER | SAINT-GOBAIN ISOVER (FR) | 2019-06-20 | — | — | WO | disclosed |
| EP-3017001-B1 | CURABLE COMPOSITION AND PROCESS FOR THE MANUFACTURE OF AN EPOXY THERMOSET | RHODIA OPERATIONS (FR) | 2019-06-19 | — | — | EP | disclosed |
| US-20190153151-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG AND SUBSTRATE USING SAME | KOLON INDUSTRIES, INC. (KR) | 2019-05-23 | — | — | US | disclosed |
| EP-3472227-A1 | POLYSILOXANE BASED AEROGELS | Henkel AG & Co. KGaA (DE) | 2019-04-24 | — | — | EP | disclosed |
| EP-3472221-A1 | BLEND FOR CURING EPOXY RESIN COMPOSITIONS | Huntsman Petrochemical LLC (US) | 2019-04-24 | — | — | EP | disclosed |
| US-20190100616-A1 | Blend For Curing Epoxy Resin Composistions | HUNTSMAN PETROCHEMICAL LLC | 2019-04-04 | — | — | US | disclosed |
| EP-3458500-A1 | HYBRID AEROGELS BASED ON CLAYS | Henkel AG & Co. KGaA (DE) | 2019-03-27 | — | — | EP | disclosed |
| US-10233190-B2 | IDO inhibitors | NEWLINK GENETICS CORPORATION (US) | 2019-03-19 | — | — | US | disclosed |
| US-20190074444-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2019-03-07 | — | — | US | disclosed |
| CN-109415514-A | Polysiloxane-based aerogels | 汉高股份有限及两合公司 | 2019-03-01 | — | — | CN | disclosed |
| WO-2019005237-A1 | EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-01-03 | — | — | WO | disclosed |
| US-20190002686-A1 | EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-01-03 | — | — | US | disclosed |
| CN-109071826-A | Mixing aeroge based on clay | 汉高股份有限及两合公司 | 2018-12-21 | — | — | CN | disclosed |
| US-10128462-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-11-13 | — | — | US | disclosed |
| US-10107064-B2 | Changeable well seal tool | HALLIBURTON ENERGY SERVICES, INC. (US) | 2018-10-23 | — | — | US | disclosed |
| WO-2018188932-A1 | ORGANIC AEROGELS BASED ON AMINES AND CYCLIC ETHER POLYMER NETWORKS | HENKEL AG & CO. KGAA (DE) | 2018-10-18 | — | — | WO | disclosed |
| US-20180291164-A1 | FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-10-11 | — | — | US | disclosed |
| EP-3134448-B1 | POLYURETHANE-ACRYLATE EPOXY ADHESIVE | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-09-26 | — | — | EP | disclosed |
| US-10077332-B2 | Curable composition and process for the manufacture of an epoxy thermoset | RHODIA OPERATIONS (FR) | 2018-09-18 | — | — | US | disclosed |
| US-20180258215-A1 | ORGANIC AEROGELS BASED ON ISOCYANATE AND CYCLIC ETHER POLYMER NETWORKS | Henkel IP & Holding GmbH (DE) | 2018-09-13 | — | — | US | disclosed |
| US-10066136-B2 | Polyurethane-acrylate epoxy adhesive | DOW GLOBAL TECHNOLOGIES LLC (US) | 2018-09-04 | — | — | US | disclosed |
| EP-3362495-A1 | FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES | Dow Global Technologies, LLC (US) | 2018-08-22 | — | — | EP | disclosed |
| EP-3348558-A1 | COMPOSITIONS COMPRISING FUSED IMIDAZOLE DERIVATIVES USEFUL AS IDO INHIBITORS | Newlink Genetics Corporation (US) | 2018-07-18 | — | — | EP | disclosed |
| WO-2018102509-A1 | ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2018-06-07 | — | — | WO | disclosed |
| US-20180148600-A1 | ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES | MOMENTIVE PERFORMANCE MATERIALS INC. | 2018-05-31 | — | — | US | disclosed |
| WO-2018077862-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | HENKEL AG & CO. KGAA (DE) | 2018-05-03 | — | — | WO | disclosed |
| US-20180118753-A1 | IDO Inhibitors | NEWLINK GENETICS CORPORATION | 2018-05-03 | — | — | US | disclosed |
| EP-3315529-A1 | COPOLYMER HYBRID AEROGELS BASED ON ISOCYANATE - CYCLIC ETHER - CLAY NETWORKS | Henkel AG & Co. KGaA (DE) | 2018-05-02 | — | — | EP | disclosed |
| CN-107922580-A | Organic aerogel based on isocyanates and polymerization of cyclic ethers thing network | 汉高股份有限及两合公司 | 2018-04-17 | — | — | CN | disclosed |
| US-20180026191-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2018-01-25 | — | — | US | disclosed |
| US-9850248-B2 | IDO inhibitors | NEWLINK GENETICS CORPORATION (US) | 2017-12-26 | — | — | US | disclosed |
| WO-2017218934-A1 | BLEND FOR CURING EPOXY RESIN COMPOSITIONS | HUNTSMAN PETROCHEMICAL LLC (US) | 2017-12-21 | — | — | WO | disclosed |
| WO-2017216034-A1 | POLYSILOXANE BASED AEROGELS | HENKEL AG & CO. KGAA (DE) | 2017-12-21 | — | — | WO | disclosed |
| WO-2017198658-A1 | HYBRID AEROGELS BASED ON CLAYS | HENKEL AG & CO. KGAA (DE) | 2017-11-23 | — | — | WO | disclosed |
| US-9806261-B2 | Organic light emitting diode display | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-10-31 | — | — | US | disclosed |
| US-9701811-B2 | Toughened, curable epoxy compositions for high temperature applications | BLUE CUBE IP LLC (US) | 2017-07-11 | — | — | US | disclosed |
| US-9701851-B2 | Core shell rubber modified solid epoxy resins | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-07-11 | — | — | US | disclosed |
| US-9677370-B2 | Deformable plug and seal well system | HALLIBURTON ENERGY SERVICES, INC. (US) | 2017-06-13 | — | — | US | disclosed |
| US-9677372-B2 | Well system cementing plug | HALLIBURTON ENERGY SERVICES, INC. (US) | 2017-06-13 | — | — | US | disclosed |
| US-9677371-B2 | Fluid loss well treatment | HALLIBURTON ENERGY SERVICES, INC. (US) | 2017-06-13 | — | — | US | disclosed |
| US-9644062-B2 | Polymer particle dispersions with polyols | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-05-09 | — | — | US | disclosed |
| WO-2017066056-A1 | FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-04-20 | — | — | WO | disclosed |
| US-20170084868-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-03-23 | — | — | US | disclosed |
| EP-3134448-A1 | POLYURETHANE-ACRYLATE EPOXY ADHESIVE | Dow Global Technologies LLC (US) | 2017-03-01 | — | — | EP | disclosed |
| EP-2385970-B1 | METAL STABILIZERS FOR EPOXY RESINS | BLUE CUBE IP LLC (US) | 2017-03-01 | — | — | EP | disclosed |
| US-9570707-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2017-02-14 | — | — | US | disclosed |
| US-20170029673-A1 | POLYURETHANE-ACRYLATE EPOXY ADHESIVE | DOW GLOBAL TECHNOLOGIES LLC (US) | 2017-02-02 | — | — | US | disclosed |
| WO-2017016755-A1 | ORGANIC AEROGELS BASED ON ISOCYANATE AND CYCLIC ETHER POLYMER NETWORKS | HENKEL AG & CO. KGAA (DE) | 2017-02-02 | — | — | WO | disclosed |
| EP-3124516-A1 | ORGANIC AEROGELS BASED ON ISOCYANATE AND CYCLIC ETHER POLYMER NETWORKS | Henkel AG & Co. KGaA (DE) | 2017-02-01 | — | — | EP | disclosed |
| US-20160362412-A1 | IDO Inhibitors | NEWLINK GENETICS CORPORATION | 2016-12-15 | — | — | US | disclosed |
| EP-2909250-B1 | TOUGHENED, CURABLE EPOXY COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | BLUE CUBE IP LLC (US) | 2016-12-07 | — | — | EP | disclosed |
| US-9475229-B2 | Resin production method and resin production apparatus | CANON KABUSHIKI KAISHA (JP) | 2016-10-25 | — | — | US | disclosed |
| US-20160297941-A1 | COMPOSITES FOR PROTECTING SIGNAL TRANSMITTERS/RECEIVERS | SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION | 2016-10-13 | — | — | US | disclosed |
| US-20160237303-A1 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND PRINTED CIRCUIT BOARD USING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2016-08-18 | — | — | US | disclosed |
| US-9388191-B2 | Fused imidazole derivatives useful as IDO inhibitors | NEWLINK GENETICS CORPORATION (US) | 2016-07-12 | — | — | US | disclosed |
| EP-3033370-A1 | 1K THERMOSET EPOXY COMPOSITION | Dow Global Technologies LLC (US) | 2016-06-22 | — | — | EP | disclosed |
| US-20160152764-A1 | Curable composition and process for the manufacture of an epoxy thermoset | SPECIALTY OPERATIONS FRANCE (FR) | 2016-06-02 | — | — | US | disclosed |
| US-20160152822-A1 | 1K THERMOSET EPOXY COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2016-06-02 | — | — | US | disclosed |
| EP-3017001-A1 | CURABLE COMPOSITION AND PROCESS FOR THE MANUFACTURE OF AN EPOXY THERMOSET | Rhodia Operations (FR) | 2016-05-11 | — | — | EP | disclosed |
| EP-3018132-A1 | FUSED IMIDAZOLE DERIVATIVES USEFUL AS IDO INHIBITORS | Newlink Genetics Corporation (US) | 2016-05-11 | — | — | EP | disclosed |
| US-20160115759-A1 | Changeable Well Seal Tool | HALLIBURTON ENERGY SERVICES, INC. | 2016-04-28 | — | — | US | disclosed |
| US-9278909-B2 | Amide-extended crosslinking compounds and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2016-03-08 | — | — | US | disclosed |
| US-9260434-B2 | Fused imidazole derivatives useful as IDO inhibitors | NEWLINK GENETICS CORPORATION (US) | 2016-02-16 | — | — | US | disclosed |
| EP-2697227-B1 | FUSED IMIDAZOLE DERIVATIVES USEFUL AS IDO INHIBITORS | NEWLINK GENETICS CORP (US) | 2016-02-03 | — | — | EP | disclosed |
| US-20160002249-A1 | Fused Imidazole Derivatives Useful as IDO Inhibitors | NEWLINK GENETICS CORPORATION | 2016-01-07 | — | — | US | disclosed |
| US-20150357601-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | YOULCHON CHEMICAL CO., LTD. (KR) | 2015-12-10 | — | — | US | disclosed |
| US-20150315432-A1 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS | BLUE CUBE IP LLC (US) | 2015-11-05 | — | — | US | disclosed |
| US-20150315412-A1 | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION PROCESS | BLUE CUBE IP LLC (US) | 2015-11-05 | — | — | US | disclosed |
| US-20150319858-A1 | METAL STABILIZERS FOR EPOXY RESINS | BLUE CUBE IP LLC (US) | 2015-11-05 | — | — | US | disclosed |
| WO-2015164031-A1 | POLYURETHANE-ACRYLATE EPOXY ADHESIVE | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-10-29 | — | — | WO | disclosed |
| US-20150252183-A1 | POLYMER PARTICLE DISPERSIONS WITH EPOXY HARDENERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-09-10 | — | — | US | disclosed |
| US-20150252638-A1 | Fluid Loss Well Treatment | HALLIBURTON ENERGY SERVICES, INC. | 2015-09-10 | — | — | US | disclosed |
| US-20150247031-A1 | POLYMER PARTICLE DISPERSIONS WITH DIVINYLARENE DIOXIDES | BLUE CUBE IP LLC | 2015-09-03 | — | — | US | disclosed |
| EP-2909249-A2 | CORE SHELL RUBBER MODIFIED SOLID EPOXY RESINS | Dow Global Technologies LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| EP-2909259-A1 | POLYMER PARTICLE DISPERSIONS WITH POLYOLS | Dow Global Technologies LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| EP-2909268-A1 | POLYMER PARTICLE DISPERSIONS WITH DIVINYLARENE DIOXIDES | Dow Global Technologies LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| EP-2909258-A1 | POLYMER PARTICLE DISPERSIONS WITH EPOXY HARDENERS | Dow Global Technologies LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| EP-2909250-A2 | TOUGHENED, CURABLE EPOXY COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | Dow Global Technologies LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| US-9112180-B2 | Organic light emitting diode display and manufacturing method thereof | SAMSUNG DISPLAY CO., LTD. (KR) | 2015-08-18 | — | — | US | disclosed |
| US-20150225576-A1 | CORE SHELL RUBBER MODIFIED SOLID EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC | 2015-08-13 | — | — | US | disclosed |
| US-20150218299-A1 | POLYMER PARTICLE DISPERSIONS WITH POLYOLS | DOW GLOBAL TECHNOLOGIES LLC | 2015-08-06 | — | — | US | disclosed |
| US-20150210906-A1 | TOUGHENED, CURABLE EPOXY COMPOSITIONS FOR HIGH TEMERATURE APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-07-30 | — | — | US | disclosed |
| US-20150198008-A1 | Well System Cementing Plug | HALLIBURTON ENERGY SERVICES, INC. | 2015-07-16 | — | — | US | disclosed |
| EP-2892948-A1 | TOUGHENING MASTERBLENDS | Dow Global Technologies LLC (US) | 2015-07-15 | — | — | EP | disclosed |
| EP-2892962-A1 | TOUGHENED EPOXY RESIN FORMULATIONS | Dow Global Technologies LLC (US) | 2015-07-15 | — | — | EP | disclosed |
| US-20150183976-A1 | TOUGHENING MASTERBLENDS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-07-02 | — | — | US | disclosed |
| US-20150166825-A1 | TOUGHENED EPOXY RESIN FORMULATIONS | BLUE CUBE IP LLC | 2015-06-18 | — | — | US | disclosed |
| US-20150167424-A1 | Deformable Plug and Seal Well System | HALLIBURTON ENERGY SERVICES, INC. | 2015-06-18 | — | — | US | disclosed |
| US-20150140227-A1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2015-05-21 | — | — | US | disclosed |
| EP-2665761-B1 | HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-04-08 | — | — | EP | disclosed |
| EP-2841255-A1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | Canon Kabushiki Kaisha (JP) | 2015-03-04 | — | — | EP | disclosed |
| WO-2015023615-A1 | 1K THERMOSET EPOXY COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-02-19 | — | — | WO | disclosed |
| EP-2829570-A1 | Curable composition and process for the manufacture of an epoxy thermoset | Rhodia Operations (FR) | 2015-01-28 | — | — | EP | disclosed |
| WO-2015001061-A1 | CURABLE COMPOSITION AND PROCESS FOR THE MANUFACTURE OF AN EPOXY THERMOSET | RHODIA OPERATIONS (FR) | 2015-01-08 | — | — | WO | disclosed |
| EP-2218724-B1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION | SHOWA DENKO KK (JP) | 2015-01-07 | — | — | EP | disclosed |
| EP-2147034-B1 | EPOXY THERMOSET COMPOSITIONS COMPRISING EXCESS EPOXY RESIN AND PROCESS FOR THE PREPARATION THEREOF | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-12-17 | — | — | EP | disclosed |
| WO-2014197832-A1 | WELL SYSTEM CEMENTING PLUG | HALLIBURTON ENERGY SERVICES, INC. (US) | 2014-12-11 | — | — | WO | disclosed |
| WO-2014197834-A1 | FLUID LOSS WELL TREATMENT | HALLIBURTON ENERGY SERVICES, INC. (US) | 2014-12-11 | — | — | WO | disclosed |
| US-8871892-B2 | Polyoxazolidone resins | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-10-28 | — | — | US | disclosed |
| US-20140316068-A1 | BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-10-23 | — | — | US | disclosed |
| US-20140287543-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-25 | — | — | US | disclosed |
| EP-2776503-A1 | BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS | Dow Global Technologies LLC (US) | 2014-09-17 | — | — | EP | disclosed |
| US-8829772-B2 | Organic light emitting diode display with heat dissipating adhesive | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-09-09 | — | — | US | disclosed |
| US-8816021-B2 | Curable composition with rubber-like properties | DESIGNER MOLECULES, INC. (US) | 2014-08-26 | — | — | US | disclosed |
| US-8786186-B2 | Organic light emitting diode display with adhesive layer | SAMSUNG DISPLAY CO., LTD. (KR) | 2014-07-22 | — | — | US | disclosed |
| US-20140186607-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM | CHEIL INDUSTRIES, INC. (KR) | 2014-07-03 | — | — | US | disclosed |
| US-20140162072-A1 | THERMOSETTING RESIN COMPOSITIONS, RESIN FILMS IN B-STAGE, METAL FOILS, COPPER CLAD BOARDS AND MULTI LAYER BUILD-UP BOARDS | TAMURA CORPORATION (JP) | 2014-06-12 | — | — | US | disclosed |
| WO-2014062903-A1 | POLYMER PARTICLE DISPERSIONS WITH POLYOLS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-04-24 | — | — | WO | disclosed |
| WO-2014062891-A1 | POLYMER PARTICLE DISPERSIONS WITH DIVINYLARENE DIOXIDES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-04-24 | — | — | WO | disclosed |
| WO-2014062895-A1 | POLYMER PARTICLE DISPERSIONS WITH EPOXY HARDENERS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-04-24 | — | — | WO | disclosed |
| WO-2014062475-A2 | TOUGHENED, CURABLE EPOXY COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-04-24 | — | — | WO | disclosed |
| WO-2014062531-A2 | CORE SHELL RUBBER MODIFIED SOLID EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-04-24 | — | — | WO | disclosed |
| WO-2014039062-A1 | TOUGHENED EPOXY RESIN FORMULATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-03-13 | — | — | WO | disclosed |
| WO-2014039063-A1 | TOUGHENING MASTERBLENDS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-03-13 | — | — | WO | disclosed |
| EP-2705090-A1 | TRIMETHYL BORATE IN EPOXY RESINS | Dow Global Technologies LLC (US) | 2014-03-12 | — | — | EP | disclosed |
| US-20140066625-A1 | Fused Imidazole Derivatives Useful as IDO Inhibitors | NEWLINK GENETICS CORPORATION (US) | 2014-03-06 | — | — | US | disclosed |
| US-20140045973-A1 | TRIMETHYL BORATE IN EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-02-13 | — | — | US | disclosed |
| WO-2014017505-A1 | RESIN PRODUCTION METHOD AND RESIN PRODUCTION APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2014-01-30 | — | — | WO | disclosed |
| EP-2268697-B1 | EPOXY-IMIDAZOLE CATALYSTS USEFUL FOR POWDER COATING APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2014-01-29 | — | — | EP | disclosed |
| US-8637611-B2 | Amide-extended crosslinking compounds and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2014-01-28 | — | — | US | disclosed |
| US-8637225-B2 | Magnetic recording medium and magnetic recording/reproducing apparatus | SHOWA DENKO K.K. (JP) | 2014-01-28 | — | — | US | disclosed |
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | disclosed |
| US-20130338313-A1 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2013-12-19 | — | — | US | disclosed |
| US-8604150-B2 | Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition | SHOWA DENKO K.K. (JP) | 2013-12-10 | — | — | US | disclosed |
| EP-2665761-A1 | HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS | Dow Global Technologies LLC (US) | 2013-11-27 | — | — | EP | disclosed |
| US-20130307195-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-20130303659-A1 | HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-11-14 | — | — | US | disclosed |
| US-20130292652-A1 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG DISPLAY CO., LTD. (KR) | 2013-11-07 | — | — | US | disclosed |
| US-8557896-B2 | Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film | CHEIL INDUSTRIES, INC. (KR) | 2013-10-15 | — | — | US | disclosed |
| US-20130251931-A1 | NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-09-26 | — | — | US | disclosed |
| US-20130203895-A1 | CURING AGENTS FOR EPOXY RESINS | DESIGNER MOLECULES, INC. (US) | 2013-08-08 | — | — | US | disclosed |
| US-20130178558-A1 | THERMOSET DAMPENER MATERIAL | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-07-11 | — | — | US | disclosed |
| US-20130165603-A1 | Adhesive Composition And Adhesive Film Comprising The Same | CHEIL INDUSTRIES, INC. (KR) | 2013-06-27 | — | — | US | disclosed |
| US-20130143363-A1 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME | CHEIL INDUSTRIES, INC. (KR) | 2013-06-06 | — | — | US | disclosed |
| WO-2013070478-A1 | BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-05-16 | — | — | WO | disclosed |
| EP-2205653-B1 | NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-04-24 | — | — | EP | disclosed |
| US-8404310-B2 | Thermoset dampener material | DOW GLOBAL TECHNOLOGIES LLC (US) | 2013-03-26 | — | — | US | disclosed |
| US-20130012620-A1 | CURING AGENTS FOR EPOXY RESINS | DESIGNER MOLECULES, INC. (US) | 2013-01-10 | — | — | US | disclosed |
| US-20120326194-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO., LTD. (KR) | 2012-12-27 | — | — | US | disclosed |
| US-20120313508-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| US-20120313499-A1 | ORGANIC LIGHT EMITTING DIODE DISPLAY | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2012-12-13 | — | — | US | disclosed |
| US-8318036-B2 | Sizing composition for an insulating product based on mineral wool, and resulting products | SAINT-GOBAIN ISOVER (FR) | 2012-11-27 | — | — | US | disclosed |
| WO-2012151171-A1 | TRIMETHYL BORATE IN EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-11-08 | — | — | WO | disclosed |
| US-8288591-B2 | Curing agents for epoxy resins | DESIGNER MOLECULES, INC. (US) | 2012-10-16 | — | — | US | disclosed |
| EP-2499180-A2 | POLYOXAZOLIDONE RESINS | Dow Global Technologies LLC (US) | 2012-09-19 | — | — | EP | disclosed |
| US-20120214958-A1 | POLYOXAZOLIDONE RESINS | BLUE CUBE IP LLC | 2012-08-23 | — | — | US | disclosed |
| WO-2012099713-A1 | HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-07-26 | — | — | WO | disclosed |
| US-8217120-B2 | Functionalized styrene oligomers and polymers | DESIGNER MOLECULES, INC. (US) | 2012-07-10 | — | — | US | disclosed |
| US-8211540-B2 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2012-07-03 | — | — | US | disclosed |
| US-20120142816-A1 | Novel epoxy hardeners with improved cure and polymers with enhanced coating properties | DOW GLOBAL TECHNOLOGIES INC (US) | 2012-06-07 | — | — | US | disclosed |
| EP-2451872-A1 | CORE/SHELL RUBBERS FOR USE IN ELECTRICAL LAMINATE COMPOSITIONS | Dow Global Technologies LLC (US) | 2012-05-16 | — | — | EP | disclosed |
| US-20120095133-A1 | CORE/SHELL RUBBERS FOR USE IN ELECTRICAL LAMINATE COMPOSITIONS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-19 | — | — | US | disclosed |
| EP-2094759-B1 | EPOXY RESINS COMPRISING A CYCLOALIPHATIC DIAMINE CURING AGENT | DOW GLOBAL TECHNOLOGIES LLC (US) | 2012-04-18 | — | — | EP | disclosed |
| US-8158748-B2 | Hetero-functional compounds and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2012-04-17 | — | — | US | disclosed |
| US-20120065336-A1 | CURABLE COMPOSITION WITH RUBBER-LIKE PROPERTIES | DESIGNER MOLECULES, INC. (US) | 2012-03-15 | — | — | US | disclosed |
| US-20120049106-A1 | MALEIMIDE-FUNCTIONAL MONOMERS IN AMORPHOUS FORM | DESIGNER MOLECULES, INC. (US) | 2012-03-01 | — | — | US | disclosed |
| US-20120029117-A1 | ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY | CHEIL INDUSTRIES, INC. (KR) | 2012-02-02 | — | — | US | disclosed |
| EP-2389406-A1 | HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES | Dow Global Technologies LLC (US) | 2011-11-30 | — | — | EP | disclosed |
| EP-2385969-A1 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS | Dow Global Technologies LLC (US) | 2011-11-16 | — | — | EP | disclosed |
| EP-2385974-A1 | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION PROCESS | Dow Global Technologies LLC (US) | 2011-11-16 | — | — | EP | disclosed |
| EP-2385970-A1 | METAL STABILIZERS FOR EPOXY RESINS | Dow Global Technologies LLC (US) | 2011-11-16 | — | — | EP | disclosed |
| EP-1682461-B1 | SIZING COMPOSITION FOR AN INSULATING PRODUCT BASED ON MINERAL WOOL, AND RESULTING PRODUCTS | SAINT GOBAIN ISOVER (FR) | 2011-11-09 | — | — | EP | disclosed |
| US-20110263754-A1 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-10-27 | — | — | US | disclosed |
| US-20110253271-A1 | HIGH-STRENGTH STEEL PLATE AND PRODUCING METHOD THEREFOR | NIPPON STEEL CORPORATION (JP) | 2011-10-20 | — | — | US | disclosed |
| US-20110257299-A1 | METAL STABILIZERS FOR EPOXY RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-10-20 | — | — | US | disclosed |
| US-8040958-B2 | Method for measuring correlation between frequency response functions | HONDA MOTOR CO., LTD (JP) | 2011-10-18 | — | — | US | disclosed |
| US-20110247756-A1 | HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-10-13 | — | — | US | disclosed |
| WO-2011116050-A2 | CURING AGENTS FOR EPOXY RESINS | DESIGNER MOLECULES, INC. (US) | 2011-09-22 | — | — | WO | disclosed |
| US-20110224329-A1 | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION PROCESS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-09-15 | — | — | US | disclosed |
| US-8013104-B2 | Thermosetting hyperbranched compositions and methods for use thereof | DESIGNER MOLECULES, INC. (US) | 2011-09-06 | — | — | US | disclosed |
| US-20110160327-A1 | ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY FOAM APPLICATIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2011-06-30 | — | — | US | disclosed |
| US-20110160339-A1 | ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM | CHEIL INDUSTRIES, INC. (KR) | 2011-06-30 | — | — | US | disclosed |
| US-20110152466-A1 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2011-06-23 | — | — | US | disclosed |
| US-20110129689-A2 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2011-06-02 | — | — | US | disclosed |
| WO-2011059633-A2 | POLYOXAZOLIDONE RESINS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2011-05-19 | — | — | WO | disclosed |
| US-20110028602-A1 | EPOXY-IMIDAZOLE CATALYSTS USEFUL FOR POWDER COATING APPLICATIONS | DOW DEUTSCHLAND GMBH & CO. OHG (DE) | 2011-02-03 | — | — | US | disclosed |
| US-20110019307-A1 | METHOD FOR PRODUCING MAGNETIC RECORDING MEDIUM, MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING/REPRODUCING APPARATUS | SHOWA DENKO K.K. (JP) | 2011-01-27 | — | — | US | disclosed |
| WO-2011005925-A1 | CORE/SHELL RUBBERS FOR USE IN ELECTRICAL LAMINATE COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2011-01-13 | — | — | WO | disclosed |
| EP-2268697-A1 | EPOXY-IMIDAZOLE CATALYSTS USEFUL FOR POWDER COATING APPLICATIONS | Dow Global Technologies Inc. (US) | 2011-01-05 | — | — | EP | disclosed |
| US-20100316889-A1 | CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE CURABLE COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-12-16 | — | — | US | disclosed |
| US-20100258983-A1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIALS AND METHOD FOR FORMING MICROPATTERN USING THE COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-14 | — | — | US | disclosed |
| US-20100240816-A1 | EPOXY RESIN COMPOSITION CONTAINING ISOCYANURATES FOR USE IN ELECTRICAL LAMINATES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-09-23 | — | — | US | disclosed |
| US-20100227090-A1 | NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS | DOW GLOBAL TECHNOLOGIES LLC | 2010-09-09 | — | — | US | disclosed |
| EP-2218724-A1 | EPOXY GROUP-CONTAINING ORGANOSILOXANE COMPOUND, CURABLE COMPOSITION FOR TRANSFER MATERIAL, AND FINE PATTERN FORMING METHOD USING THE COMPOSITION | Showa Denko K.K. (JP) | 2010-08-18 | — | — | EP | disclosed |
| US-20100193725-A1 | THERMOSET DAMPENER MATERIAL | BLUE CUBE IP LLC | 2010-08-05 | — | — | US | disclosed |
| EP-2207827-A1 | EPOXY RESIN COMPOSITION CONTAINING ISOCYANURATES FOR USE IN ELECTRICAL LAMINATES | Dow Global Technologies Inc. (US) | 2010-07-21 | — | — | EP | disclosed |
| WO-2010078690-A1 | METAL STABILIZERS FOR EPOXY RESINS AND DISPERSION PROCESS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-07-15 | — | — | WO | disclosed |
| WO-2010078689-A1 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-07-15 | — | — | WO | disclosed |
| WO-2010078688-A1 | METAL STABILIZERS FOR EPOXY RESINS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-07-15 | — | — | WO | disclosed |
| EP-2205653-A2 | NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS | Dow Global Technologies Inc. (US) | 2010-07-14 | — | — | EP | disclosed |
| WO-2010075006-A1 | HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-07-01 | — | — | WO | disclosed |
| US-20100151138-A1 | ISOCYANATE-EPOXY FORMULATIONS FOR IMPROVED CURE CONTROL | DOW GLOBAL TECHNOLOGIES LLC | 2010-06-17 | — | — | US | disclosed |
| US-20100144965-A1 | EPOXY THERMOSET COMPOSITIONS COMPRISING EXCESS EPOXY RESIN AND PROCESS FOR THE PREPARATION THEREOF | DOW GLOBAL TECHNOLOGIES LLC | 2010-06-10 | — | — | US | disclosed |
| US-20100144977-A1 | CURING AGENTS FOR EPOXY RESINS | DESIGNER MOLECULES, INC. (US) | 2010-06-10 | — | — | US | disclosed |
| EP-2193153-A1 | ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY FOAM APPLICATIONS | Dow Global Technologies Inc. (US) | 2010-06-09 | — | — | EP | disclosed |
| US-20100119854-A1 | PRIMER COMPOSITION FOR ACRYLIC ADHESIVE, BONDING METHOD AND ASSEMBLY | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2010-05-13 | — | — | US | disclosed |
| US-20100097715-A1 | NANOIMPRINTING RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-04-22 | — | — | US | disclosed |
| EP-2176355-A1 | THERMOSET DAMPENER MATERIAL | Dow Global Technologies Inc. (US) | 2010-04-21 | — | — | EP | disclosed |
| WO-2010019832-A2 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-02-18 | — | — | WO | disclosed |
| US-20100041845-A1 | HETERO-FUNCTIONAL COMPOUNDS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-02-18 | — | — | US | disclosed |
| US-20100041803-A1 | THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2010-02-18 | — | — | US | disclosed |
| US-20100041832-A1 | FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS | DESIGNER MOLECULES, INC. (US) | 2010-02-18 | — | — | US | disclosed |
| EP-2152773-A1 | ISOCYANATE-EPOXY FORMULATIONS FOR IMPROVED CURE CONTROL | Dow Global Technologies Inc. (US) | 2010-02-17 | — | — | EP | disclosed |
| EP-2147034-A1 | EPOXY THERMOSET COMPOSITIONS COMPRISING EXCESS EPOXY RESIN AND PROCESS FOR THE PREPARATION THEREOF | Dow Global Technologies Inc. (US) | 2010-01-27 | — | — | EP | disclosed |
| WO-2009129088-A1 | EPOXY-IMIDAZOLE CATALYSTS USEFUL FOR POWDER COATING APPLICATIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2009-10-22 | — | — | WO | disclosed |
| EP-2094759-A1 | EPOXY RESINS COMPRISING A CYCLOALPHATIC DIAMINE CURING AGENT | Dow Global Technologies Inc. (US) | 2009-09-02 | — | — | EP | disclosed |
| US-20090162650-A1 | Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-06-25 | — | — | US | disclosed |
| US-20090141472-A1 | Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-06-04 | — | — | US | disclosed |
| US-20090136748-A1 | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-05-28 | — | — | US | disclosed |
| WO-2009058715-A2 | NON-SINTERING ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY APPLICATIONS | DOW GLOBAL TECHNOLOGY INC. (US) | 2009-05-07 | — | — | WO | disclosed |
| US-20090110940-A1 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-04-30 | — | — | US | disclosed |
| WO-2009055666-A1 | EPOXY RESIN COMPOSITION CONTAINING ISOCYANURATES FOR USE IN ELECTRICAL LAMINATES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2009-04-30 | — | — | WO | disclosed |
| WO-2009035860-A1 | ISOCYANATE MODIFIED EPOXY RESIN FOR FUSION BONDED EPOXY FOAM APPLICATIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2009-03-19 | — | — | WO | disclosed |
| WO-2009018194-A1 | THERMOSET DAMPENER MATERIAL | DOW GLOBAL TECHNOLOGIES INC. (US) | 2009-02-05 | — | — | WO | disclosed |
| WO-2008147641-A1 | ISOCYANATE-EPOXY FORMULATIONS FOR IMPROVED CURE CONTROL | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-12-04 | — | — | WO | disclosed |
| WO-2008140906-A1 | EPOXY THERMOSET COMPOSITIONS COMPRISING EXCESS EPOXY RESIN AND PROCESS FOR THE PREPARATION THEREOF | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| WO-2008064115-A1 | EPOXY RESINS COMPRISING A CYCLOALIPHATIC DIAMINE CURING AGENT | DOW GLOBAL TECHNOLOGIES INC. (US) | 2008-05-29 | — | — | WO | disclosed |
| US-20070077425-A1 | Sizing composition for an insulating product based on mineral wool, and resulting products | SAINT-GOBAIN ISOVER (FR) | 2007-04-05 | — | — | US | disclosed |
| US-20070023288-A1 | Method of forming multi-layered coating film | KANSAI PAINT CO., LTD. (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1682461-A1 | SIZING COMPOSITION FOR AN INSULATING PRODUCT BASED ON MINERAL WOOL, AND RESULTING PRODUCTS | SAINT-GOBAIN ISOVER (FR) | 2006-07-26 | — | — | EP | disclosed |
| WO-2005044750-A1 | SIZING COMPOSITION FOR AN INSULATING PRODUCT BASED ON MINERAL WOOL, AND RESULTING PRODUCTS | SAINT-GOBAIN ISOVER (FR) | 2005-05-19 | — | — | WO | disclosed |
| US-6713143-B2 | FOR USE IN PRINTED CIRCUIT BOARD; ELECTRONICS | TOMEGAWA PAPER CO., LTD. (JP) | 2004-03-30 | — | — | US | disclosed |
| US-6492030-B1 | SILOXANE DENATURED POLYIMIDE, DI- OR TRIALLYL COMPOUND AND DIMALEIMIDE COMPOUND; ADHERES TO METALS WITH LOW DIELECTRIC CONSTANT AND DISSIPATION FACTOR; FASTER SIGNAL PROCESSING; HIGH FREQUENCY ELECTRONICS WITH MINIATURIZED CIRCUITS | TOMOEGAWA PAPER CO., LTD. (JP) | 2002-12-10 | — | — | US | disclosed |
| US-20020106521-A1 | Thermosetting low-dielectric resin composition and use thereof | HASHIMOTO TAKESHI (JP) | 2002-08-08 | — | — | US | disclosed |
| US-6346598-B1 | SILOXANE MODIFIED POLYIMIDES WITH METHALLYL GROUPS | TOMOEGAWA PAPER CO., LTD. (JP) | 2002-02-12 | — | — | US | disclosed |
| US-6194490-B1 | MIXTURES OF EPOXIDES WITH ANHYDRIDES AND CURING | VANTICO, INC. | 2001-02-27 | — | — | US | disclosed |
| EP-1058702-A1 | CURABLE COMPOSITION COMPRISING EPOXIDISED NATURAL OILS | Vantico AG (CH) | 2000-12-13 | — | — | EP | disclosed |
| WO-1999043729-A1 | CURABLE COMPOSITION COMPRISING EPOXIDISED NATURAL OILS | VANTICO AG (CH) | 1999-09-02 | — | — | WO | disclosed |
| EP-0747399-B1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO LTD (JP) | 1999-06-16 | — | — | EP | disclosed |
| US-5863988-A | OXIDATION RESISTANT CURABLE ADHESIVE COMPRISING A DISSOLVED ACRYLONITRILE-BUTADIENE COPOLYMER, A PHENOLIC RESIN, A DIAMINE, DIMALEIMIDE COMPOUND AND/OR A POLYSILOXANE; FREE FROM GENERATING GAS, CURING AT LOW TEMPERATURE | TOMOEGAWA PAPER CO., LTD. (JP) | 1999-01-26 | — | — | US | disclosed |
| EP-0867480-A2 | Cationically electrodepositable coating composition | KANSAI PAINT CO., LTD. (JP) | 1998-09-30 | — | — | EP | disclosed |
| EP-0649892-B1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO LTD (JP) | 1998-06-03 | — | — | EP | disclosed |
| EP-0649893-B1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO LTD (JP) | 1998-05-20 | — | — | EP | disclosed |
| EP-0651040-B1 | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same | TOMOEGAWA PAPER CO LTD (JP) | 1997-12-29 | — | — | EP | disclosed |
| US-5614316-A | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-03-25 | — | — | US | disclosed |
| US-5609956-A | (PIPERAZINYLETHYLAMINO)CARBONYL-CONTAINING ACRYLONITRILE-BUTADIENE COPOLYMER, MALEIMIDE COMPOUND | TOMOEGAWA PAPER CO., LTD. (JP) | 1997-03-11 | — | — | US | disclosed |
| EP-0747399-A2 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1996-12-11 | — | — | EP | disclosed |
| JP-H08120162-A | HEAT-RESISTANT DROPWISE IMPREGNATION RESIN | MEIDENSHA CORP | 1996-05-14 | — | — | JP | disclosed |
| JP-H08109240-A | HEAT-RESISTANT RESIN FOR IMPREGNATION BY DROPPING | MEIDENSHA CORP | 1996-04-30 | — | — | JP | disclosed |
| JP-H08109316-A | HEAT-RESISTANT DRIP IMPREGNATING RESIN | MEIDENSHA CORP | 1996-04-30 | — | — | JP | disclosed |
| US-5512628-A | COMBINING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER WITH A MALEIMIDE CONTAINING COMPOUND IN AN ORGANIC SOLVENT; CURABLE | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-04-30 | — | — | US | disclosed |
| US-5510189-A | COMPRISING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER AND A MALEIMIDE COMPOUND; ADHERED AND CURED AT LOW TEMPERATURE; HEAT RESISTANCE | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-04-23 | — | — | US | disclosed |
| US-5500294-A | MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-03-19 | — | — | US | disclosed |
| US-5494757-A | BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN | TOMOEGAWA PAPER CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| US-5446080-A | Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound | TOMOEGAWA PAPER CO., LTD. (JP) | 1995-08-29 | — | — | US | disclosed |
| EP-0651040-A1 | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-05-03 | — | — | EP | disclosed |
| EP-0649893-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0649892-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0478606-B1 | Process for the preparation of epoxy-terminated polyoxazolidones and of electrical laminates therefrom | DOW CHEMICAL CO (US) | 1994-12-14 | — | — | EP | disclosed |
| EP-0478606-A4 | EPOXY-TERMINATED POLYOXAZOLIDONES, PROCESS OF PREPARATION, AND ELECTRICAL LAMINATES THEREFROM | — | 1992-05-13 | — | — | EP | disclosed |
| US-5112932-A | Reaction of a polyisocyanate compound with a polyepoxide compound in the presence of a catalyst | THE DOW CHEMICAL COMPANY (US) | 1992-05-12 | — | — | US | disclosed |
| EP-0478606-A1 | Process for the preparation of epoxy-terminated polyoxazolidones and of electrical laminates therefrom. | DOW CHEMICAL CO (US) | 1992-04-08 | — | — | EP | disclosed |
| WO-1990015089-A1 | EPOXY-TERMINATED POLYOXAZOLIDONES, PROCESS OF PREPARATION, AND ELECTRICAL LAMINATES THEREFROM | THE DOW CHEMICAL COMPANY (US) | 1990-12-13 | — | — | WO | disclosed |
| JP-S63221172-A | COVER COAT COMPOSITION FOR PRINTED-WIRING BOARD | FUJIKURA LTD | 1988-09-14 | — | — | JP | disclosed |
| JP-S63105080-A | EPOXY RESIN INK COMPOSITION AND PRODUCTION THEREOF | SHIKOKU CHEM CORP | 1988-05-10 | — | — | JP | disclosed |
| US-4658009-A | Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-04-14 | — | — | US | disclosed |
| EP-0126531-A3 | 4,4'-METHYLENE-BIS-(2-ETHYL-5-METHYL IMIDAZOLE) AND METHODS OF PRODUCING AND USING THE SAME | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-01-14 | — | — | EP | disclosed |
| EP-0126531-A3 | 4,4'-METHYLENE-BIS-(2-ETHYL-5-METHYL IMIDAZOLE) AND METHODS OF PRODUCING AND USING THE SAME | SHIKOKU CHEMICALS CORPORATION (JP) | 1987-01-14 | — | — | EP | disclosed |
| EP-0194895-A2 | 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-09-17 | — | — | EP | disclosed |
| US-4593069-A | Containing 2-vinyl-4,6-diamino-s-triazine or adduct thereof with isocyanuric acid | SHIKOKU CHEMICALS CORP. (JP) | 1986-06-03 | — | — | US | disclosed |
| EP-0166588-A1 | Epoxy resin composition | SHIKOKU CHEMICALS CORPORATION (JP) | 1986-01-02 | — | — | EP | disclosed |
| JP-S60252466-A | METHOD OF PREVENTION OF CRYSTALLIZATION OF 2-ETHYL-4-METHYLIMIDAZOLE | SHIKOKU CHEM CORP | 1985-12-13 | — | — | JP | disclosed |
| JP-S60226522-A | EPOXY RESIN COMPOSITION | SHIKOKU CHEM CORP | 1985-11-11 | — | — | JP | disclosed |
| US-4514556-A | REACTION OF 2-ETHYL-4-METHYL IMIDAZOLE WITH CATALYST AND FORMALDEHYDE OR METHYLENIZING AGENT, CURING AGENT FOR EPOXY RESIN | SHIKOKU CHEMICALS CORPORATION (JP) | 1985-04-30 | — | — | US | disclosed |
| US-4514556-A | REACTION OF 2-ETHYL-4-METHYL IMIDAZOLE WITH CATALYST AND FORMALDEHYDE OR METHYLENIZING AGENT, CURING AGENT FOR EPOXY RESIN | SHIKOKU CHEMICALS CORPORATION (JP) | 1985-04-30 | — | — | US | disclosed |
| US-4514556-A | REACTION OF 2-ETHYL-4-METHYL IMIDAZOLE WITH CATALYST AND FORMALDEHYDE OR METHYLENIZING AGENT, CURING AGENT FOR EPOXY RESIN | SHIKOKU CHEMICALS CORPORATION (JP) | 1985-04-30 | — | — | US | disclosed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | disclosed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | disclosed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | disclosed |
| EP-0126531-A2 | 4,4'-Methylene-bis-(2-ethyl-5-methyl imidazole) and methods of producing and using the same | SHIKOKU CHEMICALS CORPORATION (JP) | 1984-11-28 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (14 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20160362412-A1 | IDO Inhibitors | IDO1, IDO2, INMT | ADORA1 1237/4885ADORA3 1059/4885ADORA2A 540/4885 |
| US-20180118753-A1 | IDO Inhibitors | IDO1, IDO2, INMT | ADORA1 1237/4885ADORA3 1059/4885ADORA2A 540/4885 |
| US-11872212-B2 | Self-healing organic crystals | DNAJA1, DNAJA3, LIG4 | ADORA1 3910/4885ADORA3 3001/4885ADORA2A 3409/4885 |
| US-20190225618-A1 | IDO Inhibitors | IDO1, IDO2, INMT | ADORA1 1192/4885ADORA3 1007/4885ADORA2A 491/4885 |
| US-20100041845-A1 | HETERO-FUNCTIONAL COMPOUNDS AND METHODS FOR USE THEREOF | C9, C3AR1, C1S | ADORA1 2834/4885ADORA3 2299/4885ADORA2A 2707/4885 |
| US-20100041832-A1 | FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS | PFAS, FDFT1, AOX1 | ADORA1 4170/4885ADORA3 3484/4885ADORA2A 4755/4885 |
| US-20130012620-A1 | CURING AGENTS FOR EPOXY RESINS | DOT1L, EHMT1, ASH1L | ADORA1 1291/4885ADORA3 2396/4885ADORA2A 3913/4885 |
| US-10233190-B2 | IDO inhibitors | IDO1, IDO2, INMT | ADORA1 1237/4885ADORA3 1059/4885ADORA2A 540/4885 |
| US-20140066625-A1 | Fused Imidazole Derivatives Useful as IDO Inhibitors | IDO1, IDO2, INMT | ADORA1 2637/4885ADORA3 2035/4885ADORA2A 823/4885 |
| US-20230051178-A1 | Self-Healing Organic Crystals | DNAJA1, DNAJA3, LIG4 | ADORA1 3910/4885ADORA3 3001/4885ADORA2A 3409/4885 |
| US-20110152466-A1 | AMIDE-EXTENDED CROSSLINKING COMPOUNDS AND METHODS FOR USE THEREOF | ACMSD, AAAS, NAAA | ADORA1 3318/4885ADORA3 3046/4885ADORA2A 3296/4885 |
| US-20100144977-A1 | CURING AGENTS FOR EPOXY RESINS | PTGER3, PTGER4, ELL | ADORA1 1941/4885ADORA3 1192/4885ADORA2A 3048/4885 |
| US-20160002249-A1 | Fused Imidazole Derivatives Useful as IDO Inhibitors | IDO1, IDO2, INMT | ADORA1 2211/4885ADORA3 1858/4885ADORA2A 832/4885 |
| US-20100041803-A1 | THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF | PAICS, PUF60, PARG | ADORA1 1880/4885ADORA3 1272/4885ADORA2A 1788/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.