SCHEMBL443991

SCHEMBL443991

NC(=O)n1nnc2ccccc21

nearest known ligand 0.64

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ GAA P10253 11/20 0.64
▸ MGAM O43451 10/20 0.64
▸ AMY1A P0DUB6 10/20 0.64
▸ SI P14410 10/20 0.64
▸ MGAM2 Q2M2H8 10/20 0.64
▸ KMT2A Q03164 3/20 0.64
▸ F2 P00734 2/20 0.64
▸ HPGD P15428 1/20 0.64
▸ SLC9A1 P19634 1/20 0.64
▸ DGAT1 O75907 1/20 0.61
▸ KCNMA1 Q12791 1/20 0.58
▸ F12 P00748 7/20 0.57
▸ KDM4E B2RXH2 1/20 0.54
▸ ALDH1A1 P00352 1/20 0.54
▸ MAPT P10636 1/20 0.54
▸ HTT P42858 1/20 0.54
▸ NPSR1 Q6W5P4 1/20 0.54
▸ MIF P14174 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4250719 0.84 GAA (0.68) GAAMGAMAMY1ASIMGAM2
SCHEMBL706083 0.84 MGAM (0.68) GAAMGAMAMY1ASIMGAM2
SCHEMBL170673 0.82 GAA (0.71) GAAMGAMAMY1ASIMGAM2
SCHEMBL1756653 0.82 DGAT1 (0.69) GAAMGAMAMY1ASIMGAM2
SCHEMBL2583961 0.82 SLC9A1 (0.54) GAAMGAMAMY1ASIMGAM2
SCHEMBL1520814 0.81 DGAT1 (0.72) GAAMGAMAMY1ASIMGAM2
SCHEMBL427058 0.81 GAA (0.64) GAAMGAMAMY1ASIMGAM2
SCHEMBL10621117 0.81 GAA (0.64) GAAMGAMAMY1ASIMGAM2
SCHEMBL3840404 0.81 GAA (0.69) GAAMGAMAMY1ASIMGAM2
Ammonia Solution, Strong SCHEMBL3505685 0.81 GAA (0.69) GAAMGAMAMY1ASIMGAM2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12550694-B2 Selective deposition for integrated circuit interconnect structures TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2026-02-10 — — US claimed
US-12278143-B2 Method of providing a workpiece including low resistance interconnect low-resistance interconnect TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2025-04-15 — — US claimed
US-20240258166-A1 SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2024-08-01 — — US claimed
CN-115948067-B Functional filler, self-repairing anticorrosive paint and preparation method 国网山东省电力公司电力科学研究院 2023-12-08 — — CN claimed
US-20230369114-A1 Low-Resistance Interconnect TAIWAN SEMICONDUCTOR MANUFACTORING CO., LTD (TW) 2023-11-16 — — US claimed
CN-115948067-A Functional filler, self-repairing anticorrosive coating and preparation method 国网山东省电力公司电力科学研究院 2023-04-11 — — CN claimed
US-20220277996-A1 SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) 2022-09-01 — — US claimed
CN-113337204-B Antifriction paint 米巴滑动轴承奥地利有限公司 2022-06-28 — — CN claimed
US-20220144884-A1 METHOD FOR PRODUCING AMIDE TOKYO INSTITUTE OF TECHNOLOGY (JP) 2022-05-12 — — US claimed
EP-3932933-A1 METHOD FOR PRODUCING AMIDE Tokyo Institute of Technology (JP) 2022-01-05 — — EP claimed
CN-113474354-A Process for producing amide 国立大学法人东京工业大学 2021-10-01 — — CN claimed
CN-111441058-A Descaling rust-removing corrosion-inhibition prefilming agent and preparation method and application thereof 北京可林维尔化工有限公司 2020-07-24 — — CN claimed
CN-109476918-A Elastomer composition and use thereof 美国陶氏有机硅公司 2019-03-15 — — CN claimed
CN-105670181-A Radiation-resistant and folding-resistant cable and preparation method thereof 苏州科茂电子材料科技有限公司 2016-06-15 — — CN claimed
CN-102037157-B Adhesion promotion of metal to laminate with a multi-functional compound ENTHONE 2014-05-28 — — CN claimed
EP-2274460-A1 ADHESION PROMOTION OF METAL TO LAMINATE WITH A MULTI-FUNCTIONAL COMPOUND HAFTFORDERUNG VON METALL ZU LAMINATEN MIT EINER MULTIFUNKTIONELLEN Enthone, Inc. (US) 2011-01-19 — — EP claimed
WO-2009117734-A1 ADHESION PROMOTION OF METAL TO LAMINATE WITH A MULTI-FUNCTIONAL COMPOUND HAFTFORDERUNG VON METALL ZU LAMINATEN MIT EINER MULTIFUNKTIONELLEN ENTHONE INC. (US) 2009-09-24 — — WO claimed
EP-2014797-A2 Coating composition for interconnection part of electrode and plasma display panel including the same Samsung SDI Co., Ltd. (KR) 2009-01-14 — — EP claimed
US-20080303439-A1 Coating composition for interconnection part of electrode and plasma display panel including the same SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA (KR) 2008-12-11 — — US claimed
EP-0057160-B1 2-(2-HYDROXYPHENYL)-BENZOTRIAZOLES, THEIR USE AS ULTRAVIOLET STABILIZERS AND THEIR PREPARATION CIBA-GEIGY AG (CH) 1985-06-19 — — EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12550694-B2 Selective deposition for integrated circuit interconnect structures CAPRIN1, PIEZO1, GJB2 GAA 4782/4885MGAM 3369/4885AMY1A 4427/4885
US-20220144884-A1 METHOD FOR PRODUCING AMIDE NAAA, ASNS, RIMKLA GAA 972/4885MGAM 849/4885AMY1A 272/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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