SCHEMBL444020

SCHEMBL444020

B.[H-].[Na+]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8599079 0.87
SCHEMBL208 0.82
SCHEMBL27354297 0.82
SCHEMBL3408563 0.82
SCHEMBL31122202 0.82
SCHEMBL3183687 0.67
SCHEMBL6659176 0.67
SCHEMBL9682639 0.67
Water SCHEMBL2647084 0.67
SCHEMBL127310 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 376 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022267945-A1 METHOD FOR PREPARING PRANOPROFEN AND COMPOSITION CONTAINING PRANOPROFEN AND IMPURITY 沈阳兴齐眼药股份有限公司 2022-12-29 WO claimed
CN-110339369-A The improved method for preparing physiological active polypeptide compound 韩美科学株式会社 2019-10-18 CN claimed
CN-105732659-B Nitro glyoxaline compound and preparation method thereof and the purposes in pharmacy 上海阳帆医药科技有限公司 2019-07-16 CN claimed
CN-106590069-B A kind of automatically cleaning hydrophobic titanium dioxide coating and preparation method thereof 华东理工大学 2019-07-12 CN claimed
CN-109970625-A A kind of preparation method of 5R- benzyloxy amino piperidine -2S- formic acid or derivatives thereof 新发药业有限公司 2019-07-05 CN claimed
CN-108822179-A Ursolic acid derivative and preparation method thereof and the application in preparation treatment MRSA infection medicine 江西农业大学 2018-11-16 CN claimed
CN-106866452-B A kind of synthetic method and intermediate product of Yi Dushaban intermediates 浙江天宇药业股份有限公司 2018-10-30 CN claimed
EP-2586768-B1 HYDROXY ACID ESTER OF PROPOFOL, PREPARATION METHOD AND MEDICAL USE WEST CHINA HOSPITAL SICHUAN UNIV (CN) 2018-06-27 EP claimed
CN-108055844-A The method for preparing cytotoxic benzodiazepine * derivatives 伊缪诺金公司 2018-05-18 CN claimed
CN-108026103-A Process for preparing cytotoxic benzodiazepine derivatives 伊缪诺金公司 2018-05-11 CN claimed
CN-1305559-C Super large pore ball shaped cellulose fixed tannin adsorbent and its preparation method and application HUADONG UNIVERSITY OF SCIENCE (CN) 2007-03-21 CN claimed
CN-1657157-A Super large pore ball shaped cellulose fixed tannin adsorbent and its preparation method and application UNIV HUADONG SCIENCE & ENG (CN) 2005-08-24 CN claimed
EP-0702099-B1 Electroless gold plating solution ELECTROPLATING ENG (JP) 1998-12-02 EP claimed
EP-0697469-B1 Electroless gold plating solution ELECTROPLATING ENG (JP) 1998-01-28 EP claimed
US-5614004-A THALLIUM COMPOUND ELECTROPLATING ENGINEERS OF JAPAN, LIMITED (JP) 1997-03-25 US claimed
US-5601637-A COMPRISING REDUCTION CONTROLLERS ELECTROPLATING ENGINEERS OF JAPAN, LIMITED (JP) 1997-02-11 US claimed
US-5560764-A REDUCING ALKALI METAL GOLD CYANIDE WITH BORON COMPOUND AS REDUCING AGENT IN PRESENCE OF ALKALI METAL HYDROXIDE AS PH ADJUSTER AND DIMETHYLAMINE AS AN ADDITIVE ELECTROPLATING ENGINEERS OF JAPAN, LIMITED (JP) 1996-10-01 US claimed
EP-0702099-A1 Electroless gold plating solution Electroplating Engineers of Japan Limited (JP) 1996-03-20 EP claimed
EP-0697469-A1 Electroless gold plating solution Electroplating Engineers of Japan Limited (JP) 1996-02-21 EP claimed
EP-0697470-A1 Electroless gold plating solution Electroplating Engineers of Japan Limited (JP) 1996-02-21 EP claimed