SCHEMBL4516955

SCHEMBL4516955

C=Cc1cccc2ccc(CC)cc12

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.48
CYP2A6 P11509 1/20 0.48
TYMS P04818 1/20 0.38
CNR2 P34972 4/20 0.37
MAPT P10636 4/20 0.35
HTT P42858 4/20 0.35
GAA P10253 3/20 0.35
ALDH1A1 P00352 3/20 0.35
KDM4E B2RXH2 3/20 0.35
USP2 O75604 2/20 0.35
ALOX12 P18054 2/20 0.35
HSD17B10 Q99714 2/20 0.35
ALOX15 P16050 1/20 0.35
SIGMAR1 Q99720 4/20 0.35
PSMD14 O00487 1/20 0.35
POLB P06746 1/20 0.35
SMN1; SMN2 Q16637 3/20 0.34
KIF11 P52732 1/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5033215 0.87 MEN1 (0.42) CYP1A2CYP2A6CNR2GAASIGMAR1
SCHEMBL4521095 0.86 CYP1A2 (0.48) CYP1A2CYP2A6MAPTHTTGAA
SCHEMBL1979135 0.83 PLAU (0.38) CYP1A2CYP2D6
SCHEMBL2517953 0.82 MTNR1A (0.35) TP53
SCHEMBL10384829 0.78 PTGS1 (0.39) CYP1A2CYP2A6MAPTGAASIGMAR1
SCHEMBL21244243 0.77 CYP1A2 (0.57) CYP1A2CYP2A6TYMSMAPTGAA
SCHEMBL3972895 0.75 TRPA1 (0.41) CYP1A2CYP2A6TYMSMAPTHTT
SCHEMBL19583369 0.74 CYP2A6 (0.58) CYP1A2CYP2A6TYMSMAPTHTT
Butane SCHEMBL9572169 0.74 SIRT2 (0.44) CYP2A6ALDH1A1KDM4E
SCHEMBL2443320 0.74 TYMS (0.42) CYP1A2CYP2A6TYMSMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF Kraton Corporation (US) 2026-02-05 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-12024590-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-07-02 US disclosed
US-12022611-B2 Prepreg, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-06-25 US disclosed
WO-2020017399-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-01-23 WO disclosed
CN-109385018-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-109385021-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-109385020-A A kind of compositions of thermosetting resin and prepreg and metal-clad laminate using its production 广东生益科技股份有限公司 2019-02-26 CN disclosed
CN-1914239-B Curable resin composition NIPPON STEEL CHEMICAL CO 2010-05-05 CN disclosed
US-7595362-B2 Curable resin composition NIPPON STEEL CHEMICAL CO., LTD. (JP) 2009-09-29 US disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed
US-20070129502-A1 Polyphenylene ethers; improved chemical resistance, dielectric, low water-absorption, heat resistance, flame retardance, and mechanical properties; laminates NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-06-07 US disclosed
CN-1914239-A Curable resin composition NIPPON STEEL CHEMICAL CO (JP) 2007-02-14 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF VCL, FGB, CDH1 CYP1A2 788/4885CYP2A6 2149/4885TYMS 3896/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 CYP1A2 2570/4885CYP2A6 1938/4885TYMS 2761/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD CYP1A2 1939/4885CYP2A6 3443/4885TYMS 4636/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.