SCHEMBL453413

SCHEMBL453413

CCCCCCCCS(=O)(=O)[O-].c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.39
CES1 P23141 1/20 0.39
PABPC1 P11940 1/20 0.39
EIF4H Q15056 1/20 0.39
CTDSP1 Q9GZU7 1/20 0.39
EPHX2 P34913 1/20 0.38
MMP1 P03956 1/20 0.38
MMP9 P14780 1/20 0.38
MMP13 P45452 1/20 0.38
NR1I2 O75469 1/20 0.38
PTGS2 P35354 1/20 0.38
FAAH O00519 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1664173 1.00 CES2 (0.39) CES2CES1PABPC1EIF4HCTDSP1
SCHEMBL217581 0.93 PABPC1 (0.41) CES2CES1PABPC1EIF4HCTDSP1
SCHEMBL3193355 0.93 MCHR1 (0.40) CES2CES1PABPC1EIF4HCTDSP1
SCHEMBL3203451 0.91 PABPC1 (0.37) PABPC1EIF4HCTDSP1MMP1MMP9
SCHEMBL1804914 0.91 ESR1 (0.43) PTGS2
SCHEMBL450157 0.89 MMP1 (0.38) MMP1MMP9MMP13
SCHEMBL2898670 0.89 MMP13 (0.42) PABPC1EIF4HCTDSP1EPHX2MMP1
SCHEMBL3199957 0.89 NR1I2 (0.40) NR1I2
SCHEMBL3190137 0.89 PTGS2 (0.41) PABPC1EIF4HCTDSP1MMP1MMP9
SCHEMBL6652819 0.86 CA12 (0.38) CES2CES1PABPC1EIF4HCTDSP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 307 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250383599-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND RESOLUTION YCCHEM CO LTD (KR) 2025-12-18 US claimed
EP-4607277-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION Ycchem Co., Ltd. (KR) 2025-08-27 EP claimed
US-20250199406-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND ENHANCING ADHESION YCCHEM CO., LTD. (KR) 2025-06-19 US claimed
EP-4369099-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR IMPROVING PATTERN PROFILE AND RESOLUTION Ycchem Co., Ltd. (KR) 2024-05-15 EP claimed
CN-110256655-A A kind of tannic acid Quito official's epoxy resin and preparation method thereof and preparation can liquid alkali developing negative photoresist 苏州瑞红电子化学品有限公司 2019-09-20 CN claimed
CN-105566552-B A kind of acrylate copolymer and its manufactured 248nm photoetching compositions 江南大学 2019-05-17 CN claimed
CN-109154776-A Chemical amplifying type negative photoresist composition 荣昌化学制品株式会社 2019-01-04 CN claimed
CN-109073973-A KrF laser negative photoresist composition with high-resolution and high aspect ratio 荣昌化学制品株式会社 2018-12-21 CN claimed
CN-108084331-A A kind of biology base film-forming resin and its photoresist of preparation 江南大学 2018-05-29 CN claimed
CN-107850841-A Negative photoresist composition for KrF laser for forming semiconductor pattern 荣昌化学制品株式会社 2018-03-27 CN claimed
CN-105566552-A Acrylate copolymer and 248nm photoresist composition made thereof UNIV JIANGNAN 2016-05-11 CN claimed
CN-102037409-B Orthogonal processing of organic materials used in electronic and electrical devices UNIV CORNELL 2013-12-11 CN claimed
US-8053158-B2 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-11-08 US claimed
CN-102037409-A Orthogonal processing of organic materials used in electronic and electrical devices UNIV CORNELL 2011-04-27 CN claimed
CN-100561344-C Have improve etch resistant properties fluoridize the photoresist material IBM (US) 2009-11-18 CN claimed
US-20070202436-A1 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-30 US claimed
EP-1669421-B1 Ink composition for a color filter, a color filter substrate manufactured using the ink composition and method of manufacturing a color filter substrate using the ink composition SAMSUNG ELECTRONICS CO LTD (KR) 2007-07-18 EP claimed
CN-1846169-A Negative resist composition with fluorosulfonamide-containing polymer IBM (US) 2006-10-11 CN claimed
CN-1782876-A Fluorinated photoresist materials with improved etch resistant properties IBM (US) 2006-06-07 CN claimed
CN-1637603-A Positive photoresist composition with a polymer including a fluorosulfonamide group and process for its use IBM (US) 2005-07-13 CN claimed