SCHEMBL462046

SCHEMBL462046

Cc1ccc(S(=O)(=O)ON2C(=O)c3ccc4ccccc4c3C2=O)cc1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
VDR P11473 2/20 0.68
KDM4E B2RXH2 10/20 0.63
ALDH1A1 P00352 10/20 0.63
HPGD P15428 7/20 0.63
MAPT P10636 10/20 0.54
KMT2A Q03164 8/20 0.54
MEN1 O00255 5/20 0.53
F2 P00734 4/20 0.52
HTT P42858 3/20 0.50
XBP1 P17861 2/20 0.48
LMNA P02545 2/20 0.47
THRB P10828 1/20 0.47
POLB P06746 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
SMN1; SMN2 Q16637 2/20 0.44
CYP1A2 P05177 1/20 0.44
CYP3A4 P08684 1/20 0.44
CYP2C19 P33261 1/20 0.44
NPSR1 Q6W5P4 1/20 0.44
HKDC1 Q2TB90 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL72297 0.90 ALDH1A1 (0.63) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL462228 0.89 KMT2A (0.66) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL547930 0.84 KMT2A (0.50) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL29370293 0.82 VDR (1.00) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL64277 0.82 VDR (1.00) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL65319 0.81 MAPT (0.47) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL548394 0.81 ALDH1A1 (0.47) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL14099607 0.79 VDR (0.76) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL60581 0.79 KMT2A (0.45) VDRKDM4EALDH1A1HPGDMAPT
SCHEMBL14650923 0.78 VDR (0.57) VDRKDM4EALDH1A1HPGDMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 209 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
EP-4375750-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE ADEKA CORPORATION (JP) 2024-05-29 EP disclosed
EP-3010943-B1 CURABLE COMPOSITION, FILM, AND METHOD OF PRODUCING FILM CANON KK (JP) 2024-04-03 EP disclosed
US-11592605-B2 Color developing structure having concave-convex layer, method for producing such structure, and display TOPPAN PRINTING CO., LTD. (JP) 2023-02-28 US disclosed
WO-2023002928-A1 FILM-FORMING MATERIAL FOR SEMICONDUCTOR, MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, PROCESS MEMBER-FORMING MATERIAL FOR SEMICONDUCTOR, UNDERLAYER FILM-FORMING MATERIAL, UNDERLAYER FILM, AND SEMICONDUCTOR DEVICE 株式会社ADEKA 2023-01-26 WO disclosed
US-11332597-B2 Photo-curable composition and patterning method using the same CANON KABUSHIKI KAISHA (JP) 2022-05-17 US disclosed
US-11249398-B2 Method for producing plated shaped structure and photosensitive resin composition for production of plated shaped structures JSR CORPORATION (JP) 2022-02-15 US disclosed
CN-107207456-B Latent acids and their use 巴斯夫欧洲公司 2021-05-04 CN disclosed
EP-3253735-B1 LATENT ACIDS AND THEIR USE BASF SE (DE) 2021-03-31 EP disclosed
WO-2021039799-A1 CURABLE COMPOSITION 株式会社日本触媒 2021-03-04 WO disclosed
US-5962180-A COMPRISING (A) A COPOLYMER COMPRISING RECURRING UNITS OF A P-HYDROXYSTYRENE UNIT AND A STYRENE UNIT HAVING AN ACETAL GROUP OR A KETAL GROUP AT THE P-POSITION, (B) A COPOLYMER COMPRISING RECURRING UNITS OF A T-BUTYL (METH)ACRYLATE UNIT JSR CORPORATION (JP) 1999-10-05 US disclosed
EP-0898201-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-02-24 EP disclosed
EP-0843220-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-20 EP disclosed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 US disclosed
EP-0793144-A2 Radiation sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-09-03 EP disclosed
EP-0660187-B1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1997-03-05 EP disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed
EP-0058638-B1 CURABLE COMPOSITIONS CONTAINING AN ACID-CURABLE RESIN, AND PROCESS FOR CURING THEM CIBA-GEIGY AG (CH) 1985-08-28 EP disclosed
EP-0058638-A2 Curable compositions containing an acid-curable resin, and process for curing them CIBA-GEIGY AG (CH) 1982-08-25 EP disclosed