SCHEMBL498582

SCHEMBL498582

COC(CC(=O)O)C(C)C

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.38
TDP1 Q9NUW8 1/20 0.36
CACNA2D1 P54289 2/20 0.35
CACNB3 P54284 1/20 0.35
CACNA1C Q13936 1/20 0.35
PGR P06401 1/20 0.35
ADRA1A P35348 1/20 0.35
HTR2B P41595 1/20 0.35
CACNA2D2 Q9NY47 1/20 0.35
SMN1; SMN2 Q16637 3/20 0.35
MMP1 P03956 1/20 0.34
MMP2 P08253 1/20 0.34
MMP3 P08254 1/20 0.34
MMP9 P14780 1/20 0.34
MMP13 P45452 1/20 0.34
ALOX15 P16050 1/20 0.33
MAPT P10636 1/20 0.33
MMP12 P39900 1/20 0.33
GABRR1 P24046 2/20 0.32
LMNA P02545 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15987193 0.83 SLC22A6 (0.42) SLC22A6TDP1CACNA2D1CACNB3CACNA1C
SCHEMBL886928 0.83 SLC22A6 (0.42) SLC22A6TDP1CACNA2D1CACNB3CACNA1C
SCHEMBL28772970 0.81 GABRP (0.38) SLC22A6TDP1CACNA2D1CACNB3CACNA1C
SCHEMBL12729926 0.80 ALDH1A1 (0.48) TDP1SMN1; SMN2MMP1MMP2MMP3
SCHEMBL13424255 0.78 SLC22A6 (0.42) SLC22A6TDP1SMN1; SMN2ALOX15MAPT
SCHEMBL25946703 0.75 MMP1 (0.39) SLC22A6TDP1CACNA2D1CACNB3CACNA1C
SCHEMBL18327240 0.75 PGD (0.35) SLC22A6TDP1CACNA2D1CACNB3CACNA1C
SCHEMBL20543906 0.75 SLC22A6 (0.39) SLC22A6TDP1SMN1; SMN2MAPTGABRR1
SCHEMBL10827451 0.74 CACNA2D1 (0.46) CACNA2D1CACNB3CACNA1CPGRADRA1A
SCHEMBL8752294 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115707794-A Surface-binding agent and method for treating substrate surface 柏群科技有限公司 2023-02-21 CN disclosed
US-20230011185-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-12 US disclosed
CN-115315783-A Laminate, method for producing laminate, and method for producing semiconductor substrate 东京应化工业株式会社 2022-11-08 CN disclosed
US-11120993-B2 Diffusing agent composition and method of manufacturing semiconductor substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2021-09-14 US disclosed
US-10961422-B2 Surface treatment liquid, surface treatment method, and method for suppressing pattern collapse TOKYO OHKA KOGYO CO., LTD. (JP) 2021-03-30 US disclosed
US-20200373162-A1 DIFFUSING AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-26 US disclosed
US-10720321-B2 Substrate treating method and semiconductor device manufacturing method TOSHIBA MEMORY CORPORATION (JP) 2020-07-21 US disclosed
US-20200075315-A1 SUBSTRATE TREATING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD TOSHIBA MEMORY CORPORATION (JP) 2020-03-05 US disclosed
US-10541138-B2 Diffusing agent composition and method of manufacturing semiconductor substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2020-01-21 US disclosed
US-10504732-B2 Impurity diffusion agent composition and method for manufacturing semiconductor substrate TOKYO OHKA KOGYO CO, LTD. (JP) 2019-12-10 US disclosed
EP-1761823-A1 METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN TOKYO OHKA KOGYO CO., LTD. (JP) 2007-03-14 EP disclosed
WO-2006059757-A2 PROCESS FOR PRODUCING RESIST PATTERN AND CONDUCTOR PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-06-08 WO disclosed
WO-2006003757-A1 METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-01-12 WO disclosed
US-6641628-B1 Plastic particles are acrylonitrile/polyethylene chloride/styrene resin particles TOKYO OHKA KOGYO CO., LTD. (JP) 2003-11-04 US disclosed
EP-0890417-B1 Method for sandblast processing plasma display panel substrate using a plastic abrasive TOKYO OHKA KOGYO CO LTD (JP) 2003-05-07 EP disclosed
US-6368195-B1 Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 2002-04-09 US disclosed
US-6268108-B1 MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT TOKYO OHKA KOGYO CO., LTD. (JP) 2001-07-31 US disclosed
US-6126513-A Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 2000-10-03 US disclosed
US-6071673-A Method for the formation of resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2000-06-06 US disclosed
EP-0890417-A1 Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 1999-01-13 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10504732-B2 Impurity diffusion agent composition and method for manufacturing semiconductor substrate SLC43A1, SAMHD1, SNRPD2 SLC22A6 185/4885TDP1 943/4885CACNA2D1 3564/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.