SCHEMBL5087773

SCHEMBL5087773

O=Cc1cccc(C(=O)Oc2ccccc2)c1O

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 4/20 0.57
HPGD P15428 3/20 0.57
ALOX15 P16050 2/20 0.57
MAPT P10636 5/20 0.54
KDM4E B2RXH2 2/20 0.54
TDP1 Q9NUW8 1/20 0.54
ALDH1A1 P00352 2/20 0.47
NSD2 O96028 1/20 0.46
KMT2A Q03164 3/20 0.46
LMNA P02545 2/20 0.46
GAA P10253 2/20 0.46
ERN1 O75460 3/20 0.46
SMN1; SMN2 Q16637 2/20 0.45
TP53 P04637 1/20 0.45
CYP3A4 P08684 1/20 0.45
ADORA3 P0DMS8 1/20 0.45
CHRM1 P11229 1/20 0.45
TBXA2R P21731 1/20 0.45
SLC6A2 P23975 1/20 0.45
PDE4A P27815 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL733386 0.86 HSD17B10 (0.59) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL5712255 0.84 HSD17B10 (0.71) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL2148269 0.83 HSD17B10 (0.53) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL2148267 0.83 HSD17B10 (0.53) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL14337136 0.81 MAPT (0.51) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL6144656 0.80 HSD17B10 (0.61) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL4387913 0.80 HSD17B10 (0.76) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL7195201 0.78 KDM4E (0.58) HSD17B10MAPTKDM4EALDH1A1LMNA
SCHEMBL70411 0.78 HSD17B10 (0.61) HSD17B10HPGDALOX15MAPTKDM4E
SCHEMBL70410 0.78 HSD17B10 (0.61) HSD17B10HPGDALOX15MAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0947532-B1 Epoxy resin composition for printed circuit board and printed circuit board using the same HITACHI CHEMICAL CO LTD (JP) 2006-01-18 EP claimed
US-6462147-B1 INCLUDES AN EPOXY RESIN; A MULTI-FUNCTIONAL PHENOL GROUP; A HARDENING ACCELERATOR; AND AT LEAST ONE OF A COMPOUND HAVING A TRIAZINE OR ISOCYANURATE RING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-10-08 US claimed
CN-100528949-C Low heat release and low smoke reinforcing fiber/epoxy composites SUPRESTA LLC (US) 2009-08-19 CN disclosed
US-20080057314-A1 Low Heat Release and Low Smoke Reinforcing Fiber/Epoxy Composites SUPRESTA U.S. LLC. (US) 2008-03-06 US disclosed
CN-1942515-A Low heat release and low smoke reinforcing fiber/epoxy composites SUPRESTA LLC (US) 2007-04-04 CN disclosed
EP-1751222-A2 LOW HEAT RELEASE AND LOW SMOKE REINFORCING FIBER/EPOXY COMPOSITES Supresta U.S. LLC. (US) 2007-02-14 EP disclosed
EP-0947532-B1 Epoxy resin composition for printed circuit board and printed circuit board using the same HITACHI CHEMICAL CO LTD (JP) 2006-01-18 EP disclosed
WO-2005118276-A2 LOW HEAT RELEASE AND LOW SMOKE REINFORCING FIBER/EPOXY COMPOSITES SUPRESTA LLC. (US) 2005-12-15 WO disclosed
US-6462147-B1 INCLUDES AN EPOXY RESIN; A MULTI-FUNCTIONAL PHENOL GROUP; A HARDENING ACCELERATOR; AND AT LEAST ONE OF A COMPOUND HAVING A TRIAZINE OR ISOCYANURATE RING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-10-08 US disclosed
EP-0947532-A1 Epoxy resin composition for printed circuit board and printed circuit board using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-10-06 EP disclosed