SCHEMBL534366

SCHEMBL534366

CNC(=O)N(C)c1ccc(C)c(N(C)C(=O)NC)c1

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ROCK2 O75116 1/20 0.43
ALDH1A1 P00352 4/20 0.38
MAPT P10636 3/20 0.33
POLB P06746 1/20 0.33
KDM4E B2RXH2 2/20 0.32
GAA P10253 2/20 0.32
LMNA P02545 1/20 0.32
MAPK1 P28482 1/20 0.32
HSD17B10 Q99714 1/20 0.32
RAB9A P51151 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
HSD17B1 P14061 2/20 0.32
HSD17B2 P37059 2/20 0.32
NPSR1 Q6W5P4 1/20 0.31
CYP2C9 P11712 1/20 0.31
KMT2A Q03164 2/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
CYP3A4 P08684 1/20 0.31
NPC1 O15118 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5046029 0.81 RAB9A (0.46) ROCK2ALDH1A1MAPTGAARAB9A
SCHEMBL16518673 0.80 MLYCD (0.52) ALDH1A1MAPTKDM4EGAALMNA
SCHEMBL9408595 0.79 ROCK2 (0.59) ROCK2ALDH1A1MAPTKDM4EGAA
SCHEMBL28567911 0.78 GPBAR1 (0.45) ROCK2ALDH1A1MAPTKDM4ELMNA
SCHEMBL689376 0.78 MAPT (0.45) ROCK2ALDH1A1MAPTPOLBKDM4E
SCHEMBL11099527 0.77 ALDH1A1 (0.37) ALDH1A1MAPTPOLBRAB9ASMN1; SMN2
SCHEMBL5814272 0.77 SIGMAR1 (0.45) ALDH1A1LMNAHSD17B1HSD17B2KMT2A
SCHEMBL31442198 0.77 SIGMAR1 (0.45) ALDH1A1LMNAHSD17B1HSD17B2KMT2A
SCHEMBL22688978 0.76 TSHR (0.49) ALDH1A1MAPTPOLBLMNAMAPK1
SCHEMBL16314171 0.76 ALDH1A1 (0.38) ALDH1A1MAPTPOLBLMNARAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4245783-A1 PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2023-09-20 EP claimed
WO-2022102629-A1 PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION 三菱ケミカル株式会社 2022-05-19 WO claimed
CN-108264729-B Epoxy resin composition, epoxy resin mixture, preparation method of epoxy resin mixture, epoxy resin prepreg and composite material 比亚迪股份有限公司 2020-02-07 CN claimed
EP-2414467-A1 WATER BASED NON-CHROMATED PRIMERS FOR STRUCTURAL BONDING APPLICATIONS CYTEC TECHNOLOGY CORP. (US) 2012-02-08 EP claimed
WO-2010117757-A1 WATER BASED NON-CHROMATED PRIMERS FOR STRUCTURAL BONDING APPLICATIONS CYTEC TECHNOLOGY CORP. (US) 2010-10-14 WO claimed
US-20100247922-A1 Water Based Non-Chromated Primers for Structural Bonding Applications CYTEC TECHNOLOGY CORP. (US) 2010-09-30 US claimed
EP-1279688-B1 Quick cure carbon fiber reinforced epoxy resin TORAY COMPOSITES AMERICA INC (US) 2005-06-08 EP claimed
EP-1279688-A1 Quick cure carbon fiber reinforced epoxy resin Toray Composites (America), Inc. (US) 2003-01-29 EP claimed
EP-0693092-A1 FIRE-RESISTANT ESSENTIALLY HALOGEN-FREE EPOXY COMPOSITION MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1996-01-24 EP claimed
WO-1994024209-A1 FIRE-RESISTANT ESSENTIALLY HALOGEN-FREE EPOXY COMPOSITION MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-10-27 WO claimed
EP-0298742-B1 Latent cure accelerators for cyanate esters AMOCO CORP (US) 1994-06-01 EP claimed
US-4931496-A Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition AMOCO CORPORATION (US) 1990-06-05 US claimed
US-4918157-A COATINGS, ADHESIVES; STORAGE STABLE AMOCO CORPORATION (US) 1990-04-17 US claimed
US-4804740-A STORAGE STABILITY AMOCO CORPORATION (US) 1989-02-14 US claimed
EP-0298742-A2 Latent cure accelerators for cyanate esters AMOCO CORPORATION (US) 1989-01-11 EP claimed
CN-118574909-A Adhesive composition 东洋纺株式会社 2024-08-30 CN disclosed
CN-118414395-A Adhesive composition and laminate 东洋纺株式会社 2024-07-30 CN disclosed
EP-0075533-A1 Heat-curable epoxy-resin compositions CIBA-GEIGY AG (CH) 1983-03-30 EP disclosed
US-4273686-A 1,1'-O-PHENYLENEBIS(3,3-DIMETHYLUREA), DICYANDIAMIDE, FILLER, QUICK-SETTING AMERICAN CYANAMID COMPANY (US) 1981-06-16 US disclosed
EP-0024526-A2 Epoxy based synthetic solder AMERICAN CYANAMID COMPANY (US) 1981-03-11 EP disclosed