Known targets — ChEMBL curated mechanism
ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 known ✓ | P00915 | 3/20 | 0.80 |
| ▸ | CA2 known ✓ | P00918 | 1/20 | 0.80 |
| ▸ | CA4 known ✓ | P22748 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11586203 | 0.89 | CA1 (0.60) | CA1CA2CA4 | |
| SCHEMBL11589359 | 0.89 | CA1 (0.60) | CA1CA2CA4 | |
| SCHEMBL11650129 | 0.89 | CA1 (0.60) | CA1CA2CA4 | |
| Sodium Cyanide SCHEMBL387 | 0.89 | — | — | |
| SCHEMBL123095 | 0.89 | — | — | |
| SCHEMBL309167 | 0.89 | — | — | |
| Potassium Ion SCHEMBL10619299 | 0.80 | — | — | |
| SCHEMBL3904189 | 0.80 | CA1 (0.80) | CA1CA2CA4 | |
| SCHEMBL1285681 | 0.80 | — | — | |
| Potassium Ion SCHEMBL44034 | 0.80 | CA1 (0.50) | CA1CA2CA4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 365 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119973130-A | Preparation method of five-twin crystal gold nanoparticles | 电子科技大学(深圳)高等研究院 | 2025-05-13 | — | — | CN | claimed |
| US-12173423-B2 | Gold electroplating solution and method | HUTCHINSON TECHNOLOGY INCORPORATED (US) | 2024-12-24 | — | — | US | claimed |
| US-12168199-B2 | Method of forming a Pd—Au alloy layer on a substrate | COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) | 2024-12-17 | — | — | US | claimed |
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-115928161-B | Gold electroplating solution and application thereof, gold bump, preparation method of gold bump, electronic component and electronic equipment | 华为技术有限公司 | 2024-08-27 | — | — | CN | claimed |
| WO-2024140976-A1 | GOLD ELECTROPLATING SOLUTION AND USE THEREOF | 华为技术有限公司 | 2024-07-04 | — | — | WO | claimed |
| CN-116240597-B | Electroplating solution and application thereof | 华为技术有限公司 | 2024-03-26 | — | — | CN | claimed |
| US-11898264-B2 | Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces | HUTCHINSON TECHNOLOGY INCORPORATED (US) | 2024-02-13 | — | — | US | claimed |
| CN-114836794-B | Gold-copper alloy electroforming process and application thereof | 深圳市铭轩珠宝首饰有限公司 | 2024-01-30 | — | — | CN | claimed |
| CN-116240597-A | Electroplating solution and application thereof | 华为技术有限公司 | 2023-06-09 | — | — | CN | claimed |
| EP-3023520-A1 | ENVIRONMENTALLY FRIENDLY GOLD ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2016-05-25 | — | — | EP | claimed |
| US-20160040296-A1 | ELECTROLESS GOLD PLATING LIQUID | MK CHEM & TECH (KR) | 2016-02-11 | — | — | US | claimed |
| CN-102105623-B | Electrolytic gold plating solution and gold film obtained using same | JAPAN PURE CHEMICAL CO LTD | 2013-10-02 | — | — | CN | claimed |
| CN-102677110-A | Au-Pd alloy electroplating solution as well as preparation method and electroplating process thereof | YONGBAO NANO TECHNOLOGY SHENZHEN CO LTD | 2012-09-19 | — | — | CN | claimed |
| CN-102105623-A | Electrolytic gold plating solution and gold film obtained using same | JAPAN PURE CHEMICAL CO LTD | 2011-06-22 | — | — | CN | claimed |
| US-6194032-B1 | ELECTROLESS PLATING | MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2001-02-27 | — | — | US | claimed |
| WO-1999018255-A1 | SELECTIVE SUBSTRATE METALLIZATION | MASSACHUSETTS INSTITUTE OF TECHNOLOGY (US) | 1999-04-15 | — | — | WO | claimed |
| EP-0618308-B1 | Electroless gold plating bath | UYEMURA C & CO LTD (JP) | 1998-06-17 | — | — | EP | claimed |
| US-5035744-A | Efficiency, gloss, ethyleneamines as complexing agents, sodium and potassium gold cyanides | KOJIMA CHEMICALS CO., LTD. (JP) | 1991-07-30 | — | — | US | claimed |
| US-4436595-A | Electroplating bath and method | METAL SURFACES, INC. (US) | 1984-03-13 | — | — | US | claimed |