SCHEMBL5851781

SCHEMBL5851781

CO[I+](OS(=O)(=O)C(F)(F)F)(c1ccccc1)c1ccccc1

nearest known ligand 0.32

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
▸ CA1 P00915 1/20 0.32
▸ CA2 P00918 1/20 0.32
▸ CA5A P35218 1/20 0.32
▸ CA9 Q16790 1/20 0.32
▸ NR1H2 P55055 1/20 0.31
▸ NR1H3 Q13133 1/20 0.31
▸ KEAP1 Q14145 1/20 0.31
▸ GAA P10253 1/20 0.30
▸ L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5851106 0.84 CA1 (0.36) CA1CA2
SCHEMBL6331113 0.83 CA2 (0.37) CA1CA2
SCHEMBL5950044 0.78 CA2 (0.34) CA1CA2CA5ACA9KEAP1
SCHEMBL5851127 0.76 TDP1 (0.37) CA1CA2CA5ACA9KEAP1
SCHEMBL7889055 0.73 CA4 (0.41) CA1CA2CA9L3MBTL1
SCHEMBL3518888 0.70 KCNN4 (0.38) GAAL3MBTL1
SCHEMBL1419536 0.70 CXCR2 (0.31) —
Toluene SCHEMBL28809616 0.66 ACHE (0.46) CA1CA2CA5ACA9NR1H2
Trifluoromethanesulfonic Acid SCHEMBL8735170 0.64 GPR3 (0.47) CA1CA2CA5ACA9
SCHEMBL379586 0.64 CA1 (0.38) CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6984473-B2 Light blocking; amplified photoresist; acid generators; high density semiconductors MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2006-01-10 — — US disclosed
US-20030152845-A1 Mask blank, protective film therefor and method of patterning mask blank MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2003-08-14 — — US disclosed
US-5882843-A ACRYLIC POLYMER, INITIATOR, SOLVENTS, THERMAL CROSSLINKER AND PIGMENTS HOECHST JAPAN LIMITED (JP) 1999-03-16 — — US disclosed
EP-0713144-B1 Photosensitive resin composition HOECHST JAPAN (JP) 1998-09-23 — — EP disclosed
EP-0713144-A2 Photosensitive resin composition HOECHST JAPAN LIMITED (JP) 1996-05-22 — — EP disclosed
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