Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HRH3 | Q9Y5N1 | 8/20 | 0.48 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | HRH1 | P35367 | 2/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | HRH4 | Q9H3N8 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2852223 | 1.00 | HRH3 (0.48) | HRH3CYP1A2MAPK1SMN1; SMN2KCNH2 | |
| SCHEMBL1995694 | 0.98 | HRH3 (0.44) | HRH3CYP1A2MAPK1SMN1; SMN2KCNH2 | |
| SCHEMBL11897269 | 0.90 | CSNK2A2 (0.38) | HRH3SMN1; SMN2KCNH2MAPTALDH1A1 | |
| SCHEMBL1230445 | 0.88 | HRH3 (0.41) | HRH3CYP1A2POLBMAPTALDH1A1 | |
| SCHEMBL8083018 | 0.86 | CSNK2A2 (0.43) | HRH3MAPTALDH1A1 | |
| SCHEMBL9516643 | 0.84 | HRH3 (0.48) | HRH3CYP1A2MAPK1SMN1; SMN2KCNH2 | |
| SCHEMBL329441 | 0.83 | HRH3 (0.30) | HRH3 | |
| SCHEMBL29308223 | 0.82 | CSNK2A2 (0.34) | KCNH2MAPTALDH1A1CYP2D6 | |
| SCHEMBL14814163 | 0.82 | MAPK1 (0.37) | CYP1A2MAPK1MEN1ALDH1A1CYP2D6 | |
| SCHEMBL29496667 | 0.82 | HRH3 (0.46) | HRH3CYP1A2MAPK1SMN1; SMN2KCNH2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 290 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106589385-A | Low-yellowing quaternary ammonium type hydrophilic amino-modified silicone oil emulsion and preparation method thereof | 佛山市顺德区德美瓦克有机硅有限公司 | 2017-04-26 | — | — | CN | claimed |
| EP-0417755-B1 | Packing for chromatography and its use for separating water soluble organic compounds | DAISO CO LTD (JP) | 1993-12-29 | — | — | EP | claimed |
| US-5103000-A | PACKING FOR CHROMATOGRAPHY AND METHOD FOR SEPARATING WATER SOLUBLE ORGANIC COMPOUNDS USING THE SAME | DAISO CO., LTD. (JP) | 1992-04-07 | — | — | US | claimed |
| EP-0417755-A1 | Packing for chromatography and its use for separating water soluble organic compounds | DAISO CO., LTD. (JP) | 1991-03-20 | — | — | EP | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100079-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100734-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| EP-3950724-B1 | CONJUGATED DIENE COPOLYMER AND METHOD FOR MANUFACTURING CONJUGATED DIENE COPOLYMER | ZEON CORP (JP) | 2026-02-18 | — | — | EP | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| EP-0355927-B1 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | ASAHI CHEMICAL IND (JP) | 1994-11-23 | — | — | EP | disclosed |
| EP-0304136-B1 | Novel photosensitive composition | ASAHI CHEMICAL IND (JP) | 1994-06-29 | — | — | EP | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
| EP-0417755-B1 | Packing for chromatography and its use for separating water soluble organic compounds | DAISO CO LTD (JP) | 1993-12-29 | — | — | EP | disclosed |
| US-5103000-A | PACKING FOR CHROMATOGRAPHY AND METHOD FOR SEPARATING WATER SOLUBLE ORGANIC COMPOUNDS USING THE SAME | DAISO CO., LTD. (JP) | 1992-04-07 | — | — | US | disclosed |
| US-5019482-A | Polymer/oxime ester/coumarin compound photosensitive composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1991-05-28 | — | — | US | disclosed |
| EP-0417755-A1 | Packing for chromatography and its use for separating water soluble organic compounds | DAISO CO., LTD. (JP) | 1991-03-20 | — | — | EP | disclosed |
| EP-0304136-A2 | Novel photosensitive composition | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1989-02-22 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | HRH3 902/4885CYP1A2 4765/4885MAPK1 2987/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | HRH3 51/4885CYP1A2 3344/4885MAPK1 1924/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | HRH3 160/4885CYP1A2 3973/4885MAPK1 3625/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.