SCHEMBL673334

SCHEMBL673334

C=C(C)C(=O)OC1(CC)CC1

nearest known ligand 0.39

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
THRB P10828 1/20 0.38
TSHR P16473 4/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL47303 0.92 ALDH1A1 (0.37) ALDH1A1THRBTSHR
SCHEMBL27927215 0.92 ALDH1A1 (0.37) ALDH1A1THRBTSHR
SCHEMBL9929393 0.91 TSHR (0.35) ALDH1A1THRBTSHR
SCHEMBL686077 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL4544299 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL47306 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL4544316 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL133202 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL28137753 0.90 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL12960146 0.87 ALDH1A1 (0.33) ALDH1A1THRBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114447307-B Composite positive electrode material, preparation method thereof and electrochemical energy storage device 湖北亿纬动力有限公司 2024-03-15 CN claimed
CN-114447307-A Composite positive electrode material, preparation method thereof and electrochemical energy storage device 湖北亿纬动力有限公司 2022-05-06 CN claimed
US-20260098106-A1 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-04-09 US disclosed
US-20260079398-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) 2026-03-19 US disclosed
US-20250282903-A1 COPOLYMER OF HYDROXYSTYRENE-BASED MONOMER AND (METH)ACRYLIC ACID ESTER-BASED MONOMER, AND PRODUCTION METHOD THEREOF MARUZEN PETROCHEMICAL CO., LTD. (JP) 2025-09-11 US disclosed
US-20250116933-A1 MULTIBLOCK COPOLYMERS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2025-04-10 US disclosed
CN-119775514-A Multiblock copolymer, photoresist composition comprising the same, and pattern forming method 杜邦电子材料国际有限责任公司 2025-04-08 CN disclosed
CN-114447307-B Composite positive electrode material, preparation method thereof and electrochemical energy storage device 湖北亿纬动力有限公司 2024-03-15 CN disclosed
US-20240055382-A1 METALLIZATION METHOD U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-02-15 US disclosed
CN-117457484-A Metallization method 罗门哈斯电子材料有限责任公司 2024-01-26 CN disclosed
US-20230331887-A1 IONOMER RESIN, RESIN SHEET, AND LAMINATED GLASS KURARAY EUROPE GMBH (DE) 2023-10-19 US disclosed
US-20090087607-A1 Resin Composition for Tubes and Tube KANEKA CORPORATION (JP) 2009-04-02 US disclosed
EP-2022512-A1 CATHETER TUBE AND CATHETER COMPRISING THE TUBE Kaneka Corporation (JP) 2009-02-11 EP disclosed
EP-1832792-A1 RESIN COMPOSITION FOR TUBES AND TUBE Kaneka Corporation (JP) 2007-09-12 EP disclosed
EP-0888880-B1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2006-08-02 EP disclosed
EP-1660583-A1 POLYPHENYLENE SULFIDE COMPOSITION AND APPLICATION Chevron Phillips Chemical Company LP (US) 2006-05-31 EP disclosed
US-20050089688-A1 Polyphenylene sulfide composition and application CHEVRON PHILLIPS CHEMICAL COMPANY, LP 2005-04-28 US disclosed
WO-2005019341-A1 POLYPHENYLENE SULFIDE COMPOSITION AND APPLICATION CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) 2005-03-03 WO disclosed
US-6723400-B1 ELECTROCONDUCTIVE, MULTILAYERED HOLLOW MOLDINGS WITH GOOD, WELL-BALANCED HEAT RESISTANCE, HOT WATER RESISTANCE, CHEMICAL RESISTANCE, GASOHOL PERMEATION RESISTANCE, OUTWARD APPEARANCE, INTERLAYER ADHESION AND LOW-TEMP. STIFFNESS TORAY INDUSTRIES, INC. (JP) 2004-04-20 US disclosed
EP-0888880-A1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1999-01-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260079398-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS ARCN1, SMC4, CCT4 ALDH1A1 1499/4885THRB 3109/4885TSHR 2944/4885
US-20260098106-A1 POLYMER, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION RPS21, RPL21, SCO2 ALDH1A1 3033/4885THRB 1476/4885TSHR 2061/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.