SCHEMBL47306

SCHEMBL47306

C=C(C)C(=O)OC1(CC)CCCCCCC1

nearest known ligand 0.35

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.35
THRB P10828 1/20 0.35
TSHR P16473 3/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4544316 1.00 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL4544299 1.00 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL28137753 1.00 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL133202 1.00 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL686077 1.00 ALDH1A1 (0.35) ALDH1A1THRBTSHR
SCHEMBL47303 0.98 ALDH1A1 (0.37) ALDH1A1THRBTSHR
SCHEMBL27927215 0.94 ALDH1A1 (0.37) ALDH1A1THRBTSHR
SCHEMBL673334 0.90 ALDH1A1 (0.39) ALDH1A1THRBTSHR
Acrylic Acid SCHEMBL31420446 0.89 LMNA (0.31) ALDH1A1THRBTSHR
SCHEMBL21338913 0.87 ALDH1A1 (0.37) ALDH1A1THRBTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 470 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12032288-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed
US-12032290-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-07-09 US disclosed
US-20230400769-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-12-14 US disclosed
US-11835849-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-12-05 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-20230348351-A1 COMPOUND, POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, PATTERN FORMATION METHOD, INSULATING FILM FORMATION METHOD, AND METHOD FOR PRODUCING COMPOUND MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-11-02 US disclosed
US-11762292-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-09-19 US disclosed
US-20230266675-A1 INSPECTION METHOD, METHOD FOR PRODUCING COMPOSITION, AND METHOD FOR VERIFYING COMPOSITION FUJIFILM CORPORATION (JP) 2023-08-24 US disclosed
US-20230244143-A9 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND JSR CORPORATION (JP) 2023-08-03 US disclosed
US-11697754-B2 Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor device FUJIFILM CORPORATION (JP) 2023-07-11 US disclosed
US-20090197204-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2009-08-06 US disclosed
US-20090197204-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2009-08-06 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-7476492-B2 Low activation energy photoresist composition and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-01-13 US disclosed
US-20080233514-A1 POSITIVE PHOTORESIST COMPOSITION WITH A POLYMER INCLUDING A FLUOROSULFONAMIDE GROUP AND PROCESS FOR ITS USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-09-25 US disclosed
US-20080233514-A1 POSITIVE PHOTORESIST COMPOSITION WITH A POLYMER INCLUDING A FLUOROSULFONAMIDE GROUP AND PROCESS FOR ITS USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-09-25 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed
US-20070275324-A1 Low activation energy photoresist composition and process for its use GLOBALFOUNDRIES U.S. INC. 2007-11-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230348351-A1 COMPOUND, POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, PATTERN FORMATION METHOD, INSULATING FILM FORMATION METHOD, AND METHOD FOR PRODUCING COMPOUND PHOSPHO1, RER1, RIF1 ALDH1A1 3361/4885THRB 1590/4885TSHR 813/4885
US-11835849-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device RER1, TERB1, TRRAP ALDH1A1 2433/4885THRB 3506/4885TSHR 1473/4885
US-20090197204-A1 RESIST COMPOSITION FOR IMMERSION EXPOSURE, METHOD OF FORMING RESIST PATTERN USING THE SAME, AND FLUORINE-CONTAINING COMPOUND RER1, FRG1, AFF1 ALDH1A1 2326/4885THRB 2484/4885TSHR 2238/4885
US-12032288-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device RER1, COL1A1, RAD51 ALDH1A1 762/4885THRB 2913/4885TSHR 3144/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.