Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.57 |
| ▸ | F2 | P00734 | 3/20 | 0.55 |
| ▸ | F10 | P00742 | 3/20 | 0.55 |
| ▸ | MEN1 | O00255 | 8/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 8/20 | 0.47 |
| ▸ | MAPT | P10636 | 6/20 | 0.47 |
| ▸ | LMNA | P02545 | 4/20 | 0.47 |
| ▸ | HPGD | P15428 | 3/20 | 0.46 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.46 |
| ▸ | RECQL | P46063 | 1/20 | 0.45 |
| ▸ | ALDH3A1 | P30838 | 1/20 | 0.45 |
| ▸ | ALDH1A3 | P47895 | 1/20 | 0.45 |
| ▸ | GSK3B | P49841 | 1/20 | 0.44 |
| ▸ | CYBB | P04839 | 1/20 | 0.44 |
| ▸ | NOX4 | Q9NPH5 | 1/20 | 0.44 |
| ▸ | CRHBP | P24387 | 1/20 | 0.43 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.43 |
| ▸ | GAA | P10253 | 2/20 | 0.43 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6805432 | 1.00 | ALDH1A1 (0.57) | ALDH1A1F2F10MEN1KMT2A | |
| SCHEMBL1348304 | 0.84 | F2 (0.56) | ALDH1A1F2F10MEN1KMT2A | |
| SCHEMBL1348301 | 0.84 | F2 (0.56) | ALDH1A1F2F10MEN1KMT2A | |
| SCHEMBL355427 | 0.83 | MAPT (0.56) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL2775363 | 0.83 | MAPT (0.56) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL10979146 | 0.82 | ALDH1A1 (0.53) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL1347928 | 0.82 | USP18 (0.54) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL10979150 | 0.82 | ALDH1A1 (0.53) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL1347925 | 0.82 | USP18 (0.54) | ALDH1A1MEN1KMT2AMAPTLMNA | |
| SCHEMBL22462352 | 0.81 | F10 (0.68) | ALDH1A1F2F10MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100734-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100079-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20250341777-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | RESONAC CORP (JP) | 2025-11-06 | — | — | US | disclosed |
| US-20250271757-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | RESONAC CORPORATION (JP) | 2025-08-28 | — | — | US | disclosed |
| WO-2025099883-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2025-05-15 | — | — | WO | disclosed |
| WO-2025095080-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND CURED PRODUCT | 株式会社レゾナック | 2025-05-08 | — | — | WO | disclosed |
| WO-2025088815-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED PRODUCT, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2025-05-01 | — | — | WO | disclosed |
| WO-2025088704-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED PRODUCT, PRODUCTION METHOD FOR PATTERNED CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2025-05-01 | — | — | WO | disclosed |
| WO-2025088705-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED PRODUCT, CURED PRODUCT, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2025-05-01 | — | — | WO | disclosed |
| US-5886136-A | Pattern forming process | NIPPON ZEON CO., LTD. (JP) | 1999-03-23 | — | — | US | disclosed |
| US-5847071-A | Photosensitive resin composition | HITACHI, CHEMICAL CO., LTD. (JP) | 1998-12-08 | — | — | US | disclosed |
| US-5777068-A | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1998-07-07 | — | — | US | disclosed |
| EP-0822229-A1 | POLYIMIDE RESIN COMPOSITION | NIPPON ZEON CO., LTD. (JP) | 1998-02-04 | — | — | EP | disclosed |
| US-5668248-A | POLYAMIC ACID ESTERS | HITACHI CHEMICAL CO., LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| EP-0702270-A2 | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1996-03-20 | — | — | EP | disclosed |
| US-5472823-A | Polyamic acids | HITACHI CHEMICAL CO., LTD. (JP) | 1995-12-05 | — | — | US | disclosed |
| EP-0373952-B1 | Photosensitive resin composition and photosensitive element using the same | HITACHI CHEMICAL CO LTD (JP) | 1995-02-08 | — | — | EP | disclosed |
| US-5262277-A | Light sensitive elements for electrical thick films with heat resistance | HITACHI CHEMICAL COMPANY, INC. (JP) | 1993-11-16 | — | — | US | disclosed |
| EP-0373952-A2 | Photosensitive resin composition and photosensitive element using the same | Hitachi Chemical Co., Ltd. (JP) | 1990-06-20 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | ALDH1A1 382/4885F2 2157/4885F10 1135/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.