Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30773362 | 0.91 | FTO (0.32) | ACHE | |
| SCHEMBL3256213 | 0.91 | FTO (0.32) | ACHE | |
| SCHEMBL3919468 | 0.91 | TP53 (0.31) | — | |
| SCHEMBL16203376 | 0.83 | HNF4A (0.34) | ACHEHNF4A | |
| SCHEMBL8895378 | 0.79 | — | — | |
| SCHEMBL26758316 | 0.76 | ACHE (0.33) | ACHE | |
| SCHEMBL10001261 | 0.76 | ACHE (0.35) | ACHEHNF4A | |
| SCHEMBL10001259 | 0.75 | RARA (0.34) | — | |
| SCHEMBL7775769 | 0.72 | — | — | |
| Pyrogallol SCHEMBL4390779 | 0.71 | ALDH1A1 (0.43) | ACHEHNF4A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024053655-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2024048604-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048603-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048435-A1 | RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048605-A1 | RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2024048436-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-03-07 | — | — | WO | disclosed |
| WO-2022202647-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-09-29 | — | — | WO | disclosed |
| US-6716565-B2 | APPLICABLE TO IMAGE-FORMING MATERIALS SUCH AS THREE-DIMENSIONAL MODELLING BY LIGHT, HOLOGRAPHY, LITHOGRAPHIC PRINTING PLATES, COLOR PROOFS, PHOTORESISTS AND COLOR FILTERS, AND INKS, PAINTS AND ADHESIVES | FUJI PHOTO FILM CO., LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| EP-1223467-A2 | Positive image-forming material | FUJI PHOTO FILM CO., LTD. (JP) | 2002-07-17 | — | — | EP | disclosed |
| EP-0786699-B1 | Positive photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 2001-10-31 | — | — | EP | disclosed |
| US-5318875-A | Resolution; heat resistance; photosensitivity; developability; integrated circuits; semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0385442-B1 | Positive-working photoresist composition | FUJI PHOTO FILM CO LTD (JP) | 1994-06-01 | — | — | EP | disclosed |
| EP-0555861-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1993-08-18 | — | — | EP | disclosed |
| EP-0540032-A1 | Photoresist composition and etching method | FUJI PHOTO FILM CO., LTD. (JP) | 1993-05-05 | — | — | EP | disclosed |
| US-5143816-A | Lithography printing plates; good adhesion | FUJI PHOTO FILM CO., LTD. (JP) | 1992-09-01 | — | — | US | disclosed |
| US-5130224-A | Naphthoquinonediazide and a light absorbers | FUJI PHOTO FILM CO., LTD. (JP) | 1992-07-14 | — | — | US | disclosed |
| EP-0477691-A2 | Positive-type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1992-04-01 | — | — | EP | disclosed |
| EP-0445680-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |
| EP-0445819-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |
| EP-0443533-A2 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-08-28 | — | — | EP | disclosed |