SCHEMBL702997

SCHEMBL702997

CCCCc1cccc(C(CCC)O[SiH3])c1CCCC

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYSLTR2 Q9NS75 9/20 0.35
CYSLTR1 Q9Y271 9/20 0.35
ALOX5 P09917 1/20 0.34
PTGS2 P35354 1/20 0.34
LIPG Q9Y5X9 1/20 0.31
PPARA Q07869 2/20 0.31
BID P55957 3/20 0.30
MCL1 Q07820 3/20 0.30
BCL2L1 Q07817 2/20 0.30
BAK1 Q16611 2/20 0.30
KAT8 Q9H7Z6 2/20 0.30
PPARG P37231 1/20 0.30
EP300 Q09472 1/20 0.30
KAT2A Q92830 1/20 0.30
KAT2B Q92831 1/20 0.30
KAT5 Q92993 1/20 0.30
SAE1 Q9UBE0 1/20 0.30
CYP3A4 P08684 1/20 0.30
CYP2D6 P10635 1/20 0.30
CYP2C9 P11712 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL708790 0.90 ALOX5 (0.35) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL706397 0.88 ADRA2A (0.35)
SCHEMBL706089 0.86 CYSLTR2 (0.43) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL705823 0.82 ALOX5 (0.36) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL706329 0.80 GABRA1 (0.33)
SCHEMBL708504 0.77 ADRA2A (0.33)
SCHEMBL30159313 0.76 GABRA1 (0.47) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL28354022 0.76 GABRA1 (0.47) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL704445 0.75 CYSLTR2 (0.40) CYSLTR2CYSLTR1ALOX5PTGS2LIPG
SCHEMBL702730 0.74 TAS1R3 (0.36) CYSLTR2CYSLTR1PPARAPPARGCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed