SCHEMBL705573

SCHEMBL705573

O=C(CCC(c1ccccc1)c1ccccc1)O[SiH3]

nearest known ligand 0.44

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 1/20 0.44
MTNR1B P49286 1/20 0.44
HRH1 P35367 4/20 0.44
HTR2A P28223 3/20 0.44
CNR1 P21554 3/20 0.43
EPHX2 P34913 2/20 0.43
CNR2 P34972 2/20 0.43
TBXAS1 P24557 1/20 0.43
GRM2 Q14416 1/20 0.42
GRM3 Q14832 1/20 0.42
CASR P41180 1/20 0.39
CYP2D6 P10635 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707771 0.93 HRH1 (0.46) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL27946531 0.90 TBXAS1 (0.52) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL7056883 0.90 TBXAS1 (0.52) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL7057732 0.90 TBXAS1 (0.52) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL28970084 0.81 MTNR1A (0.53) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL706628 0.80 ALDH1A1 (0.49) CYP2D6
SCHEMBL27484392 0.79 ALDH1A1 (0.48) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL11815316 0.78 ALDH1A1 (0.47) MTNR1AMTNR1BHRH1HTR2ACNR1
SCHEMBL28633131 0.78 SMN1; SMN2 (0.51) MTNR1AMTNR1BCASRCYP2D6
SCHEMBL3674189 0.77 CYP2D6 (0.54) MTNR1AMTNR1BHRH1HTR2ACNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP disclosed
US-6175031-B1 PLATINUM-CATALYZED HYDROSILYLATION BETWEEN SIH-SUBSTITUTED SILICON COMPOUNDS AND UNSATURATED GROUP-FUNCTIONAL ORGANIC OR ORGANOSILICON COMPOUNDS IN PRESENCE OF A (ACYLOXY)-FUNCTIONAL HYDROGENSILANE COMPOUND OR ACID AND HYDRO(ALKOXY)SILANE DOW CORNING ASIA, LTD. (JP) 2001-01-16 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US disclosed