SCHEMBL7058982

SCHEMBL7058982

CO[SiH](C)Cc1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.40
LTA4H P09960 1/20 0.40
TSHR P16473 4/20 0.39
CALM1 P0DP23 1/20 0.38
ALDH1A1 P00352 4/20 0.36
IDO1 P14902 2/20 0.36
LOXL2 Q9Y4K0 1/20 0.35
TRPA1 O75762 1/20 0.35
CA4 P22748 1/20 0.35
KDM4E B2RXH2 2/20 0.34
TDP1 Q9NUW8 1/20 0.34
AGXT P21549 1/20 0.34
CYP3A4 P08684 1/20 0.34
MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2510929 0.79 TP53 (0.39) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL3482739 0.78 TP53 (0.42) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL49102 0.78 TP53 (0.42) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL837631 0.77 ALDH1A1 (0.41) TP53LTA4HALDH1A1IDO1LOXL2
SCHEMBL17077610 0.77 TP53 (0.42) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL12715451 0.77 CALM1 (0.42) TP53CALM1ALDH1A1IDO1KDM4E
SCHEMBL28693711 0.77 CA2 (0.38) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL9505652 0.76 TP53 (0.40) TP53LTA4HTSHRCALM1ALDH1A1
SCHEMBL28693714 0.76 TAAR1 (0.35) TP53LTA4HTSHRALDH1A1TRPA1
SCHEMBL4195238 0.74 LTA4H (0.39) TP53LTA4HTSHRCALM1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
CN-113518794-B Addition-curable silicone adhesive composition 迈图高新材料公司 2023-12-22 CN disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
CN-115066475-A Addition curable silicone adhesive composition 迈图高新材料公司 2022-09-16 CN disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-3914638-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2021-12-01 EP disclosed
WO-2021118582-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-06-17 WO disclosed
WO-2020153947-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-07-30 WO disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed