SCHEMBL837631

SCHEMBL837631

CO[SiH](C)CCc1ccccc1

nearest known ligand 0.44

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
HPGD P15428 1/20 0.41
ALOX15 P16050 1/20 0.41
ALOX12 P18054 1/20 0.41
CASP1 P29466 1/20 0.41
HSD17B10 Q99714 1/20 0.41
TAAR1 Q96RJ0 3/20 0.40
ATM Q13315 1/20 0.40
TDP1 Q9NUW8 2/20 0.39
CYP2A6 P11509 1/20 0.39
HTR2A P28223 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
LOXL2 Q9Y4K0 1/20 0.39
IDO1 P14902 1/20 0.38
AOC3 Q16853 1/20 0.38
LTA4H P09960 1/20 0.38
TP53 P04637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL338863 0.83 ALDH1A1 (0.41) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL18389643 0.81 ALDH1A1 (0.39) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL296206 0.80 ALDH1A1 (0.42) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL3342114 0.79 TP53 (0.39) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL17519998 0.78 ALDH1A1 (0.37) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL7058982 0.77 TP53 (0.40) ALDH1A1TDP1LOXL2IDO1LTA4H
SCHEMBL28382866 0.77 TAAR1 (0.43) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL476138 0.77 TP53 (0.50) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL7749434 0.77 ALDH1A1 (0.48) ALDH1A1HPGDALOX15ALOX12CASP1
SCHEMBL3482599 0.76 IDO1 (0.37) ALDH1A1HPGDALOX15ALOX12CASP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
CN-113518794-B Addition-curable silicone adhesive composition 迈图高新材料公司 2023-12-22 CN disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
CN-115066475-A Addition curable silicone adhesive composition 迈图高新材料公司 2022-09-16 CN disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-3914638-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2021-12-01 EP disclosed
WO-2021118582-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-06-17 WO disclosed
WO-2020153947-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-07-30 WO disclosed
US-20080286474-A1 Hydrophobing Minerals and Filler Materials DOW SILICONES CORPORATION 2008-11-20 US disclosed
EP-1904415-A2 HYDROPHOBING MINERALS AND FILLER MATERIALS Dow Corning Corporation (US) 2008-04-02 EP disclosed
WO-2007009935-A2 HYDROPHOBING MINERALS AND FILLER MATERIALS DOW CORNING CORPORATION (US) 2007-01-25 WO disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed