SCHEMBL706247

SCHEMBL706247

c1ccc(CCCC[SiH](Oc2ccccc2)Oc2ccccc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.45
MAOB P27338 2/20 0.44
DRD2 P14416 1/20 0.43
DRD4 P21917 1/20 0.43
DRD3 P35462 1/20 0.43
SIGMAR1 Q99720 8/20 0.42
IDO1 P14902 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.41
MAPT P10636 1/20 0.40
RXFP1 Q9HBX9 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL704670 0.94 DRD2 (0.44) MAOAMAOBDRD2DRD4DRD3
SCHEMBL704612 0.86 ALDH1A1 (0.41) MAOAMAOBDRD2DRD4DRD3
SCHEMBL704369 0.78 L3MBTL1 (0.47) MAOAMAOBSIGMAR1IDO1L3MBTL1
SCHEMBL4363258 0.78 KCNA3 (0.37) DRD2DRD4DRD3
SCHEMBL4361022 0.78 KCNA3 (0.41) DRD2DRD4DRD3
SCHEMBL3350917 0.78 HDAC3 (0.52) DRD2DRD4DRD3IDO1
SCHEMBL19927175 0.78 LTA4H (0.47) MAOADRD2DRD3
SCHEMBL19470846 0.77 SIGMAR1 (0.48) MAOAMAOBSIGMAR1L3MBTL1MAPT
SCHEMBL19470822 0.77 SIGMAR1 (0.48) MAOAMAOBSIGMAR1L3MBTL1MAPT
SCHEMBL19470840 0.77 SIGMAR1 (0.48) MAOAMAOBSIGMAR1L3MBTL1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed